A low temperature fabrication process utilizing FIB implantation for CMOS compatible photovoltaic cells

Effect of Cr-doping on the physicochemical properties of blue TiO2 and its application in dye-sensitized solar cells via low-temperature fabrication process

Ceramics International ◽

10.1016/j.ceramint.2018.11.094 ◽

2019 ◽

Vol 45 (4) ◽

pp. 4230-4236 ◽

Cited By ~ 2

Author(s):

Sami Bin Humam ◽

Huy Hao Nguyen ◽

Chhabilal Regmi ◽

Gobinda Gyawali ◽

Bhupendra Joshi ◽

...

Keyword(s):

Solar Cells ◽

Low Temperature ◽

Physicochemical Properties ◽

Dye Sensitized Solar Cells ◽

Fabrication Process ◽

Dye Sensitized ◽

Sensitized Solar Cells ◽

Cr Doping

Download Full-text

CMOS compatible fabrication process of MEMS resonator for timing reference and sensing application

10.1117/12.2202532 ◽

2015 ◽

Author(s):

Duc H. Huynh ◽

Phuong D. Nguyen ◽

Thanh C. Nguyen ◽

Stan Skafidas ◽

Robin Evans

Keyword(s):

Fabrication Process ◽

Mems Resonator ◽

Cmos Compatible ◽

Sensing Application

Download Full-text

A Novel Latching Relay Fabricated Using an Oxide Molded Tungsten Process

MRS Proceedings ◽

10.1557/proc-872-j11.6 ◽

2005 ◽

Vol 872 ◽

Author(s):

J.G. Fleming ◽

Michael Baker ◽

David Luck

Keyword(s):

Chemical Vapor Deposition ◽

Low Temperature ◽

Tensile Stress ◽

Vapor Deposition ◽

Chemical Mechanical Polishing ◽

Chemical Vapor ◽

Metal Contacts ◽

Cmos Compatible ◽

Mems Device ◽

Very High

AbstractIn this paper we describe an oxide molded tungsten process applied to the fabrication of a novel latching relay. The steps in the process are: deposition of a sacrificial oxide, patterning of the oxide, filling of the resulting mold with a blanket film of tungsten using chemical vapor deposition (CVD), and then the removal and planarization of excess tungsten through chemical mechanical polishing (CMP). The process for the incorporation of dielectric isolation has also been developed. The resulting tungsten structures are under high tensile stress, which appears to be compensated in process by the compressive stress of the oxide mold. All the steps are low temperature and the entire process is backend CMOS compatible. This process has been used to fabricate a latching relay which relies on the internal stress of the tungsten and always generates force in a pulling mode. Parts have been successfully fabricated and tested, the devices generate very high forces for a MEMS device and give reasonable contact resistances even without noble metal contacts.

Download Full-text