Effects analysis of large area polishing tool on aspheric surface quality

2012 ◽  
Author(s):  
Yun-long Zhang ◽  
Feng Zhang ◽  
Jin-rui Yan ◽  
Ying Su ◽  
Rui Guo ◽  
...  
Keyword(s):  
Surface Quality ◽  
Aspheric Surface ◽  
Large Area ◽  
Polishing Tool

Improving surface quality of polyethylene terephthalate film for large area flexible electronic applications

2015 ◽  
Vol 20 (7) ◽  
pp. 1895-1902 ◽  
Author(s):  
Florencia Edith Wiria ◽  
Chu Long Tham ◽  
Alamelu Suriya Subramanian ◽  
Ju Nie Tey ◽  
Xiaoying Qi ◽  
...  
Keyword(s):  
Surface Quality ◽  
Polyethylene Terephthalate ◽  
Large Area ◽  
Polyethylene Terephthalate Film ◽  
Flexible Electronic

Fundamental Investigation on the Polishing Aspheric Elements with Doughnut-Shaped MCF Slurry

2018 ◽  
Vol 792 ◽  
pp. 179-184 ◽  
Author(s):  
Ming Feng ◽  
Yong Bo Wu ◽  
Teruo Bitoh ◽  
Tsunehisa Suzuki ◽  
Mitsuyoshi Nomura ◽  
...  
Keyword(s):  
Experimental Result ◽  
Aspheric Surface ◽  
Aspheric Surfaces ◽  
Variable Parameters ◽  
Flat Surfaces ◽  
Surface Polishing ◽  
Fundamental Investigation ◽  
Novel Method ◽  
Curve Radius ◽  
Polishing Tool

Previous researches have confirmed that MCF (magnetic compound fluid) slurry shows outstanding performance in the nanoprecision polishing of flat surfaces and V-grooves. However, no investigations have been conducted on the polishing of aspheric surfaces using MCF slurry. In this work, a novel method employing a doughnut-shaped MCF polishing tool and a 6-DOF manipulator has been proposed for the aspheric surface polishing. The time consumption for forming stable polishing tool and its final appearance are investigated. Flat aluminum alloy workpieces that can be considered as a kind of aspheric elements with infinite curve radius were adopted in the investigation of the polished forces under variable parameters. As a typical experimental result, with MCF3 slurry, 2.5ml volume of supplied slurry and work gap 3.5 mm, the surface roughness Ra decreases from 125nm to almost 10nm after 90 min polishing, confirming that the proposed method has the potential to polish aspheric surfaces.

Polishing path generation for physical uniform coverage of the aspheric surface based on the Archimedes spiral in bonnet polishing

2019 ◽  
Vol 233 (12) ◽  
pp. 2251-2263 ◽  
Author(s):  
Qizhi Zhao ◽  
Lei Zhang ◽  
Yanjun Han ◽  
Cheng Fan
Keyword(s):  
Tool Path ◽  
Curved Surface ◽  
Path Generation ◽  
Aspheric Surface ◽  
Polishing Process ◽  
Bonnet Polishing ◽  
Archimedes Spiral ◽  
Uniform Coverage ◽  
Polishing Path ◽  
Polishing Tool

As a new polishing method, bonnet polishing is suitable for polishing the curved surface due to its advantages in flexibility and adaptability of the polishing tool. In the polishing process, the contact state between the bonnet and the curved surface always changes. The traditional polishing tool path with equal interval will inevitably lead to over-polished areas and unpolished areas. In this article, a new tool path for bonnet polishing, which is called the revised Archimedes spiral polishing path, is proposed to ensure the physical uniform coverage of the curved surface in bonnet polishing. The path generation method is based on the modified tool–workpiece contact model and the pointwise searching algorithm. To prove the effectiveness of the revised path, two aspheric workpieces were polished along the traditional Archimedes spiral polishing path and the revised path, respectively. The roughnesses of the two workpieces are 10.94 and 10 nm, and the profile tolerances are 0.4097 and 0.2037 μm, respectively. The experimental results show that the revised path achieves lower roughness and surface tolerance than the traditional Archimedes path, which indicates that the revised path can achieve uniform physical coverage on the surface.

On-machine truing of diamond wheel and high-efficiency grinding of monocrystal silicon for aspheric surface

2016 ◽  
Vol 231 (1) ◽  
pp. 186-192 ◽  
Author(s):  
Bing Chen ◽  
Bing Guo ◽  
Qingliang Zhao
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
High Efficiency ◽  
Diamond Wheel ◽  
Experimental Results ◽  
Aspheric Surface ◽  
Removal Rates ◽  
Aspheric Surfaces ◽  
Silicon Carbon

To realize the high-efficiency grinding of the aspheric surfaces on monocrystal silicon, a novel on-machine truing method for the resin-bonded arc-shaped diamond wheels was proposed utilizing rotary green silicon carbon rod, and then the high-efficiency grinding of the aspheric surface was performed. First, the principle of mutual-wear for truing arc-shaped diamond wheel was introduced, and the truing performance was studied. The experimental results showed that the top morphology of the trued arc-shaped wheel was precise and smooth, and the run error on the top of the trued arc-shaped wheel was reduced from 41 to 10 µm after truing. Furthermore, high-efficiency grinding experiments revealed that the surface quality of the aspheric surface increased with the increase in the average material removal rates.

