Guidelines for reliability testing of microelectromechanical systems in military applications

2006 ◽  
Author(s):  
Robert Mason ◽  
Larry Gintert ◽  
Marc Rippen ◽  
Don Skelton ◽  
James Zunino ◽  
...  
Keyword(s):  
Microelectromechanical Systems ◽  
Reliability Testing ◽  
Military Applications

Development of Reliability Test Guidelines for Microelectromechanical Systems in Military Applications

2007 ◽  
Author(s):  
Robert Mason ◽  
Michael Miller ◽  
James Kannard ◽  
Mark Singleton ◽  
Don Skelton ◽  
...  
Keyword(s):  
Microelectromechanical Systems ◽  
Reliability Test ◽  
Military Applications

Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective

2003 ◽  
Vol 125 (4) ◽  
pp. 816-823 ◽  
Author(s):  
Srinivas A. Tadigadapa ◽  
Nader Najafi
Keyword(s):  
Microelectromechanical Systems ◽  
Process Development ◽  
Reliability Testing ◽  
Mems Devices ◽  
Manufacturing Strategy ◽  
Cad Tools ◽  
Fragile State ◽  
Mems Packaging ◽  
Overall Performance

This paper presents a discussion of some of the major issues that need to be considered for the successful commercialization of MEMS products. The diversity of MEMS devices and historical reasons have led to scattered developments in the MEMS manufacturing infrastructure. A good manufacturing strategy must include the complete device plan including package as part of the design and process development of the device. In spite of rapid advances in the field of MEMS there are daunting challenges that lie in the areas of MEMS packaging, and reliability testing. CAD tools for MEMS are starting to get more mature but are still limited in their overall performance. MEMS manufacturing is currently at a fragile state of evolution. In spite of all the wonderful possibilities, very few MEMS devices have been commercialized. In our opinion, the magnitude of the difficulty of fabricating MEMS devices at the manufacturing level is highly underestimated by both the current and emerging MEMS communities. A synopsis of MEMS manufacturing issues is presented here.

Prototyping With SUMMiT™ Technology, Sandia’s Ultra-Planar Multi-Level MEMS Technology

2002 ◽  
Author(s):  
Ellen Shepherd
Keyword(s):  
Chemical Mechanical Polishing ◽  
Microelectromechanical Systems ◽  
State Of The Art ◽  
Technology Process ◽  
Military Applications ◽  
Mems Technology ◽  
Volume Production ◽  
Visualization Tools ◽  
Multi Level ◽  
And Training

Sandia National Laboratories, a world leader in the development and application of surface micromachining technology, offers its ultra-planar, multi-level SUMMiT™ technology for prototyping devices for microelectromechanical systems (MEMS). By incorporating advanced fabrication processes, such as chemical mechanical polishing and five levels of polysilicon (four mechanical and one ground), in a well-characterized, base-lined technology, the SUMMiT™ (Sandia’s Ultra-planar, Multi-level, MEMS Technology) process offers a virtually limitless range of microelectromechanical systems that can be fabricated for both commercial and military applications [1]. Sandia’s SUMMiT™ process, licensed to industry for volume production, is available from Sandia for agile prototyping through the SAMPLES™ Program. The SAMPLES™ (Sandia’s Agile MEMS Prototyping, Layout tools, Education, and Services) Program, offers participants the opportunity to access state-of-the-art MEMS technology to prototype an idea and produce hardware that can be used to sell a concept. The four components of the SAMPLES™ Program provide: • Education and training on Sandia’s SUMMiT™ designand visualization tools, fabrication process, and reliability issues; • Layout tools for design including visualization and checking of design rules; • Fabrication in the 5-level SUMMiT™ technology; • Post-fabrication services such as release, packaging, reliability characterization, and failure analysis. This paper discusses the SUMMiT™ technology, its capabilities, and the infrastructure for prototyping within the technology through the SAMPLES™ Program.

