Practical Excimer Laser Energy And Power Measurement: A Laser Manufacturer's Perspective.

1988 ◽  
Author(s):  
Steven N. Bittenson
Keyword(s):  
Excimer Laser ◽  
Laser Energy ◽  
Power Measurement

scholarly journals Preparation and Properties of Superconducting thin Films by Excimer Laser Ablation

1990 ◽  
Vol 191 ◽  
Author(s):  
Michael E. Geusic ◽  
Alan F. Stewart ◽  
Larry R. Pederson ◽  
William J. Weber ◽  
Kenneth R. Marken ◽  
...  
Keyword(s):  
Thin Films ◽  
Laser Ablation ◽  
Excimer Laser ◽  
Laser Energy ◽  
Substrate Surface ◽  
Xrd Analysis ◽  
Zero Field ◽  
Superconducting Transition ◽  
X Ray Diffraction ◽  
Excimer Laser Ablation

ABSTRACTExcimer laser ablation with an in situ heat treatment was used to prepare high quality superconducting YBa2Cu3O7−x thin films on (100)-SrTiO3 and (100)-LaAlO3 substrates. A pulsed excimer laser (XeCl; 308 nm) was used to ablate a rotating, bulk YBa2Cu3O7−x target at a laser energy density of 2–3 J/cm2. Based on four-probe dc resistance measurements, the films exhibited superconducting transition temperatures (Tc, midpoint) of 88 and 87K with 2K (90–10%) transition widths for SrTiO3 and LaAlO3, respectively. Transport critical current densities (Jc) measured at 77K were 2 × 106 and 1 × 106 A/cm2 in zero field for SrTiO3 and LaAlO3, respectively. X-ray diffraction (XRD) analysis showed the films to be highly oriented, with the c-axis perpendicular to the substrate surface.

Computer Simulation of Pulsed Laser Ablation for YBaCuO Superconducting Films

1990 ◽  
Vol 191 ◽  
Author(s):  
Toshiyuki Nakamiya ◽  
Kenji Ebihara ◽  
P. K. John ◽  
B. Y. Tong
Keyword(s):  
Thin Films ◽  
Excimer Laser ◽  
Laser Energy ◽  
Pulsed Laser ◽  
The Finite Element Method ◽  
High Tc ◽  
One Dimensional ◽  
Incident Laser Energy ◽  
Krf Excimer Laser ◽  
Pulsed Laser Irradiation

ABSTRACTThe dynamics of melting and ablation of high Tc YBa2Cu3O7-x superconducting thin films flashed by a pulsed KrF excimer laser(λ=248nm) or a pulsed Nd-YAG laser (λ =1.06μ m) were studied numerically. The fundamental model during a pulsed laser irradiation was a one-dimensional heat conduction equation. The finite element method was applied to solve the equation including the temperature dependence of the thermal conductivity of YBaCuO thin films. In addition, the microstructure of YBa2Cu3O7-x bulk(l.5mm thick) flashed by a pulsed XeCl excimer laser (λ =308nm) was investigated by scanning electron microscopy (SEM) in order to estimate the threshold incident laser energy density for surface melting and ablation. The good agreements between the numerical calculations and the experimental results were obtained.

Amorphous Silicon Crystallization For Tft Applications

1993 ◽  
Vol 321 ◽  
Author(s):  
J. Yi ◽  
R. Wallace ◽  
N. Sridhar ◽  
D. D. L. Chung ◽  
W. A. Anderson
Keyword(s):  
Thin Film ◽  
Amorphous Silicon ◽  
Leakage Current ◽  
Excimer Laser ◽  
Delay Time ◽  
Solid Phase ◽  
Laser Energy ◽  
Silicon Film ◽  
Rapid Thermal Anneal ◽  
Laser Anneal

