Reconfigurable free-space optical switching technologies for storage area networks

2009 ◽  
Author(s):  
N. Collings ◽  
H.-H. Chou ◽  
F. Zhang ◽  
W. A. Crossland
2012 ◽  
Vol 30 (11) ◽  
pp. 1719-1725 ◽  
Author(s):  
Hsi-Hsir Chou ◽  
F. Zhang ◽  
T. D. Wilkinson ◽  
N. Collings ◽  
W. A. Crossland

2005 ◽  
Author(s):  
Fan Zhang ◽  
Neil Collings ◽  
William A. Crossland ◽  
Timothy D. Wilkinson ◽  
Mark Fan ◽  
...  

2005 ◽  
Vol 43 (3) ◽  
pp. 93-99 ◽  
Author(s):  
T.D. Wilkinson ◽  
B. Crossland ◽  
N. Collings ◽  
Fan Zhang ◽  
M. Fan

2005 ◽  
Vol 152 (6) ◽  
pp. 285-291 ◽  
Author(s):  
F. Zhang ◽  
M.R. Taghizadeh ◽  
A. Waddie ◽  
T.D. Wilkinson ◽  
N. Collings ◽  
...  

1996 ◽  
Author(s):  
Daniel J. Reiley ◽  
Jose M. Sasian ◽  
Martin G. Beckman

Author(s):  
Gary A. Sevison ◽  
Joshua A. Burrow ◽  
Andrea Aboujaoude ◽  
Matthew Mircovich ◽  
Andrew Sarangan ◽  
...  

1997 ◽  
Vol 08 (02) ◽  
pp. 283-297 ◽  
Author(s):  
M. C. Wu ◽  
L. Y. Lin ◽  
S. S. Lee ◽  
C. R. King

A surface-micromachined free-space micro-optical bench (FS-MOB) technology has been proposed to monolithically integrate micro-optical elements, optomechanical structures, micropositioners, and microactuators on the same substrate. Novel three-dimensional micro-optical elements have been fabricated by surface-micromachining techniques. The optical axes of these optical elements are parallel to the substrate, which enables the entire free-space optical system to be integrated on a single substrate. Mocro-scale Fresnel lenses, refractive microlenses, mirrors, beam-splitters, gratings, and precision optical mounts have been successfully fabricated and characterized. Integration of micro-optical elements with translation or rotation stages provides on chip optical alignment or optomechanical switching. This new free-space micro-optical bench technology could significantly reduce the size, weight, an cost of most optical systems, and could have a significant impact on optical switching, optical sensing and optical data storage systems as well as packaging of optoelectronic components.


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