A System for Electromechanical Reliability Testing of MEMS Devices

2006 ◽  
Author(s):  
Stefan Spinner ◽  
Michael Doelle ◽  
Patrick Ruther ◽  
Oliver Paul ◽  
Ilia Polian ◽  
...  
Keyword(s):  
Mechanical Stress ◽  
Microelectromechanical Systems ◽  
Automated Analysis ◽  
Dynamic Loads ◽  
Reliability Testing ◽  
Mems Devices ◽  
Single Chip ◽  
Wafer Level ◽  
Optical Inspection

Abstract This paper reports on a setup and a method that enables automated analysis of mechanical stress impact on microelectromechanical systems (MEMS). In this setup both electrical and optical inspection are available. Reliability testing is possible on a single chip as well as on the wafer level. Mechanical stress is applied to the tested structure with programmable static forces up to 3.6 N and dynamic loads at frequencies up to 20 Hz. The applications of the presented system include the postmanufacturing test, characterization and stress screens as well as reliability studies. We report preliminary results of long-term reliability testing obtained for a CMOS-based stress sensor.

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

Pengaruh Motivasi Kerja Dan Lingkungan Kerja Terhadap Kinerja Karyawan Bappeda Kabupaten Wonosobo Tahun 2013

2017 ◽  
Vol 1 (2) ◽  
pp. 135-147
Author(s):  
Ary Sutrischastini ◽  
Ratna Setyani
Keyword(s):  
Work Environment ◽  
Work Motivation ◽  
Employee Performance ◽  
Linear Regression Analysis ◽  
Test Validity ◽  
Multiple Linear Regression Analysis ◽  
Reliability Testing ◽  
Evaluation Influence ◽  
Environment Variables ◽  
Research Goal

This research goal is to identification and evaluation influence of work motivation and work environment to employee’s performance in BAPPEDA Kabupaten Wonosobo. The object of this research is 37 employees of Badan Perencanaan Pembangunan Kabupaten Wonosobo. And the location of this research is at Badan Perencanaan Pembangunan Kabupaten Wonosobo. The analysis used is test validity, reliability testing, and test the hypothesis, with the help of the computer program SPSS version 17, using multiple linear regression analysis. Based on calculations of data and analysis used, the regression equation is obtained: Y = 11.733 + 0.320 X1 +0.334 X2 + ε, by using the equation regression analytical method can conclude that (X1) take effect positively against employees performance. With t value in amount of 2,219 (bigger than t in table in amount of 1,690) and significance value in amount of 0,33. By applying significance limited value in amount of 0,05, it means, hypothesis that claim if work motivation take effect against employees performance can be accepted. There is a positive and significant correlation between work environment variables (X2) against employees. With t value in amount of 2,219 (bigger than t in table in amount of 1,690) and significance value in amount of 0,33 (smaller than 0,5). Simultaneously, work motivation take effect positively and significantly against employees performance with the F value in amount of 11,562 (bigger than 0.05), then obtained significance value 0.000. It can be concluded that the work motivation and work environment has a positive and significant influence on employee performance in BAPPEDA Kabupaten Wonosobo.

Charge Trapping and Degradation Properties of PZT Thin Films for MEMS

1996 ◽  
Vol 444 ◽  
Author(s):  
Hyeon-Seag Kim ◽  
D. L. Polla ◽  
S. A. Campbell
Keyword(s):  
Thin Films ◽  
Loss Factor ◽  
High Field ◽  
Microelectromechanical Systems ◽  
Charge Trapping ◽  
Metal Organic ◽  
Electrical Reliability ◽  
Silicon Based ◽  
Degradation Properties ◽  
Organic Decomposition

AbstractThe electrical reliability properties of PZT (54/46) thin films have been measured for the purpose of integrating this material with silicon-based microelectromechanical systems. Ferroelectric thin films of PZT were prepared by metal organic decomposition. The charge trapping and degradation properties of these thin films were studied through device characteristics such as hysteresis loop, leakage current, fatigue, dielectric constant, capacitancevoltage, and loss factor measurements. Several unique experimental results have been found. Different degradation processes were verified through fatigue (bipolar stress), low and high charge injection (unipolar stress), and high field stressing (unipolar stress).

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