ABSTRACTThin film hydrogenated Amorphous silicon (a-Si:H) was deposited on Molybdenum (Mo) substrates by d.c. glow discharge. We investigated the a-Si:H crystallization using four anneal techniques; nitrogen atmosphere furnace, vacuum, rapid thermal anneal (RTA), and excimer laser anneal. Anneal temperature ranged from 100 to 1200 °C. Excimer laser energy per pulse ranged from 90 to 340 M.J. Transmission electron Microscopy (TEM) revealed microstructure of crystallized Si film with grain size over 0.5 μm. X-ray diffraction (XRD) and Raman spectroscopy were employed to determine the degree of crystallization. The a-Si:H started to crystallize at temperatures over 600 °C. An 850 °C anneal reduced film resistivity to 10s (ω-cm) for intrinsic and 1 (ω-cm) for n-type. Coplanar type thin film transistors (TFT) with gate channel length of 25 μm and width of 220 μm were fabricated with various insulating layers; if sputtered SiO2, Si3N4, BaTiO3, MgO, and evaporated SiO. The first two exhibited the least leakage current. The as-grown intrinsic a-Si:H field effect mobility was around 0.03 (cmVV.s) and delay time was 5×10−7 s. The solid phase crystallized silicon film exhibited high leakage current. The delay time of an excimer laser anneal treated TFT was reduced to 2.5×10−7 s. Crystallized Si film mobility was improved to 15 (cm2 /V.s).

Poly-Resistor Thin Film Formation by Excimer Laser Micromachine

2015 ◽  
Vol 780 ◽  
pp. 17-21
Author(s):  
A.F.M. Anuar ◽  
Yufridin Wahab ◽  
M.Z. Zainol ◽  
H. Fazmir ◽  
M. Najmi ◽  
...  
Keyword(s):  
Thin Film ◽  
Excimer Laser ◽  
Laser Energy ◽  
Film Formation ◽  
Chemical Vapor ◽  
Laser Pulses ◽  
Beam Size ◽  
Silicon Thin Film ◽  
Pressure Chemical ◽  
Krf Excimer Laser

A simple theoretical model and resistor fabrication for calculating the resistance of a polycrystalline silicon thin film is presented. The resistance value for poly-resistor is perfomed in terms of polysilicon thickness and its total area. The KrF excimer laser micromachine is used in assisting the resistor formation for a low pressure chemical vapor deposition (LPCVD) based polysilicon. Laser micromachine with three main parameters is used to aid the fabrication of the poly-resistor; namely as the pulse rate (i.e. number of laser pulses per second), laser beam size and laser energy. These parameters have been investigated to create the isolation between materials and also to achieve the desired poly-resistor shape. Preliminary results show that the 35 um beam size and 15 mJ of energy level is the most effective parameter to produce the pattern. Poly-resistor formation with 12 and 21 number of squares shows the total average resistance of 303.52 Ω and 210.14 Ω respectively. The laser micromachine process also significantly reduce the total time and number of process steps that are required for resistor fabrication.

Low Temperature Crystallization of Amorphous Silicon Films Using an Excimer Laser

1989 ◽  
Vol 149 ◽  
Author(s):  
S. E. Ready ◽  
J. B. Boyce ◽  
R. Z. Bachrach ◽  
R. I. Johnson ◽  
K. Winer ◽  
...  
Keyword(s):  
Amorphous Silicon ◽  
Excimer Laser ◽  
Laser Energy ◽  
Amorphous Material ◽  
Surface Region ◽  
Silicon Films ◽  
Starting Material ◽  
Near Surface ◽  
Silicon Thin Films ◽  
Crystallite Sizes

