Investigation Of Photoablation As A Patterning Technique For Silicon Based Integrated Circuits: Laser Ablation And Physical Damage Threshold Considerations

1990 ◽  
Author(s):  
D. L. Singleton ◽  
G. Paraskevopoulos ◽  
A. D. Buckthought ◽  
R. S. Irwin ◽  
G. S. Jolly ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Damage Threshold ◽  
Physical Damage ◽  
Patterning Technique ◽  
Silicon Based

Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages

2008 ◽  
Author(s):  
P. Schwindenhammer ◽  
H. Murray ◽  
P. Descamps ◽  
P. Poirier
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Ablation Process ◽  
Thermally Induced ◽  
Electrical Failure ◽  
Electrical Phenomenon ◽  
Semiconductor Packages ◽  
Complex Semiconductor

Abstract Decapsulation of complex semiconductor packages for failure analysis is enhanced by laser ablation. If lasers are potentially dangerous for Integrated Circuits (IC) surface they also generate a thermal elevation of the package during the ablation process. During measurement of this temperature it was observed another and unexpected electrical phenomenon in the IC induced by laser. It is demonstrated that this new phenomenon is not thermally induced and occurs under certain ablation conditions.

scholarly journals Upfront Magnetic Resonance Imaging-Guided Stereotactic Laser-Ablation in Newly Diagnosed Glioblastoma: A Multicenter Review of Survival Outcomes Compared to a Matched Cohort of Biopsy-Only Patients

Neurosurgery ◽  
2018 ◽  
Vol 85 (6) ◽  
pp. 762-772 ◽  
Author(s):  
Alireza M Mohammadi ◽  
Mayur Sharma ◽  
Thomas L Beaumont ◽  
Kevin O Juarez ◽  
Hanna Kemeny ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Tumor Volume ◽  
Cleveland Clinic ◽  
Damage Threshold ◽  
Progression Free Survival ◽  
Tumor Location ◽  
Newly Diagnosed ◽  
Prognostic Groups ◽  
Newly Diagnosed Glioblastoma ◽  
Disease Specific

Abstract BACKGROUND Laser ablation (LA) is used as an upfront treatment in patients with deep seated newly diagnosed Glioblastoma (nGBM). OBJECTIVE To evaluate the outcomes of LA in patients with nGBM and compare them with a matched biopsy-only cohort. METHODS Twenty-four nGBM patients underwent upfront LA at Cleveland clinic, Washington University in St. Louis, and Yale University (6/2011-12/2014) followed by chemo/radiotherapy. Also, 24 out of 171 nGBM patients with biopsy followed by chemo/radiotherapy were matched based on age (< 70 vs ≥ 70), gender, tumor location (deep vs lobar), and volume (<11 cc vs ≥11 cc). Progression-free survival (PFS), overall survival (OS), and disease-specific PFS and OS were outcome measures. Three prognostic groups were identified based on extent of tumor ablation by thermal-damage-threshold (TDT)-lines. RESULTS The median tumor volume in LA (n = 24) and biopsy only (n = 24) groups was 9.3 cm3 and 8.2 cm3 respectively. Overall, median estimate of OS and PFS in LA cohort was 14.4 and 4.3 mo compared to 15.8 mo and 5.9 mo for biopsy only cohort. On multivariate analysis, favorable TDT-line prognostic groups were associated with lower incidence of disease specific death (P = .03) and progression (P = .05) compared to other groups including biopsy only cohort. Only age (<70 yr, P = .02) and tumor volume (<11 cc, P = .03) were favorable prognostic factors for OS. CONCLUSION The maximum tumor coverage by LA followed by radiation/chemotherapy is an effective treatment modality in patients with nGBM, compared to biopsy only cohort. The TDT-line prognostic groups were independent predictor of disease specific death and progression after LA.

scholarly journals Photonic Crystal Cavity with a Thin Low-Index Layer for Silicon-Compatible Nanolight Source

2018 ◽  
Vol 8 (9) ◽  
pp. 1552 ◽  
Author(s):  
Youngsoo Kim ◽  
Young Lee ◽  
Seokhyeon Hong ◽  
Kihwan Moon ◽  
Soon-Hong Kwon
Keyword(s):  
Photonic Crystal ◽  
Integrated Circuits ◽  
Quality Factor ◽  
Wavelength Region ◽  
High Quality Factor ◽  
Silica Layer ◽  
High Quality ◽  
Light Emitting ◽  
Telecommunication Wavelength ◽  
Silicon Based

The development of an efficient silicon-based nanolight source is an important step for silicon-based photonic integrated circuits. We propose a high quality factor photonic crystal nanocavity consisting of silicon and silica, which can be used as a silicon-compatible nanolight source. We show that this cavity can effectively confine lights in a low-index silica layer with a high confinement factor of 0.25, in which rare-earth dopants can be embedded as gain materials. The cavity is optimized to have a high quality factor of 15,000 and a mode volume of 0.01 μm3, while the resonance has a wavelength of 1537 nm. We expect that the high confinement factor in the thin silica layer and the high quality factor of the proposed cavity enable the cavity to be a good candidate for silicon-compatible nanolight sources for use in nanolasers or light-emitting diodes in the telecommunication wavelength region.

scholarly journals Silicon-based heterogeneous photonic integrated circuits for the mid-infrared

2013 ◽  
Vol 3 (9) ◽  
pp. 1523 ◽  
Author(s):  
Gunther Roelkens ◽  
Utsav Dave ◽  
Alban Gassenq ◽  
Nannicha Hattasan ◽  
Chen Hu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Mid Infrared ◽  
Silicon Based

scholarly journals Organic printed photonics: From microring lasers to integrated circuits

2015 ◽  
Vol 1 (8) ◽  
pp. e1500257 ◽  
Author(s):  
Chuang Zhang ◽  
Chang-Ling Zou ◽  
Yan Zhao ◽  
Chun-Hua Dong ◽  
Cong Wei ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Flexible Electronics ◽  
Integrated Circuit ◽  
Large Scale ◽  
Rapid Development ◽  
Light Signal ◽  
Photonic Integrated Circuit ◽  
Printing Technique ◽  
On Chip ◽  
Silicon Based

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

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