Thermal wave imaging techniques for inspection of plywood materials

Author(s):  
Ravibabu Mulaveesala ◽  
Venkata Nagarjuna P. ◽  
Dadda Ravi ◽  
Muniyappa Amarnath
1986 ◽  
Vol 82 ◽  
Author(s):  
William F. Regnault

ABSTRACTChemical sensors are being developed for in-dwelling biomedical applications. As sensor technologies progress, there is a tendency to fabricate more complex devices in a smaller area, thus enabling multiple sensors to be placed within a single in-dwelling catheter. As the active area of the detector is decreased, the defect structure of both the substrate and the various layers that make up the device plays an increasingly significant role in determining the ultimate sensitivity and reliability. A simple screening test to evaluate the viability of the substrate and the interfaces would aid in the initial evaluation of the fabricated device. To this end, thermal-wave imaging techniques have been applied to the study of a dislocation subgrain structure in a polycrystalline silicon wafer. Comparisons have been made between the results obtained using thermal-wave imaging, defect etching studies, and EBIC measurements.


1983 ◽  
Vol 44 (C6) ◽  
pp. C6-519-C6-524
Author(s):  
K. R. Grice ◽  
L. J. Inglehart ◽  
L. D. Favro ◽  
P. K. Kuo ◽  
R. L. Thomas

1984 ◽  
Vol 17 (6) ◽  
pp. 526-532 ◽  
Author(s):  
G F Kirkbright ◽  
R M Miller ◽  
A Rzadkiewicz

2012 ◽  
Vol 32 ◽  
pp. 39-48 ◽  
Author(s):  
Ravibabu Mulaveesala ◽  
Soma Sekhara Balaji Panda ◽  
Rupla Naik Mude ◽  
Muniyappa Amarnath

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