Mechanical and chemical analysis of plasma and ultraviolet–ozone surface treatments for thermal bonding of polymeric microfluidic devices

Lab on a Chip ◽  
2007 ◽  
Vol 7 (7) ◽  
pp. 876-882 ◽  
Author(s):  
Arpita Bhattacharyya ◽  
Catherine M. Klapperich
Keyword(s):  
Chemical Analysis ◽  
Microfluidic Devices ◽  
Surface Treatments ◽  
Thermal Bonding ◽  
Polymeric Microfluidic

Design Techniques for Microfluidic Devices Implementation Applicable to Chemical Analysis Systems

2019 ◽  
pp. 195-222 ◽  
Author(s):  
Reinaldo Lucas dos Santos Rosa ◽  
Antonio Carlos Seabra
Keyword(s):  
Chemical Analysis ◽  
Solid Phase ◽  
Microfluidic Devices ◽  
Water Quality Monitoring ◽  
Analysis Process ◽  
Micro Total Analysis Systems ◽  
Total Analysis ◽  
On Chip ◽  
Separation Cell ◽  
High Level

This chapter provides a guide for microfluidic devices development and optimization focused on chemical analysis applications, which includes medicine, biology, chemistry, and environmental monitoring, showing high-level performance associated with a specific functionality. Examples are chemical analysis, solid phase extraction, chromatography, immunoassay analysis, protein and DNA separation, cell sorting and manipulation, cellular biology, and mass spectrometry. In this chapter, most information is related to microfluidic devices design and fabrication used to perform several steps concerning chemical analysis, process preparation of reagents, samples reaction and detection, regarding water quality monitoring. These steps are especially relevant to lab-on-chip (LOC) and micro-total-analysis-systems (μTAS). μTAS devices are developed in order to simplify analytical chemist work, incorporating several analytical procedures into flow systems. In the case of miniaturized devices, the analysis time is reduced, and small volumes (nL) can be used.

Gas-assisted thermal bonding of thermoplastics for the fabrication of microfluidic devices

2019 ◽  
Vol 25 (10) ◽  
pp. 3923-3932 ◽  
Author(s):  
S. R. Mahmoodi ◽  
P.-K. Sun ◽  
M. Mayer ◽  
R. S. Besser
Keyword(s):  
Microfluidic Devices ◽  
Thermal Bonding

Manufacturing Issues and Considerations in Thermal Bonding of Polymer Based Lab-on-a-Chip

2009 ◽  
Vol 74 ◽  
pp. 175-178
Author(s):  
Yu Xin Koh ◽  
Sum Huan Ng ◽  
Khin Thet May ◽  
Cong Zhi Chan ◽  
Zhi Ping Wang
Keyword(s):  
Bond Strength ◽  
Surface Topography ◽  
Lab On A Chip ◽  
Microfluidic Devices ◽  
Thermal Bonding ◽  
Bonding Pressure ◽  
Bonding Quality ◽  
Viscoelastic Effect ◽  
Common Technique

The sealing of microchannels is a key step in the fabrication of microfluidic devices and thermal bonding is a common technique used. Here, major manufacturing issues and considerations in thermal bonding are investigated, including bonding quality and microchannel deformations. Flatness of substrate is extremely crucial to the uniformity in bonding. While increased bonding pressure helps to overcome problems related to surface topography and to enhance bond strength, its significant impact on geometrical changes of microchannel due to viscoelastic effect should also be taken into consideration.

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