ABSTRACTIn an effort to enhance the electrical properties of silicon thin films, we have performed recrystallization experiments on a variety of amorphous silicon films using an excimer laser. The intense, pulsed UV produced by the laser (308nm, using XeCl gas) is highly absorbed by the amorphous material and thus provides intense localized heating in the near surface region. Two types of starting films were studied: plasma CVD a-Si:H and LPCVD a-Si. The subsequent modification produces crystallites whose structure and electrical characteristics vary due to starting material and laser scan parameters. The treated films have been characterized using Raman, x-ray diffraction, TEM, SIMS and transport measurements. The results indicate that crystallites nucleate in the surface region. The degree of crystallization near the surface increases dramatically as a function of deposited laser energy density and less so as a function of laser shot density. The hall mobility of the highly crystallized samples exhibit an increase of 2 orders of magnitude over the amorphous starting material. In the PECVD material, the rapid diffusion of hydrogen causes voids to be formed at intermediate laser energy densities and removal of film at higher energy densities. The LPCVD material withstands the high laser energies to produce well crystallized films with crystallite sizes greater then 1000Å.

A Novel Two-Pass Excimer Laser Crystallization Process to Obtain Homogeneous Large Grain Polysilicon

1999 ◽  
Vol 558 ◽  
Author(s):  
L. Mariucci ◽  
R. Carluccio ◽  
A. Pecora ◽  
V. Foglietti ◽  
G. Fortunato ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Crystallization Process ◽  
Laser Energy ◽  
Spatial Modulation ◽  
Lateral Growth ◽  
Laser Crystallization ◽  
First Pass ◽  
Wide Energy ◽  
Excimer Laser Crystallization ◽  
Polysilicon Tft

ABSTRACTNew approach to control the lateral growth mechanism through the opportune spatial modulation of the absorbed laser energy and with a two-pass excimer laser crystallization process is presented. In the first pass, spatial modulation of the light intensity has been obtained by irradiating the sample through a patterned mask in contact with the sample. Lateral growth is triggered when the irradiated regions are fully melted and a lateral extension of the grains in excess to 1 μm has been observed for samples irradiated at RT. In order to homogeneously crystallize the sample, the film can be re-irradiated (second pass) without the mask. By using opportune energy densities it can be induced a complete melting of the residual a-Si regions (masked areas during the first pass), while partially melting the polysilicon regions (unmasked areas during the first pass). Different mask geometries have been investigated and for optimized conditions, the sample area can be fully covered with laterally grown grains. The proposed novel technique can be rather attractive for polysilicon TFT fabrication, being characterized by only a two laser-shot process and wide energy density windows.

Excimer Laser-Induced Decomposition of Aluminum Nitride

1991 ◽  
Vol 236 ◽  
Author(s):  
H. Esrom ◽  
J-Y Zhang ◽  
A.J. Pedraza
Keyword(s):  
Aluminum Nitride ◽  
Excimer Laser ◽  
Photoelectron Spectroscopy ◽  
Laser Energy ◽  
Liquid Aluminum ◽  
Aluminum Film ◽  
Hole Drilling ◽  
Addition Line ◽  
Substrate Roughness ◽  
Direct Laser

AbstractA thin film of aluminum, detected by x-ray photoelectron spectroscopy, is left at the surface of aluminum nitride (AIN) substrates exposed to a high intensity excimer laser beam of UV radiation. Due to the presence of this film, there is a decrease in the surface resistivity of the substrate with increasing number of laser pulses. In addition, line profilometry shows a decrease of the surface roughness with the number of pulses.The thermal decomposition of AIN is assumed to take place in two stages. In the first, liquid aluminum is produced together with the evolution of gaseous nitrogen, and in the second, aluminum evaporates. Using a computer model to simulate the laser heating cycle, it is shown that the thickness of the aluminum film saturates at a given laser energy density. The saturation thickness is a strong function of the substrate absorption and reflectivity and, therefore, of the laser light frequency. The influence of the substrate roughness on the electrical resistivity of the aluminum film is discussed.The application of this process to direct laser writing in high density hybrid circuits is illustrated. During hole drilling by excimer laser, a thin aluminum film is continuously produced at the hole walls. This process can also be employed for substrate planarization.

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