Analysis about diamond tool wear in nano-metric cutting of single crystal silicon using molecular dynamics method

Author(s):  
Zhiguo Wang ◽  
Yingchun Liang ◽  
Mingjun Chen ◽  
Zhen Tong ◽  
Jiaxuan Chen
2011 ◽  
Vol 239-242 ◽  
pp. 3236-3239 ◽  
Author(s):  
Ying Chun Liang ◽  
Zhi Guo Wang ◽  
Ming Jun Chen ◽  
Jia Xuan Chen ◽  
Zhen Tong

Molecular dynamics simulations of the single crystal silicon nanoscale cutting with a diamond tool in ductile mode are carried out to investigate the adhesion phenomenon. After relaxation the silicon atoms on the surface reconstruct to make the potential decrease. The silicon atoms close to the diamond tool have the lowest potential (<-5.5 eV) and form a stable structure with surface atoms on the tool surface.


2008 ◽  
Vol 389-390 ◽  
pp. 144-150 ◽  
Author(s):  
Tsutomu Ohta ◽  
Ji Wang Yan ◽  
Sunao Kodera ◽  
Shuuma Yajima ◽  
Naoyuki Horikawa ◽  
...  

The service life of a diamond tool in cutting single-crystal silicon is normally very short because of severe tool wear. Therefore, it is important to use a proper coolant in order to restrain tool wear. In this paper, the performances of oil-based and water-based coolants were compared in silicon machining by investigating cutting forces and tool wear geometries. The water-based coolant was found to restrain flank wear more effectively than the oil-based one. The effective tool life using the water-based one was averagely three times longer than that using the oil-based one. The tool wear mechanism might be related to microplasma generated between silicon and diamond during cutting.


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