Shape measurement of solder bumps by shape-from-focus using varifocal mirror

2005 ◽  
Author(s):  
Akira Ishii ◽  
Jun Mitsudo
Keyword(s):  
Shape Measurement ◽  
Solder Bumps ◽  
Shape From Focus

Shape Measurement of Solder Bumps by Shape-from-Focus Using Varifocal Mirror

2006 ◽  
Vol 18 (6) ◽  
pp. 722-727
Author(s):  
Jun Mitsudo ◽  
◽  
Akira Ishii
Keyword(s):  
Copper Alloy ◽  
Solder Bump ◽  
Optical Axis ◽  
Focal Point ◽  
Shape Measurement ◽  
Depth Range ◽  
Focal Points ◽  
Depth Data ◽  
Solder Bumps ◽  
Shape From Focus

We measured solder bumps on an LSI package board presented for inspection based on the shape from focus. We used a copper-alloy mirror deformed by a piezoelectric actuator as a varifocal mirror to build a motionless yet fast focusing mechanism. The varifocal mirror was at the image focal point of the image-taking lens so that lateral magnification was constant during focusing and orthographic projection was established. A focused plane was shifted along the optical axis with a precision of 1.4μm in a depth range of 1.5mm by driving the varifocal mirror. A magnification of 1.97 was maintained during focusing. Evaluating the curvature of field and removing its effect from the depth data reduced errors. The shape of 208 solder bumps 260-μm high spaced 500μm on the board was measured. The 10mm×10mm board was segmented into partly overlapping 3×4 sections. We captured 101 images in each section with a high-resolution camera at different focal points at 15-μm intervals. The shape of almost the entire upper-hemisphere of a solder bump could be measured. Error in measuring bump heights was less than 12μm.

scholarly journals A Small and High-Speed Driving Mechanism for 3D Shape Measurement in Monocular Endoscopy

Sensors ◽  
2021 ◽  
Vol 21 (14) ◽  
pp. 4887
Author(s):  
Yoshikazu Nakajima ◽  
Nobuyuki Tanigaki ◽  
Takaaki Sugino ◽  
Toshihiro Kawase ◽  
Shinya Onogi
Keyword(s):  
High Speed ◽  
Image Sensor ◽  
Shape Reconstruction ◽  
Shape Measurement ◽  
Driving Mechanism ◽  
Reconstruction Algorithms ◽  
3D Shape ◽  
3D Shape Measurement ◽  
Shape Acquisition ◽  
Shape From Focus

Three-dimensional (3D) shape acquisition has been widely introduced to enrich quantitative analysis with the combination of object shape and texture, for example, surface roughness evaluation in industry and gastrointestinal endoscopy in medicine. Shape from focus is a promising technique to measure substance surfaces in 3D space because no occlusion problem appears in principle, as does with stereo shape measurement, which is another commonly used option. We have been developing endoscopic shape measurement devices and shape reconstruction algorithms. In this paper, we propose a mechanism for driving an image sensor reciprocated for the shape from focus of 3D shape measurement in monocular endoscopy. It uses a stepping motor and a planar-end cam, which transforms the motor rotation to imaging sensor reciprocation, to implement the shape from focus of 3D shape measurement in endoscopy. We test and discuss the device in terms of its driving accuracy and application feasibility for endoscopic 3D shape measurement.

Shape Measurement of Canned Food to Verify Hermetic Sealing

2012 ◽  
Vol E95.C (10) ◽  
pp. 1662-1665
Author(s):  
Ryosuke SUGA ◽  
Shigenori TAKANO ◽  
Takenori YASUZUMI ◽  
Taichi IJUIN ◽  
Tetsuya TAKATOMI ◽  
...  
Keyword(s):  
Shape Measurement ◽  
Canned Food ◽  
Hermetic Sealing

The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

2002 ◽  
Author(s):  
George F. Gaut
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Solder Bump ◽  
Selective Area ◽  
Fill Material ◽  
Solder Bumps ◽  
Time Required

Abstract Access to the solder bump and under-fill material of flip-chip devices has presented a new problem for failure analysts. The under-fill and solder bumps have also added a new source for failure causes. A new tool has become available that can reduce the time required to analyze this area of a flip-chip package. By using precision selective area milling it is possible to remove material (die or PCB) that will allow other tools to expose the source of the failure.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

Digital holography with a set of two close wavelengths for height measurement of solder bumps

2020 ◽  
Vol 59 (SO) ◽  
pp. SOOE03
Author(s):  
Hiroyuki Ishigaki ◽  
Takahiro Mamiya ◽  
Yoshio Hayasaki
Keyword(s):  
Digital Holography ◽  
Height Measurement ◽  
Solder Bumps
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