scholarly journals Programmable and scalable transfer printing with high reliability and efficiency for flexible inorganic electronics

2020 ◽  
Vol 6 (25) ◽  
pp. eabb2393 ◽  
Author(s):  
Chengjun Wang ◽  
Changhong Linghu ◽  
Shuang Nie ◽  
Chenglong Li ◽  
Qianjin Lei ◽  
...  
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Adhesive Layer ◽  
Cost Effective ◽  
Electronic Systems ◽  
Transfer Printing ◽  
Large Area ◽  
Surface Microstructures ◽  
High Yields ◽  
Thermal Stimuli

Transfer printing that enables heterogeneous integration of materials in desired layouts offers unprecedented opportunities for developing high-performance unconventional electronic systems. However, large-area integration of ultrathin and delicate functional micro-objects with high yields in a programmable fashion still remains as a great challenge. Here, we present a simple, cost-effective, yet robust transfer printing technique via a shape-conformal stamp with actively actuated surface microstructures for programmable and scalable transfer printing with high reliability and efficiency. The shape-conformal stamp features the polymeric backing and commercially available adhesive layer with embedded expandable microspheres. Upon external thermal stimuli, the embedded microspheres expand to form surface microstructures and yield weak adhesion for reliable release. Systematic experimental and computational studies reveal the fundamental aspects of the extraordinary adhesion switchability of stamp. Demonstrations of this protocol in deterministic assemblies of diverse challenging inorganic micro-objects illustrate its extraordinary capabilities in transfer printing for developing high-performance flexible inorganic electronics.

Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 002018-002053
Author(s):  
Swapan Bhattacharya ◽  
Fei Xie ◽  
Daniel F. Baldwin ◽  
Han Wu ◽  
Kelley Hodge ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Circuit Boards ◽  
Process Development ◽  
High Reliability ◽  
Optimum Process ◽  
Process Conditions ◽  
Harsh Environment ◽  
Mechanical Shock ◽  
Large Area ◽  
Reliability Performance

Reworkable underfills and edge bond adhesives are finding increasing utility in high reliability and harsh environment applications. The ASICs and FPGAs often used in these systems typically require designs incorporating large BGAs and ceramic BGAs. For these high reliability and harsh environment applications, these packages typically require underfill or edge bond materials to achieve the needed thermal cycle, mechanical shock and vibration reliability. Moreover, these applications often incorporate high dollar value printed circuit boards (on the order of thousands or tens of thousands of dollars per PCB) hence the need to rework these assemblies and maintain the integrity of the PCB and high dollar value BGAs. This further complicates the underfill requirements with a reworkability component. Reworkable underfills introduce a number of process issues that can result in significant variability in reliability performance. In contrast, edge bond adhesives provide a high reliability solution with substantial benefits over underfills. One interesting question for the large area BGA applications of reworkable underfills and edge bond materials is the comparison of their reliability performance. This paper presents a study of reliability comparison between two robust selected reworkable underfill and edge bond adhesive in a test vehicle including 11mm, 13mm, and 27mm large area BGAs. Process development for those large area BGA applications was also conducted on the underfill process and edge bond process to determine optimum process conditions. For underfill processing, establishing an underfill process that minimizing/eliminates underfill voids is critical. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. In addition, this paper also presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkablity. Four edge bond materials (commercially available) were studied and compared for a test vehicles with 12mm BGAs. The reliability testing protocol included board level thermal cycling (−40 to 125°C), mechanical drop testing (2900 G), and random vibration testing (3 G, 10 – 1000 Hz).

scholarly journals Low-Energy and Modular Wearable Device for Wireless Measurement of Physiological Signals

2020 ◽  
Vol 2 (1) ◽  
pp. 75
Author(s):  
Manuel A. Herrera-Juárez ◽  
Roberto G. Ramírez-Chavarría
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Processing System ◽  
Cost Effective ◽  
Low Energy ◽  
Physiological Signals ◽  
Data Streaming ◽  
Wireless Data ◽  
Notification System ◽  
Promising Tool

The most common way for accessing healthcare and monitoring physiological signals is based on commercial devices. Most of them are, in general, expensive, highly invasive, and require sophisticated infrastructure for operating. Nowadays, wearable devices (WD) offer an attractive technology for circumventing the limitations of classic medical devices. The design of WD, however, remains a challenging task to reach high-performance, reliability, and to be ergonomic. In this work, we develop, to the best of our knowledge, a novel WD with two main highlights. (i) Our device is based on a low-power 32-bit microcontroller, embedding a Bluetooth Low Energy (BLE) module for wireless data streaming with a mobile application for signal monitoring and recording, alongside a warning notification system. (ii) The proposed WD has a modular and flexible design, such that the user can increase the number of sensors by sharing the acquisition and processing system, thus reducing the hardware requirements and exhibiting a minimally invasive arrangement. For all the WD stages, we show their design methodology, the tests for characterizing their performance, and the results obtained from a case of study. For the latter, we consider two sensor prototypes for measuring the corporal temperature with a passive sensor, as well as the breath and heart rates via photoplethysmography signals. Results show that our WD is a cost-effective alternative and a promising tool for healthcare monitoring, as it operates in agreement with physiological levels with high-reliability.

