Laser-induced thermal response and characterization of nanoparticles for cancer treatment using magnetic resonance thermal imaging

2007 ◽  
Vol 34 (7) ◽  
pp. 3102-3108 ◽  
Author(s):  
Andrew M. Elliott ◽  
R. Jason Stafford ◽  
Jon Schwartz ◽  
James Wang ◽  
Anil M. Shetty ◽  
...  
Keyword(s):  
Magnetic Resonance ◽  
Cancer Treatment ◽  
Thermal Imaging ◽  
Thermal Response

Characterization of Magnetic Resonance Thermal Imaging Signal Artifact During Magnetic Resonance Guided Laser-Induced Thermal Therapy

2020 ◽  
Vol 19 (5) ◽  
pp. 619-624
Author(s):  
Sean M Munier ◽  
Allison S Liang ◽  
Akshay N Desai ◽  
Jose K James ◽  
Shabbar F Danish
Keyword(s):  
Magnetic Resonance ◽  
Patient Outcomes ◽  
Thermal Imaging ◽  
Thermal Damage ◽  
Invasive Procedure ◽  
Thermal Therapy ◽  
Surgical Indications ◽  
Ablation Procedure ◽  
Future Studies

Abstract BACKGROUND Magnetic resonance-guided laser interstitial thermal therapy (MRgLITT) is a minimally invasive procedure that utilizes intraoperative magnetic resonance thermal imaging (MRTI) to generate a thermal damage estimate (TDE) of the ablative area. In select cases, the MRTI contains a signal artifact or defect that distorts the ablative region. No study has attempted to characterize this artifact. OBJECTIVE To characterize MRTI signal the artifact in select cases to better understand its potential relevance and impact on the ablation procedure. METHODS All ablations were performed using the Visualase magnetic resonance imaging-guided laser ablation system (Medtronic). Patients were included if the MRTI contained signal artifact that distorted the ablative region during the first thermal dose delivered. Ablation artifact was quantified using MATLAB version R2018a (Mathworks Inc, Natick, Massachusetts). RESULTS A total of 116 patients undergoing MRgLITT for various surgical indications were examined. MRTI artifact was observed in 37.0% of cases overall. Incidence of artifact was greater at higher powers (P < .001) and with longer ablation times (P = .024), though artifact size did not correlate with laser power or ablation duration. CONCLUSION MRTI signal artifact is common during LITT. Higher powers and longer ablation times result in greater incidence of ablation artifact, though artifact size is not correlated with power or duration. Future studies should aim to evaluate effects of artifact on postoperative imaging and, most notably, patient outcomes.

Thermal Imaging Product Power-up: Metrology for Capturing Thermal Defects on Live Units Not Visible on Any Other Technique

2005 ◽  
Author(s):  
Nova T. Zamora ◽  
Kam Meng Chong ◽  
Ashish Gupta
Keyword(s):  
Thermal Imaging ◽  
Thermal Response ◽  
Recent Application ◽  
Ir Camera ◽  
Thermal Failure ◽  
Response Data ◽  
Startup Process ◽  
Customer Returns ◽  
Actual Computer ◽  
Detection Of Defects

Abstract This paper presented the recent application of die powerup in Thermal Imaging as applied to the detection of defects causing thermal failure on revenue products or units not being captured using other available techniques. Simulating the condition on an actual computer setup, the infrared (IR) camera should capture images simultaneously as the entire bootup process is being executed by the processor, thus revealing a series of images and thermal information on each and every step of the startup process. This metrology gives the failure analyst a better approach to acquire a set of information that substantiate in the conduct of rootcause analysis of thermal-related failure in revenue units, especially on customer returns. Defective units were intentionally engineered in order to collect the thermal response data and eventually come up with a plot of all known thermal-related defects.

Evaluation of Package Defects by Thermal Imaging Techniques

2002 ◽  
Author(s):  
Yongmei Liu ◽  
Rajen Dias
Keyword(s):  
Infrared Thermography ◽  
Thermal Imaging ◽  
High Speed ◽  
Imaging Techniques ◽  
Thermal Response ◽  
Analysis Tool ◽  
Nondestructive Analysis ◽  
Ir Camera ◽  
External Heating

Abstract Study presented here has shown that Infrared thermography has the potential to be a nondestructive analysis tool for evaluating package sublayer defects. Thermal imaging is achieved by applying pulsed external heating to the package surface and monitoring the surface thermal response as a function of time with a high-speed IR camera. Since the thermal response of the surface is affected by the defects such as voids and delamination below the package surface, the technique can be used to assist package defects detection and analysis.

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