Mechanism and Experimental Investigation on Silicon Wafer Hybrid Polishing by Ultrasonic-Elliptic-Vibration Chemical-Mechanical

2011 ◽  
Vol 314-316 ◽  
pp. 829-836 ◽  
Author(s):  
Wei Ping Yang ◽  
Yong Bo Wu ◽  
Hong Fei Yang
Keyword(s):  
Theoretical Analysis ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
Polished Surface ◽  
Polishing Pad ◽  
Wafer Polishing ◽  
Elliptic Vibration ◽  
Polishing Tool

Considering the technical status and existing problems of traditional silicon wafer chemical mechanical polishing (CMP), especially for the diameter of silicon wafer increasing, constantly, the surface quality and efficiency of silicon wafer polishing are becoming an urgent problem to be solved, so the research subject of ultrasonic vibration hybrid polishing new technique was proposed. By means of mechanism theoretical analysis research, firstly, the processing mechanism of hybrid polishing was studied systematically. An investigation of polishing mechanisms based on the micro-contact model between the polishing pad and the polishing surface of silicon wafer was developed. Polishing mechanism theoretical analysis shows that when ultrasonic vibrations combined with mechanical and chemical, the performance of polishing slurry is improved in the process of CMP, therefore to create favorable conditions. To verify the established theory, then, a series of experiments to investigate the traditional CMP are conducted, as well as the polishing tool with the forms of ultrasonic vibration, the polishing pad, the polishing surface quality, velocity at polishing point v, and slurry supplying Q on silicon wafer polishing. Experiment findings showed that, in the same polishing conditions, especially, hybrid polishing by ultrasonic-elliptic-vibration has gained more advantage over the effect of silicon wafer polishing. When ultrasonic-elliptic-vibration is put in polishing tool, the silicon wafer polished surface roughness Ra from the traditional method of polishing 0.077μm going down to the 0.042μm, the no-smooth rate KR which describes the polished surface morphology is significantly improved, and the material removal rate increases by 18%. Experimental research findings of the surface quality and the material removal mechanism are shown to be consistent with the theoretical analysis.

Aspheric surface polishing with orthogonal velocity polishing tool

2021 ◽  
Author(s):  
Zhimin Rao ◽  
Haitao Liu ◽  
Jieli Wu ◽  
Qiang Chen ◽  
Dailu Wang
Keyword(s):  
Aspheric Surface ◽  
Surface Polishing ◽  
Polishing Tool

Study on Polishing Tool Contact Deformation for Large Robotic Aspheric Surface Compliant Polishing

2013 ◽  
Vol 433-435 ◽  
pp. 2058-2063
Author(s):  
Wei Chen ◽  
Jian Ming Zhan ◽  
Min Qing Zhang
Keyword(s):  
Mutual Interaction ◽  
Work Piece ◽  
Aspheric Surface ◽  
Contact Deformation ◽  
Rough Machining ◽  
Compliant Polishing ◽  
Polishing Force ◽  
Pneumatic Servo System ◽  
Adaptive Ability ◽  
Polishing Tool

Due to the problem of the mutual interaction between the polishing tool system and the control of poses and positions, it is difficult to hybrid-synchronizationally control the polishing force, the posture of polishing tool head and the polishing trajectory. So the article designed a set of compliant tools that take the pneumatic servo system as the control system, which was used for active polishing aspheric surface of Robot. It was to accomplish the Robots self-adaptive control to the posture of the polishing tool as well as to figure out the correlation of the contact deformation between the polishing tool and the work piece surface, which makes a theoretical analysis on dynamic and steady characteristics of the contact deformation of the tool system. It applied the meek and polishing tools to the polishing processing of the rough machining of large aspheric surface samples to obtain the data. According to the statistics, the polishing tools can effectively solve the problem of the mutual interaction between the polishing tool system and the control of poses and positions. It also owns good adaptive ability and its machining aspheric surface quality can achieve nanoscale.

Growth Rate and Thickness Uniformity of Epitaxial Graphene

2010 ◽  
Vol 645-648 ◽  
pp. 569-572 ◽  
Author(s):  
Wlodek Strupiński ◽  
Aneta Drabińska ◽  
Rafał Bożek ◽  
Jolanta Borysiuk ◽  
Andrzej Wysmolek ◽  
...  
Keyword(s):  
Growth Rate ◽  
Surface Quality ◽  
Graphene Layer ◽  
Epitaxial Graphene ◽  
Large Area ◽  
Thickness Uniformity ◽  
Graphene Growth

The paper provides a deeper understanding of key-parameters of epitaxial graphene growth techniques on SiC. At 16000C, the graphene layer is continuous and covers a large area of the substrate. Significant differences in the growth rate could be observed for different reactor pressures and the polarity of SiC substrates as well as for the substrate miscut and surface quality. In addition, graphene thickness uniformity and mechanism of ridges creation was examined.

Novel Scanning Immersion Lithography for 3D Microfabrication

2012 ◽  
Vol 249-250 ◽  
pp. 747-751
Author(s):  
Yi Cheng Chen ◽  
Shi Chang Tseng
Keyword(s):  
Surface Quality ◽  
Experimental Results ◽  
Mask Pattern ◽  
Large Area ◽  
Immersion Lithography ◽  
3D Microstructure ◽  
Smooth Movement ◽  
Optical Applications ◽  
First Time ◽  
Lithography Technique

We propose the first time combining the merit of scanning and immersion lithography to fabricate 3D microstructure in this study. Via applying a matching liquid to reduce the diffraction error, the gap between the mask/resist becomes more tolerable. In addition, the liquid also act as a lubricant and a buffer for smooth movement of the mask/substrate. These advantages will benefit the performance of scanning lithography technique. The experimental results show that the large-area, 3D microstructure with excellent surface quality (Ravg<10 nm) can be successively fabricated based on this method. Besides, 3D microstructures with various geometries and functionalities can be generated by altering the shape of the mask pattern, or changing the scanning directions. The proposed SIL technique seems to be a promising way for fabricating 3D microstructure for optical applications.

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