The Design, Characterization, and Implementation of a One Micron Lithography Process in a High Volume Manufacturing Line

1989 ◽  
Author(s):  
Jamie S. Van De Ven ◽  
Joseph C. Langston
Keyword(s):  
High Volume ◽  
Lithography Process ◽  
Manufacturing Line

Innovative Strategic Planning for the Design of a High Volume Production Line using Quality Function Deployment and a Batch

2013 ◽  
Vol 4 (1) ◽  
pp. 53-68
Author(s):  
Roberto Yumbla ◽  
Stuart Lumley ◽  
M. Khurshid Khan
Keyword(s):  
Production Line ◽  
Quality Function Deployment ◽  
High Volume ◽  
Quality Function ◽  
Manufacturing Line ◽  
Proactive Management ◽  
High Volume Production ◽  
Volume Production ◽  
Planning Methodology ◽  
Line Design

This paper proposes an innovative factory planning methodology to achieve the objectives that were defined by Flexitallic for the future expansion of the Thermiculite production line. The concepts under investigation extend to the analysis of flow benefits and restrictions considering product features and demands addressed in a proposed Batch/Flow Comparative Matrix. Furthermore, this paper introduces the Quality Function Deployment (QFD) concept to support the manufacturing line design using a mechanism of incorporating commercial awareness in all stages of the product deployment. The original QFD ensures process planning by bringing parts deployment into parts characteristics through the House of Quality. This study renews the original QFD by developing the Strategic Alignment of Quality Function Deployment (SAQFD) to achieve proactive management of Houses III and House IV. The case study demonstrates the utilization and applicability of the proposed methodologies, and demonstrates their importance during the design of a high volume production line.

Optimization of a High-Volume 200-mm BiCMOS Manufacturing Line

2005 ◽  
Author(s):  
T. Hook ◽  
B. Chen ◽  
G. Starkey ◽  
A. Bhattacharyya ◽  
M. Faucher ◽  
...  
Keyword(s):  
High Volume ◽  
Manufacturing Line

High Volume and Fast Turnaround Automated Inline TEM Sample Preparation for Manufacturing Process Monitoring

2010 ◽  
Author(s):  
Hyoung H. Kang ◽  
John F. King ◽  
Oliver D. Patterson ◽  
Steven B. Herschbein ◽  
James P. Nadeau ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Process Monitoring ◽  
Preparation Method ◽  
High Volume ◽  
Ex Situ ◽  
Automation System ◽  
Sample Preparation Method ◽  
Factory Automation ◽  
Manufacturing Line ◽  
Tem Lamella

Abstract This paper introduces a high volume and fast turnaround TEM sample preparation method and requirements for a 300 mm inline DualBeam (FIB/SEM) system with “hands-off” full automation. It requires a factory automation system, robust automated recipes, and an ex-situ TEM lamella liftout system. It describes the recipe structure and TEM lamella lift out procedures. The focus is on fully automated TEM sample preparation for process monitoring in manufacturing line. Two successful examples are described to demonstrate the benefit of this method. The first one is TEM sample for CA profile at M1 level. The second is TEM sample for poly crystalline (PC) line profile at post-etch.

PVMaT technology improvements in the EFG high volume PV manufacturing line

2003 ◽  
Author(s):  
M.D. Rosenblum ◽  
B.R. Bathey ◽  
J. Cao ◽  
R. Gonsiorawski ◽  
B.H. Mackintosh ◽  
...  
Keyword(s):  
High Volume ◽  
Manufacturing Line

scholarly journals PVMaT Cost Reductions in the EFG High Volume PV Manufacturing Line: Final Subcontract Report, 5 August 1998 -- 4 February 2001

2002 ◽  
Author(s):  
J. Kalejs ◽  
B. Bathey ◽  
B. Brown ◽  
J. Cao ◽  
J. Doedderlein ◽  
...  
Keyword(s):  
High Volume ◽  
Manufacturing Line ◽  
Cost Reductions

scholarly journals Optimization of Dispensing Parameter to Speed up the Die Attach Throughput

