Efficient 350 nm LEDs on low edge threading dislocation density AlGaN buffer layers

2011 ◽  
Author(s):  
Richard Gutt ◽  
Thorsten Passow ◽  
Wilfried Pletschen ◽  
Michael Kunzer ◽  
Lutz Kirste ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Threading Dislocation Density ◽  
Algan Buffer

The Reduction of The Defect Density in CdTe Buffer Layers for The Growth of HgCdTe Infrared Photodiodes on Si (211) Substrates

1997 ◽  
Vol 484 ◽  
Author(s):  
H.-Y. Wei ◽  
L. Salamanca-Riba ◽  
N. K. Dhar
Keyword(s):  
Dislocation Density ◽  
Defect Density ◽  
Three Dimensional ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Si Substrates ◽  
Migration Enhanced Epitaxy ◽  
Threading Dislocation Density ◽  
Order Of Magnitude ◽  
Cdte Buffer

CdTe epilayers were grown by molecular beam epitaxy on As-passivated nominal (211) Si substrates using thin interfacial ZnTe layers. By using thin recrystallized (initially amorphous) ZnTe buffei layers, we utilized migration enhanced epitaxy (MEE) in the ZnTe layer and overcome the tendency toward three dimensional nucleation. The threading dislocation densities in 8–9 tm thick CdTe films deposited on the recrystallized amorphous ZnTe films were in the range of 2 to 5 × 105 cm−2. In addition to the reduction of threading dislocation density, the interface between the ZnTe layers and the Si substrate is much smoother and the microtwin density is an order of magnitude lower than in regular MEE growth. In order to understand the initial nucleation mechanism of the ZnTe on the As precursor Si surface, we also grew ZnTe epilayers on Te precursor treated Si substrates. The growth mode, microtwin density, and threading dislocation density are compared for films grown on Si substrates with different surface precursors and grown by different growth methods.

The Reduction of The Defect Density in CdTe Buffer Layers for The Growth of HgCdTe Infrared Photodiodes on Si (211) Substrates

1997 ◽  
Vol 487 ◽  
Author(s):  
H.-Y. Wei ◽  
L. Salamanca-Riba ◽  
N. K. Dhar
Keyword(s):  
Dislocation Density ◽  
Defect Density ◽  
Three Dimensional ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Si Substrates ◽  
Migration Enhanced Epitaxy ◽  
Threading Dislocation Density ◽  
Order Of Magnitude ◽  
Cdte Buffer

CdTe epilayers were grown by molecular beam epitaxy on As-passivated nominal (211) Si substrates using thin interfacial ZnTe layers. By using thin recrystallized (initially amorphous) ZnTe buffer layers, we utilized migration enhanced epitaxy (MEE) in the ZnTe layer and overcome the tendency toward three dimensional nucleation. The threading dislocation densities in 8–9 μm thick CdTe films deposited on the recrystallized amorphous ZnTe films were in the range of 2 to 5 × 105 cm−2. In addition to the reduction of threading dislocation density, the interface between the ZnTe layers and the Si substrate is much smoother and the microtwin density is an order of magnitude lower than in regular MEE growth. In order to understand the initial nucleation mechanism of the ZnTe on the As precursor Si surface, we also grew ZnTe epilayers on Te precursor treated Si substrates. The growth mode, microtwin density, and threading dislocation density are compared for films grown on Si substrates with different surface precursors and grown by different growth methods.

Threading Dislocations in S-Graded ZnSxSe1-x/GaAs (001) Metamorphic Buffer Layers

2014 ◽  
Vol 23 (01n02) ◽  
pp. 1420005 ◽  
Author(s):  
Tedi Kujofsa ◽  
John E. Ayers
Keyword(s):  
Dislocation Density ◽  
Buffer Layer ◽  
Lattice Relaxation ◽  
Buffer Layers ◽  
Cumulative Distribution ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Modeling Studies ◽  
Threading Dislocation Density ◽  
Dislocation Behavior

