Sub-micron texturing of silicon wafer with fiber laser

2011 ◽  
Author(s):  
Hamid Farrokhi ◽  
Wei Zhou ◽  
Hong Yu Zheng ◽  
Zhongli Li
Keyword(s):  
Fiber Laser ◽  
Silicon Wafer

Characterization of Silicon Wafer Surface Irradiated with Fiber Laser

2010 ◽  
Vol 447-448 ◽  
pp. 715-719 ◽  
Author(s):  
Hamid Farrokhi ◽  
Wei Zhou ◽  
Hong Yu Zheng ◽  
Zhong Li Li
Keyword(s):  
Fiber Laser ◽  
Silicon Wafer ◽  
Surface Texturing ◽  
Surface Oxidation ◽  
Wafer Surface ◽  
Laser Material ◽  
The Poor ◽  
Material Interaction ◽  
Scanning Electron

We studied the feasibility of micromachining of silicon wafer using 200 W fiber laser of 1090 nm in wavelength. Irradiated area was observed and analyzed using scanning electron microscope and surface profiler. It was found that micromachining of silicon could not be carried out efficiently. Careful analyses revealed possible causes for the poor machinability: first, very weak plasma formed during the fiber laser-material interaction, leading to low evaporation or melt ejection; second, formation of large amounts of SiO2 resulted in expansion of volume. It is further demonstrated that the surface oxidation can be made use of for the purpose of surface texturing.

Development of Silicon Wafer Packaging Technology for Deep UV LED

2020 ◽  
Vol 140 (7) ◽  
pp. 152-157
Author(s):  
Hirofumi Chiba ◽  
Yukio Suzuki ◽  
Yoshiaki Yasuda ◽  
Mitsuyasu Kumagai ◽  
Takaaki Koyama ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Packaging Technology ◽  
Uv Led ◽  
Deep Uv

Fiber laser pick-and-join tool for welding of thermoplastics

2006 ◽  
Author(s):  
Andrei Boglea ◽  
Luedger Bosse ◽  
Alexander Olowinsky ◽  
Silvia Bou
Keyword(s):  
Fiber Laser
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