Thermally induced stresses resulting from coefficient of thermal expansion differentials between an LED sub-mount material and various mounting substrates

2007 ◽  
Author(s):  
Charles DeMilo ◽  
Corey Bergad ◽  
Ronald Forni ◽  
Thomas Brukilacchio
Keyword(s):  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Thermally Induced ◽  
Induced Stresses

Application of an Epoxy Cap in a Flip-Chip Package Design

1989 ◽  
Vol 111 (1) ◽  
pp. 16-20 ◽  
Author(s):  
E. Suhir
Keyword(s):  
Thermal Expansion ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Preliminary Test ◽  
Elastic Stability ◽  
Thermally Induced ◽  
Package Design ◽  
Silicone Gels ◽  
Low Modulus ◽  
Supporting Frame

In order to combine the merits of epoxies, which provide good environmental and mechanical protection, and the merits of silicone gels, resulting in low stresses, one can use an encapsulation version, where a low modulus gel is utilized as a major encapsulant, while epoxy is applied as a protecting cap. Such an encapsulation version is currently under consideration, parallel with a metal cap version, for the Advanced VLSI package design which is being developed at AT&T Bell Laboratories. We recommend that the coefficient of thermal expansion for the epoxy be somewhat smaller than the coefficient of thermal expansion for the supporting frame. In this case the thermally induced displacements would result in a desirable tightness in the cap/frame interface. This paper is aimed at the assessment of stresses, which could arise in the supporting frame and in the epoxy cap at low temperatures. Also, the elastic stability of the cap, subjected to compression, is evaluated. The calculations were executed for the Advanced VLSI package design and for a Solder Test Vehicle (STV), which is currently used to obtain preliminary information regarding the performance of the candidate encapsulants. It is concluded that in order to avoid buckling of the cap, the latter should not be thinner than 15 mils (0.40 mm) in the case of VLSI package design and than 17.5 mils (0.45 mm) in the case of STV. At the same time, the thickness of the cap should not be greater than necessary, both for smaller stresses in the cap and for sufficient undercap space, required for wirebond encapsulation. The obtained formulas enable one to evaluate the actual and the buckling stresses. Preliminary test data, obtained by using STV samples, confirmed the feasibility of the application of an epoxy cap in a flip-chip package design.

Thermal Expansion and Relaxation of W-Cu Multilayers

1992 ◽  
Vol 286 ◽  
Author(s):  
Wen-C. Chiang ◽  
Soo-Kil Kim ◽  
David V. Baxter
Keyword(s):  
Thermal Expansion ◽  
High Temperature ◽  
Heat Treatments ◽  
Irreversible Change ◽  
Thermally Induced ◽  
Temperature Range ◽  
Thermal Expansion Coefficients ◽  
Induced Stresses ◽  
Expansion Coefficients ◽  
Bulk Behavior

ABSTRACTWe have studied the structure of W-Cu multilayers with modulation wavelengths between 65 and 110 xsÅ over the temperature range 25-400° C. Using a high temperature diffractometer stage specifically designed for low angle work, thermal expansion coefficients were measured and found to be marginally greater than would be expected from bulk behavior even when interaction with the substrate is taken into account. Upon annealing at temperature as low as 180° C, increased intensity of the low angle superlattice peaks is observed. Heat treatments above 180° C result in an irreversible change in the multilayer associated with the migration of Cu atoms to cracks produced by thermally induced stresses.

Tailorable Thermal Expansion of Lightweight and Robust Dual-Constituent Triangular Lattice Material

2017 ◽  
Vol 84 (10) ◽  
Author(s):  
Kai Wei ◽  
Yong Peng ◽  
Weibin Wen ◽  
Yongmao Pei ◽  
Daining Fang
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Triangular Lattice ◽  
Coefficient Of Thermal Expansion ◽  
Bulk Material ◽  
Structure Design ◽  
Thermally Induced ◽  
Precise Control ◽  
Wide Range ◽  
Lattice Material

Current studies on tailoring the coefficient of thermal expansion (CTE) of materials focused on either exploring the composition of the bulk material or the design of composites which strongly depend on a few negative CTE materials or fibers. In this work, an approach to achieve a wide range of tailorable CTEs through a dual-constituent triangular lattice material is studied. Theoretical analyses explicitly reveal that through rational arrangement of commonly available positive CTE constituents, tailorable CTEs, including negative, zero, and large positive CTEs can be easily achieved. We experimentally demonstrate this approach through CTE measurements of the specimens, which were exclusively fabricated from common alloys. The triangular lattice material fabricated from positive CTE alloys is shown to yield large positive (41.6 ppm/°C), near-zero (1.9 ppm/°C), and negative (−32.9 ppm/°C) CTEs. An analysis of the collapse strength and stiffness ensures the robust mechanical properties. Moreover, hierarchal triangular lattice material is proposed, and with certain constituents, wide range of tailorable CTEs can be easily obtained through the rationally hierarchal structure design. The triangular lattice material presented here integrates tailorable CTEs, lightweight characteristic, and robust mechanical properties, and is very promising for engineering applications where precise control of thermally induced expansion is in urgently needed.

Morphologies of Nonadherent Al2O3 and Matching Substrate Surfaces

1972 ◽  
Vol 30 ◽  
pp. 524-525
Author(s):  
C. S. Giggins ◽  
J. K. Tien ◽  
B. H. Kear ◽  
F. S. Pettit
Keyword(s):  
Electron Microscopy ◽  
Oxide Scale ◽  
Oxidation Resistance ◽  
Substrate Surface ◽  
Morphological Features ◽  
Thermally Induced ◽  
Oxide Spallation ◽  
Oxidation Resistant ◽  
Induced Stresses ◽  
Substrate Surfaces

The performance of most oxidation resistant alloys and coatings is markedly improved if the oxide scale strongly adheres to the substrate surface. Consequently, in order to develop alloys and coatings with improved oxidation resistance, it has become necessary to determine the conditions that lead to spallation of oxides from the surfaces of alloys. In what follows, the morphological features of nonadherent Al2O3, and the substrate surfaces from which the Al2O3 has spalled, are presented and related to oxide spallation.The Al2O3, scales were developed by oxidizing Fe-25Cr-4Al (w/o) and Ni-rich Ni3 (Al,Ta) alloys in air at 1200°C. These scales spalled from their substrates upon cooling as a result of thermally induced stresses. The scales and the alloy substrate surfaces were then examined by scanning and replication electron microscopy.The Al2O3, scales from the Fe-Cr-Al contained filamentary protrusions at the oxide-gas interface, Fig. 1(a). In addition, nodules of oxide have been developed such that cavities were formed between the oxide and the substrate, Fig. 1(a).

NILO ALLOY 36

Alloy Digest ◽  
1987 ◽  
Vol 36 (8) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Constant Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance ◽  
Iron Nickel

Abstract NILO alloy 36 is a binary iron-nickel alloy having a very low and essentially constant coefficient of thermal expansion at atmospheric temperatures. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Fe-79. Producer or source: Inco Alloys International Inc..

UNISPAN LR35

Alloy Digest ◽  
1971 ◽  
Vol 20 (1) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance ◽  
Operational Level

Abstract UNISPAN LR35 offers the lowest coefficient of thermal expansion of any alloy now available. It is a low residual modification of UNISPAN 36 for fully achieving the demanding operational level of precision equipment. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and surface treatment. Filing Code: Fe-46. Producer or source: Cyclops Corporation.

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