scholarly journals High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

2020 ◽  
Vol 7 (1) ◽  
Author(s):  
Abhishek Singh Dahiya ◽  
Dhayalan Shakthivel ◽  
Yogeenth Kumaresan ◽  
Ayoub Zumeit ◽  
Adamos Christou ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Functional Materials ◽  
Transfer Printing ◽  
Semiconducting Materials ◽  
Large Area ◽  
Contact Printing ◽  
Scale Structures ◽  
Silicon Based

Abstract The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

scholarly journals Direct roll transfer printed silicon nanoribbon arrays based high-performance flexible electronics

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Ayoub Zumeit ◽  
Abhishek Singh Dahiya ◽  
Adamos Christou ◽  
Dhayalan Shakthivel ◽  
Ravinder Dahiya
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Field Effect Transistors ◽  
High Mobility ◽  
Single Step ◽  
High Yield ◽  
Transfer Printing ◽  
Large Area ◽  
Direct Printing

AbstractTransfer printing of high mobility inorganic nanostructures, using an elastomeric transfer stamp, is a potential route for high-performance printed electronics. Using this method to transfer nanostructures with high yield, uniformity and excellent registration over large area remain a challenge. Herein, we present the ‘direct roll transfer’ as a single-step process, i.e., without using any elastomeric stamp, to print nanoribbons (NRs) on different substrates with excellent registration (retaining spacing, orientation, etc.) and transfer yield (∼95%). The silicon NR based field-effect transistors printed using direct roll transfer consistently show high performance i.e., high on-state current (Ion) >1 mA, high mobility (μeff) >600 cm2/Vs, high on/off ratio (Ion/off) of around 106, and low hysteresis (<0.4 V). The developed versatile and transformative method can also print nanostructures based on other materials such as GaAs and thus could pave the way for direct printing of high-performance electronics on large-area flexible substrates.

HIGH MOBILITY CONJUGATED POLYMER SEMICONDUCTORS FOR ORGANIC THIN FILM TRANSISTORS

COSMOS ◽  
2009 ◽  
Vol 05 (01) ◽  
pp. 59-77
Author(s):  
YUNING LI ◽  
BENG S. ONG
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
High Performance ◽  
High Mobility ◽  
Cost Effective ◽  
Charge Carrier Mobility ◽  
Organic Thin Film Transistors ◽  
Organic Thin Film ◽  
Large Area ◽  
Polymer Semiconductors

Organic thin film transistors (OTFTs) are promising candidates as alternatives to silicon TFTs for applications where light weight, large area and flexibility are required. OTFTs have shown potential for cost effective fabrication using solution deposition techniques under mild conditions. However, two major issues must be addressed prior to the commercialization of OTFT-based electronics: (i) low charge mobilities and (ii) insufficient air stability. This article reviews recent progress in the design and development of thiophene-based polymer semiconductors as channel materials for OTFTs. To date, both high performance p-type and n-type thiophene-based polymers with benchmark charge carrier mobility of > 0.5 cm2 V-1 s-1 have been archived, which bring printed OTFTs one step closer to commercialization.

scholarly journals Porous perovskite films integrated with Au–Pt nanowire-based electrodes for highly flexible large-area photodetectors

2020 ◽  
Vol 4 (1) ◽  
Author(s):  
Rohit Saraf ◽  
Hua Fan ◽  
Vivek Maheshwari
Keyword(s):  
High Performance ◽  
Mechanical Stability ◽  
Optoelectronic Devices ◽  
Cost Effective ◽  
Ambient Air ◽  
Single Step ◽  
Environmental Stability ◽  
Fast Method ◽  
Large Area ◽  
Research Attention

AbstractFlexible, large-area, and stable perovskite photodetectors have drawn increasing widespread research attention for next-generation wearable and portable optoelectronic devices. However, high mechanical durability coupled with large device area and enhanced environmental stability has not been demonstrated yet to attain practical viability. Herein, a highly bendable, stable, and large-area (3 cm2) flexible polystyrene incorporated perovskite photodetector is presented. Due to the formation of a porous polystyrene-perovskite composite film in a single step it allows unprecedented mechanical stability, maintaining 85% of its original photocurrent value after 10,000 bending cycles at a bending angle of 120°. Equally crucial, the solution-processed self-assembled Pt–Au nanochains were developed to provide a simple and fast method of patterning the conductive and flexible electrodes onto the filter substrate. The optimized polystyrene-perovskite photodetector exhibits a high responsivity up to 2.73 A W−1, a maximum specific detectivity of 6.2 × 1013 Jones, and a superior switching ratio of 1.0 × 104. In addition, the polystyrene-perovskite photodetector yields excellent stability under the combined stresses of moisture, ambient air, and room light, and retains 92% of its original performance for over 30 days. All these results demonstrate that this work provides a facile and cost-effective approach that paves the way to develop high-performance, stable, and highly flexible optoelectronic devices.

