A high aspect ratio Si-fin FinFET fabricated with 193nm scanner photolithography and thermal oxide hard mask etching techniques

Author(s):  
Wen-Shiang Liao
2010 ◽  
Vol 518 (21) ◽  
pp. 6076-6079 ◽  
Author(s):  
Ching-Yuan Ho ◽  
X.J. Lin ◽  
H.R. Chien ◽  
Chenhsin Lien

2000 ◽  
Vol 611 ◽  
Author(s):  
Chien Yu ◽  
Rich Wise ◽  
Anthony Domenicucci

ABSTRACTA highly selective nitride etch was developed for gate stack spacer process in advanced memory programs. Based on methyl fluoride chemistry with better than 8:1 selectivity of nitride:oxide, this process exhibits minimal erosion to the underlying RTO thermal oxide for consistent diffusion ion-implant control. As the groundrule changed to 0.175um and below, a two-step etch scheme was employed to maintain the profile control in high-aspect-ratio structures. The stability and repeatability of the process is demonstrated in the SPC chart of the post etch FTA site measurement.


MRS Advances ◽  
2016 ◽  
Vol 1 (13) ◽  
pp. 875-880 ◽  
Author(s):  
Kevin Guilloy ◽  
Nicolas Pauc ◽  
Alban Gassenq ◽  
Vincent Calvo

ABSTRACTWe present here a reactive ion etching recipe to fabricate germanium nanowires. We used a combination of Cl2, N2 and O2 and studied the influence of both the gas pressure and the O2 mass flow on the morphology of the nanowires. 5 µm long nanowires with an aspect ratio of 20 are demonstrated with smooth surfaces and a tapering below 20 nm/µm. We also show that both gold and aluminum can be used as hard mask; the latter achieving a selectivity with germanium above 100.


Author(s):  
Bing-Lung Yu ◽  
YuKai Huang ◽  
Shing-Ann Luo ◽  
Yi-Sheng Cheng ◽  
Yung-Tai Hung ◽  
...  

2014 ◽  
Vol 25 (35) ◽  
pp. 355301 ◽  
Author(s):  
Md Nazmul Hossain ◽  
John Justice ◽  
Pierre Lovera ◽  
Brendan McCarthy ◽  
Alan O’Riordan ◽  
...  

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