Hybrid tooling technologies for injection molded and hot embossed polymeric microfluidic devices

2010 ◽  
Author(s):  
Holger Becker ◽  
Erik Beckert ◽  
Claudia Gärtner
Keyword(s):  
Microfluidic Devices ◽  
Injection Molded ◽  
Polymeric Microfluidic

Tolerance Variation and Passive Alignment in Modular, Polymer Microfluidic Devices

2006 ◽  
Author(s):  
Byoung Hee You ◽  
Daniel S. Park ◽  
Christopher W. Mock ◽  
Wilfredo M. Caceres ◽  
Dimitris E. Nikitopoulos ◽  
...  
Keyword(s):  
Surface Temperature ◽  
Microfluidic Devices ◽  
Mold Surface ◽  
Injection Point ◽  
Replication Fidelity ◽  
Commercial Package ◽  
Assembly Features ◽  
Injection Molded ◽  
Successful Replication ◽  
Passive Alignment

Simulations and experiments to assess the predictability of dimensional and locational tolerances of passive alignment structures on injection molded microfluidic components were performed. A center-gated disk with microscale assembly features, to aid metrology, was reproduced using injection molding. The feature dimensions were 100, 200, 300, and 400 μ. Dimensions of the features were measured using optical profilometery and optical microscopy. Simulations using a commercial package overestimated replication fidelity. Mold surface temperatures and injection speeds significantly affected the replication fidelity as the ratio of surface area to volume increased. The location of better replication fidelity, at each mold surface temperature, moved from the edge of the mold cavity to the injection point as the mold surface temperature increased from 100°C to 150°C. Therefore, process parameters and the design of a mold have to be considered for successful replication of the features.

scholarly journals UV/Ozone Surface Treatment for Bonding of Elastomeric COC-Based Microfluidic Devices

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 943
Author(s):  
Eva Gleichweit ◽  
Christian Baumgartner ◽  
Reinhard Diethardt ◽  
Alexander Murer ◽  
Werner Sallegger ◽  
...  
Keyword(s):  
Microfluidic Devices ◽  
Thermoplastic Elastomer ◽  
Bonding Process ◽  
Test Method ◽  
Polymer Materials ◽  
Surface Activation ◽  
Molded Parts ◽  
Injection Molded ◽  
Bond Strengths ◽  
Uv Ozone

Reliable bonding of microstructured polymer parts is one of the major challenges in industrial fabrication of microfluidic devices. In the present work, the effects of a UV/ozone surface activation on the bonding process were investigated for the combination of a commonly used thermoplastic cyclic olefin copolymer (COC) with an elastomeric COC (eCOC) as a new thermoplastic elastomer material. Bonding was studied using two-component injection molded parts of COC and eCOC, together with microfluidic COC chips. Surface activation and bonding process parameters were optimized and bond strengths were characterized by the wedge test method. The results showed that strong bonding of this polymer materials combination can be achieved at temperatures significantly below the bulk glass transition temperature of COC.

scholarly journals Rapid and inexpensive fabrication of polymeric microfluidic devices via toner transfer masking

Lab on a Chip ◽  
2009 ◽  
Vol 9 (8) ◽  
pp. 1119 ◽  
Author(s):  
Christopher J. Easley ◽  
Richard K. P. Benninger ◽  
Jesse H. Shaver ◽  
W. Steven Head ◽  
David W. Piston
Keyword(s):  
Microfluidic Devices ◽  
Polymeric Microfluidic

Design and Simulation of a Novel Check Valve Made by SU-8

2012 ◽  
Vol 479-481 ◽  
pp. 2271-2274
Author(s):  
Tai Guo ◽  
Cong Chun Zhang ◽  
Gui Fu Ding
Keyword(s):  
Maximum Stress ◽  
Check Valve ◽  
Lab On A Chip ◽  
Microfluidic Devices ◽  
Maximum Deflection ◽  
Functional Material ◽  
Membrane Layer ◽  
Mems Technology ◽  
Simulation Results ◽  
Polymeric Microfluidic

In this paper, we describe the design, simulation of a novel check valve suitable for potentially embedding in polymeric microfluidic devices such as micro-pumps. Using SU-8 as functional material, the check valve can be fabricated by MEMS technology, such as, UV-LIGA and electroforming. The check valve mainly consists of two structural layers: inlet layer and valve membrane layer. From simulation, the maximum deflection of check valve membrane is 116μm under pressure of 2000Pa, and the maximum stress is 18.1MPa. We consider the fit thickness of valve membrane is 20μm. Simulation results demonstrate that this novel check valve can be potentially integrated in many micro-pumps and other lab-on-a-chip systems.

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