BRUSH WELLMAN ALLOY 360

Alloy Digest ◽  
1985 ◽  
Vol 34 (11) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
High Performance ◽  
High Reliability ◽  
Heat Treating ◽  
Electronic Systems ◽  
Heavy Duty ◽  
Mechanical And Physical Properties

Abstract BRUSH WELLMAN ALLOY 360 combines unique mechanical and physical properties required in high reliability electrical/electronic systems, heavy-duty controls, electromechanical devices and other high-performance applications. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, joining, and surface treatment. Filing Code: Ni-326. Producer or source: Brush Wellman Inc..

scholarly journals Tape Automated Bonding for High Density Packaging

1981 ◽  
Vol 8 (1-2) ◽  
pp. 15-19 ◽  
Author(s):  
Karel Kurzweil
Keyword(s):  
High Performance ◽  
Cost Effective ◽  
High Density ◽  
Electronic Systems ◽  
The Past ◽  
The World ◽  
Assembly Technology ◽  
Processing Steps ◽  
Very High ◽  
High Density Packaging

High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive.Through the development efforts conducted during the past years in the world, the Tape Automated Bonding – TAB – has become the assembly technology allowing a very high density packaging. In combination with substrate technology it has grown into a complete, cost effective, micropackaging concept.The paper describes the main technical characteristics of this packaging concept. Specific equipments for TAB were designed and built by CII-Honeywell Bull for installation in the factory. These equipments are not only those, directly related to the TAB technology processing steps but include also other equipments like high precision thick film printer.The main features of the new micropackaging facility are also presented. Some examples of high density packages built with tape automated bonding are described and some of the main quality and reliability aspects are discussed.

scholarly journals Polymer Amplification to Improve Performance and Stability Towards Semi-Transparent Perovskite Solar Cells Fabrication

2019 ◽  
Author(s):  
Hafez Nikbakht ◽  
Ahmed Esmail Shalan ◽  
Manuel Salado ◽  
Abbas Assadi ◽  
Parviz Boroojerdian ◽  
...  
Keyword(s):  
Solar Cells ◽  
High Performance ◽  
Vinylidene Fluoride ◽  
Photovoltaic Performance ◽  
Perovskite Solar Cells ◽  
Cost Effective ◽  
Spectroscopic Properties ◽  
Charge Transfer Resistance ◽  
Large Area ◽  
Transfer Resistance

<p>The performance of methylammonium lead triiodide (CH<sub>3</sub>NH<sub>3</sub>PbI<sub>3</sub>) based solar cells depends on its crystallization and controlled microstructure. In spite of its high performance, long-term stability is a paramount factor towards its large area fabrication and potential industrialization. Herein, we have employed poly(vinylidene fluoride−trifluoro ethylene) P(VDF-TrFE) as an additive into a low concentration based perovskite precursor solutions to control the crystallinity and microstructure. Perovskite layers of lower thickness can be derived from low precursor concentration, however it often suffers from severe voids and roughness. Introducing judicious quantities of P(VDF-TrFE) can improve the surface coverage, smoothness as well as reduces the grain boundaries in the perovskite. An array of characterization techniques were utilized to probe the structural, microstructural and spectroscopic properties. Impedance spectra suggests, the P(VDF-TrFE) can improve the carrier lifetimes and reduce the charge transfer resistance, which in turn allows to improve photovoltaic performance. For an optimized concentration of P(VDF-TrFE), the fabricated semi-transparent solar cells yielded power conversion efficiency in excess of 10%, which supersede pristine devices along with improved stability. The device architect and the fabrication technique provide an effective route to fabricate cost effective and visible-light-semi-transparent perovskite solar cells.</p>

scholarly journals Carrier Blocking Layer Materials and Application in Organic Photodetectors

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1404
Author(s):  
Yi Li ◽  
Hu Chen ◽  
Jianhua Zhang
Keyword(s):  
High Performance ◽  
Spectral Response ◽  
Critical Role ◽  
Cost Effective ◽  
Image Sensors ◽  
Large Area ◽  
Solution Processes ◽  
Response Range ◽  
Long Time ◽  
Organic Photodetectors

As a promising candidate for next-generation photodetectors, organic photodetectors (OPDs) have gained increasing interest as they offer cost-effective fabrication methods using solution processes and a tunable spectral response range, making them particularly attractive for large area image sensors on lightweight flexible substrates. Carrier blocking layers engineering is very important to the high performance of OPDs that can select a certain charge carriers (holes or electrons) to be collected and suppress another carrier. Carrier blocking layers of OPDs play a critical role in reducing dark current, boosting their efficiency and long-time stability. This Review summarizes various materials for carrier blocking layers and some of the latest progress in OPDs. This provides the reader with guidelines to improve the OPD performance via carrier blocking layers engineering.

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