Advances in metrology for the determination of Young's modulus for low-k dielectric thin films

2012 ◽  
Author(s):  
Sean King ◽  
George A. Antonelli ◽  
Gheorghe Stan ◽  
Robert F. Cook ◽  
R. Sooryakumar
Keyword(s):  
Thin Films ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Dielectric Thin Films ◽  
Low K

Noncontact optical metrologies for Young’s modulus measurements of nanoporous low-k dielectric thin films

2013 ◽  
Vol 7 (1) ◽  
pp. 073094 ◽  
Author(s):  
Brian C. Daly ◽  
Sheldon T. Bailey ◽  
Ratnasingham Sooryakumar ◽  
Sean W. King
Keyword(s):  
Thin Films ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Dielectric Thin Films ◽  
Low K

On the determination of Young’s modulus of thin films with impulse excitation technique

2016 ◽  
Vol 32 (3) ◽  
pp. 497-511 ◽  
Author(s):  
M.F. Slim ◽  
A. Alhussein ◽  
A. Billard ◽  
F. Sanchette ◽  
M. François
Keyword(s):  
Thin Films ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Impulse Excitation ◽  
Image Position

Abstract

Determination of young's modulus by a resonant technique applied to two dynamically ion mixed thin films

1997 ◽  
Vol 292 (1-2) ◽  
pp. 55-60 ◽  
Author(s):  
S. Peraud ◽  
S. Pautrot ◽  
P. Villechaise ◽  
P. Mazot ◽  
J. Mendez
Keyword(s):  
Thin Films ◽  
Young’S Modulus ◽  
Young's Modulus

Determination of Young’s Modulus for Nanofibrillated Cellulose Multilayer Thin Films Using Buckling Mechanics

2011 ◽  
Vol 12 (4) ◽  
pp. 961-969 ◽  
Author(s):  
Emily D. Cranston ◽  
Mohamed Eita ◽  
Erik Johansson ◽  
Julia Netrval ◽  
Michaela Salajková ◽  
...  
Keyword(s):  
Thin Films ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Nanofibrillated Cellulose ◽  
Multilayer Thin Films

Micromechanical Characterization of Dielectric Thin Films

1993 ◽  
Vol 308 ◽  
Author(s):  
James M. Grow
Keyword(s):  
Thin Films ◽  
Young’S Modulus ◽  
Deposition Temperature ◽  
Silicon Oxide ◽  
Young's Modulus ◽  
Chemical Vapor ◽  
Silicon Carbonitride ◽  
Dielectric Thin Films ◽  
Micromechanical Characterization

ABSTRACTA nanoindenter has been used to obtain Young's modulus and hardness data for a variety of dielectric thin films including silicon carbide, boron nitride, silicon carbonitride, and silicon oxide. These films, were synthesized by low pressure and plasma enhanced chemical vapor deposition, and had a thickness from 0.25 to a few microns. For the BN films, the modulus and hardness of the films decreased significantly as the deposition temperature increased while the reverse was true for the SiC films. In both cases, these changes were related to variations in the compositions of the deposits due to the onset of different reactions as the temperature is increased. Silicon carbonitride films oxidized slowly when synthesized at temperatures below 200º C and the Young's modulus of these films increased at higher deposition temperatures. For silicon dioxide, there was little change in the composition of the films over the deposition temperature range investigated (375–475º C), thus correspondingly, small variations in the micromechanical properties of the material. However, moisture and hydrogen removal caused by an anneal at 800º C resulted in an significant increase in the modulus and hardness of these films.

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Young's Modulus ◽  
Porous Silica ◽  
Silicon Substrates ◽  
Silica Thin Films ◽  
Low K

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.

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