The prediction and measurement of acoustic absorption in high temperature (up to 1200 °K) atmospheric gas mixtures using a specially designed plate‐diaphragm capacitive high temperature acoustic transducer

1991 ◽  
Vol 90 (6) ◽  
pp. 3375-3375
Author(s):  
Wallace R. A. George
Keyword(s):  
High Temperature ◽  
Gas Mixtures ◽  
Acoustic Absorption ◽  
Acoustic Transducer

scholarly journals High Temperature Shear Horizontal Electromagnetic Acoustic Transducer for Guided Wave Inspection

Sensors ◽  
2016 ◽  
Vol 16 (4) ◽  
pp. 582 ◽  
Author(s):  
Maria Kogia ◽  
Tat-Hean Gan ◽  
Wamadeva Balachandran ◽  
Makis Livadas ◽  
Vassilios Kappatos ◽  
...  
Keyword(s):  
High Temperature ◽  
Guided Wave ◽  
Electromagnetic Acoustic Transducer ◽  
Acoustic Transducer ◽  
Temperature Shear ◽  
Shear Horizontal

High-Temperature Acoustic Fluid Velocity Sensor Development

2016 ◽  
Vol 2016 (1) ◽  
pp. 000653-000659
Author(s):  
Imran Moton ◽  
Rocco DiFoggio ◽  
Josh Liew ◽  
Otto Fanini
Keyword(s):  
High Temperature ◽  
Material Selection ◽  
Fluid Velocity ◽  
Hydrocarbon Reservoir ◽  
Fluid Analysis ◽  
Acoustic Transducer ◽  
Manufacturing Testing ◽  
Silver Electrodes ◽  
Acoustic Fluid ◽  
Subsurface Formation

Abstract There are numerous challenges to developing sensors for high-temperature and high-pressure hydrocarbon reservoir fluid analysis applications in the downhole environment. These challenges include material selection as well as processes for manufacturing, testing, and verification of the sensors. We were tasked with developing sensors for the analysis of subsurface formation fluid samples that required reliable operation up to 38,000 psi (262 MPa) and 450° F (232° C). This paper focuses on the technical challenges and our solution for one such sensor that measures the sound speed of the sampled formation fluid. The core of our acoustic transducer is a piezoelectric crystal, which serves as the acoustic transmitter and receiver. This paper-thin, coin-shaped crystal has even thinner silver electrodes deposited on both of its faces. Numerous wire-to-electrode bonding methods were investigated, which included soldering, sintering, and epoxying, the latter of which proved successful.

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