2020 ◽  
pp. 39-44
Author(s):  
Michael D. Capili
Keyword(s):  
Integrated Circuits ◽  
Capital Investment ◽  
Writing Process ◽  
High Volume ◽  
Process Unit ◽  
Manufacturing Line ◽  
Die Attach ◽  
Epoxy Dispensing ◽  
Speed Up ◽  
Area Optimization

Driven by the company vision to become a high-volume manufacturing (HVM), increasing throughput in the manufacturing line is critical to meeting market demands. The ever-growing demand for integrated circuits in part requires additional capital investment to purchase new equipment such as die bonders to support the new requirement. Making the best of existing resources is often the most common approach to deal with this challenge. Defining the correct method and making the most of the secondary parameters necessary to increase the bonding speed by means of a creative analysis that made this article interesting. The objective of this project is to boost productivity by maximizing UPH to improve the epoxy writing process at Attach, which is a bottleneck area. Optimization of the dispensing sequence and the dispensing direction to improve and speed up the epoxy dispensing process unit per hour.

scholarly journals PVMaT Cost Reductions in the EFG High-Volume PV Manufacturing Line: Annual Report, August 1998-December 2000

2001 ◽  
Author(s):  
B Bathey ◽  
B Brown ◽  
J Cao ◽  
S Ebers ◽  
R Gonsiorawski ◽  
...  
Keyword(s):  
Annual Report ◽  
High Volume ◽  
Manufacturing Line ◽  
Cost Reductions

Morphology, Distribution and Identification of Micro-Constituents Along Grain Boundaries in Nickel-Base Alloys

1973 ◽  
Vol 31 ◽  
pp. 176-177
Author(s):  
D. E. Fornwalt ◽  
A. R. Geary ◽  
B. H. Kear
Keyword(s):  
Electron Microscope ◽  
Grain Boundaries ◽  
Volume Fraction ◽  
Rupture Life ◽  
Stress Rupture ◽  
High Volume ◽  
Precipitate Morphology ◽  
Stress Rupture Life ◽  
Nickel Base ◽  
Scanning Electron

A systematic study has been made of the effects of various heat treatments on the microstructures of several experimental high volume fraction γ’ precipitation hardened nickel-base alloys, after doping with ∼2 w/o Hf so as to improve the stress rupture life and ductility. The most significant microstructural chan§e brought about by prolonged aging at temperatures in the range 1600°-1900°F was the decoration of grain boundaries with precipitate particles.Precipitation along the grain boundaries was first detected by optical microscopy, but it was necessary to use the scanning electron microscope to reveal the details of the precipitate morphology. Figure 1(a) shows the grain boundary precipitates in relief, after partial dissolution of the surrounding γ + γ’ matrix.

A Comparison of Tem and Apfim to the Interpretation of Modulated Microstructures

1985 ◽  
Vol 43 ◽  
pp. 70-71
Author(s):  
M.G. Burke ◽  
M.K. Miller
Keyword(s):  
Low Temperature ◽  
Microstructural Characterization ◽  
Superlattice Reflection ◽  
High Volume ◽  
Atom Probe ◽  
Dark Field ◽  
Miscibility Gap ◽  
Second Phase ◽  
Two Phase ◽  
Probe Field

Interpretation of fine-scale microstructures containing high volume fractions of second phase is complex. In particular, microstructures developed through decomposition within low temperature miscibility gaps may be extremely fine. This paper compares the morphological interpretations of such complex microstructures by the high-resolution techniques of TEM and atom probe field-ion microscopy (APFIM).The Fe-25 at% Be alloy selected for this study was aged within the low temperature miscibility gap to form a <100> aligned two-phase microstructure. This triaxially modulated microstructure is composed of an Fe-rich ferrite phase and a B2-ordered Be-enriched phase. The microstructural characterization through conventional bright-field TEM is inadequate because of the many contributions to image contrast. The ordering reaction which accompanies spinodal decomposition in this alloy permits simplification of the image by the use of the centered dark field technique to image just one phase. A CDF image formed with a B2 superlattice reflection is shown in fig. 1. In this CDF micrograph, the the B2-ordered Be-enriched phase appears as bright regions in the darkly-imaging ferrite. By examining the specimen in a [001] orientation, the <100> nature of the modulations is evident.

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