Metamorphic semiconductor devices are commonly fabricated with linearly-graded buffer layers, but equilibrium modeling studies suggest that S-graded buffers, following a normal cumulative distribution function, may enable lower threading defect densities. The present work involves a study of threading dislocation density behavior in S-graded ZnS x Se 1-x buffer layers for metamorphic devices on mismatched GaAs (001) substrates using a kinetic model for lattice relaxation and misfit-threading dislocation interactions. The results indicate that optimization of an S-graded buffer layer to minimize the surface threading dislocation density requires adjustment of the standard deviation parameter and cannot be achieved by varying the buffer thickness alone. Furthermore, it is possible to tailor the design of the S-graded buffer layer in such a way that the density of mobile threading dislocations at the surface vanishes. Nonetheless, the threading dislocation behavior in these heterostructures is quite complex, and a full understanding of their behavior will require further experimental and modeling studies.

Fabrication of relaxed GeSi buffer layers on Si(100) with low threading dislocation density

1992 ◽  
Vol 14 (3) ◽  
pp. 332-335 ◽  
Author(s):  
Y.H. Xie ◽  
E.A. Fitzgerald ◽  
P.J. Silverman ◽  
A.R. Kortan ◽  
B.E. Weir
Keyword(s):  
Dislocation Density ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Threading Dislocation Density

Drastic Reduction of Threading Dislocation Density of AlGaN on SiC Wafer by Using Highly-Si-Incorporated AlGaN Superlattice

2000 ◽  
Vol 639 ◽  
Author(s):  
Hideki Hirayama ◽  
Makoto Ainoya ◽  
Atsuhiro Kinoshita ◽  
Akira Hirata ◽  
Yoshinobu Aoyagi
Keyword(s):  
Dislocation Density ◽  
Threading Dislocation ◽  
Drastic Reduction ◽  
Organic Vapor ◽  
Threading Dislocation Density ◽  
Metal Organic ◽  
Total Growth ◽  
Sic Wafer ◽  
Algan Buffer

ABSTRACTA new in-situ technique to reduce threading dislocation density (TDD) within sub- micron growth is demonstrated by using metal-organic vapor-phase epitaxy (MOVPE). We achieved drastic reduction of TDD of AlGaN buffer on SiC substrate by inserting highly-Si- incorporated AlGaN/undoped AlGaN superlattice (SL). TDD of AlGaN was decreased from 2×1010 to 7×107 cm−2 by inserting the SL with the total growth thickness of 0.8νm. Si incorporation in AlGaN SL was estimated to be 1.2×1020 cm−3. This technique is exactly in- situ process without complicated fabrication processes, and the surface is kept flat throughout the total growth. This method is especially useful on SiC wafer in order to prevent cracks with thin growth layer. We confirmed the similar effects for GaN and AlGaN buffer on sapphire substrates.

High-Irradiance Degradation Studies of Metamorphic 1eV GaInAs Solar Cells

2012 ◽  
Vol 1432 ◽  
Author(s):  
Ryan M. France ◽  
Myles A. Steiner
Keyword(s):  
Solar Cells ◽  
Active Region ◽  
Dislocation Density ◽  
Dark Current ◽  
Degradation Mechanism ◽  
Control Cell ◽  
High Irradiance ◽  
Threading Dislocation ◽  
Threading Dislocation Density ◽  
Degradation Studies

ABSTRACTInitial tests are performed regarding the degradation of lattice-mismatched GaInAs solar cells. 1eV metamorphic GaInAs solar cells with 1-2×106 cm-2 threading dislocation density in the active region are irradiated with an 808 nm laser for 2 weeks time under a variety of temperature and illumination conditions. All devices show a small degradation in Voc that is logarithmic with time. The absolute loss in performance after 2 weeks illuminated at 1300 suns equivalent and 125°C is 7 mV Voc and 0.2% efficiency, showing these devices to be relatively stable. The dark current increases with time and is analyzed with a two-diode model. A GaAs control cell degrades at the same rate, suggesting that the observed degradation mechanism is not related to the additional dislocations in the GaInAs devices.

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