Fabrication and integration of micro-/nanoscale photonic devices and sensors for application-specific planar optical integrated circuit board

2006 ◽  
Author(s):  
El-Hang Lee ◽  
S. G. Lee ◽  
B. H. O ◽  
S. G. Park ◽  
K. H. Kim
Keyword(s):  
Integrated Circuit ◽  
Photonic Devices ◽  
Circuit Board ◽  
Application Specific ◽  
Optical Integrated Circuit

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

scholarly journals Simultaneous Voltage and Current Measurement Instrumentation Amplifier for ECG and PPG Monitoring

Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 679
Author(s):  
Jongpal Kim
Keyword(s):  
Integrated Circuit ◽  
Cardiovascular Health ◽  
Current Noise ◽  
Instrumentation Amplifier ◽  
Current Sensing ◽  
Application Specific Integrated Circuit ◽  
Time Division ◽  
Electrocardiogram Ecg ◽  
First Time ◽  
Application Specific

An instrumentation amplifier (IA) capable of sensing both voltage and current at the same time has been introduced and applied to electrocardiogram (ECG) and photoplethysmogram (PPG) measurements for cardiovascular health monitoring applications. The proposed IA can switch between the voltage and current sensing configurations in a time–division manner faster than the ECG and PPG bandwidths. The application-specific integrated circuit (ASIC) of the proposed circuit design was implemented using 180 nm CMOS fabrication technology. Input-referred voltage noise and current noise were measured as 3.9 µVrms and 172 pArms, respectively, and power consumption was measured as 34.9 µA. In the current sensing configuration, a current noise reduction technique is applied, which was confirmed to be a 25 times improvement over the previous version. Using a single IA, ECG and PPG can be monitored in the form of separated ECG and PPG signals. In addition, for the first time, a merged ECG/PPG signal is acquired, which has features of both ECG and PPG peaks.

Exotic Doping for Zno Thin Films: Possibility of Monolithic Optical Integrated Circuit

1999 ◽  
Vol 574 ◽  
Author(s):  
Norifumi Fujimura ◽  
Tamaki Shimura ◽  
Toshifumi Wakano ◽  
Atsushi Ashida ◽  
Taichiro Ito
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Nonlinear Optic ◽  
Integrated Circuit ◽  
Film Surface ◽  
Zno Thin Films ◽  
Process Window ◽  
Electro Optic ◽  
Film Substrate ◽  
Optical Integrated Circuit

AbstractWe propose the application of ZnO:X (X = Li, Mg, N, In, Al, Mn, Gd, Yb etc.) films for a monolithic Optical Integrated Circuit (OIC). Since ZnO exhibits excellent piezoelectric effect and has also electro-optic and nonlinear optic effects and the thin films are easily obtained, it has been studied as one of the important thin film wave guide materials especially for an acoustooptic device[1]. In terms of electro-optic and nonlinear optic effects, however, LiNbO3 or LiTaO3 is superior to ZnO. The most important issue of thin film waveguide using such ferroelectrics is optical losses at the film/substrate interface and the film surface, because the process window to control the surface morphology is very narrow due to their high deposition temperature. Since ZnO can be grown at extremely low temperature, the roughness at the surface and the interface is expected to be minimized. This is the absolute requirement especially for waveguide using a blue or ultraviolet laser. Recently, lasing at the wavelength of ultraviolet, ferroelectric and antiferromagnetic behaviors of ZnO doped with various exotic elements (exotic doping) have been reported. This paper discusses the OIC application of ZnO thin films doped with exotic elements.

CONCEPTS OF ELECTRONICALLY-CONTROLLED ELECTROMECHANICAL/MECHANOELECTRICAL STEER-, AUTODRIVE- AND AUTOABSORBABLE WHEELS FOR ENVIRONMENTALLY-FRIENDLY TRI-MODE SUPERCARS

1994 ◽  
Vol 04 (04) ◽  
pp. 501-516 ◽  
Author(s):  
BOGDAN T. FIJALKOWSKI ◽  
JAN W. KROSNICKI
Keyword(s):  
Direct Current ◽  
Integrated Circuit ◽  
Environmentally Friendly ◽  
Alternating Current ◽  
Switching Frequency ◽  
Neuro Fuzzy ◽  
Interior Permanent Magnet ◽  
Application Specific Integrated Circuit ◽  
Computer Processor ◽  
Application Specific

Concepts of the electronically-controlled electromechanical/mechanoelectrical Steer-, Autodrive- and Autoabsorbable Wheels (SA2W) with their brushless Alternating Current-to-Alternating Current (AC-AC), Alternating Current-to-Direct Current-Alternating Current (AC-DC-AC) and/or Direct Current-to-Alternating Current (DC-AC)/Alternating Current-to-Direct Current (AC-DC) macroelectronic converter commutator (macro-commutator) wheel-hub motors/generators with the Application Specific Integrated Matrixer (ASIM) macroelectronic converter commutators (ASIM macrocommutators) and Application Specific Integrated Circuit (ASIC) microelectronic Neuro-Fuzzy (NF) computer (processor) controllers (ASIC NF microcontrollers) for environmentally-friendly tri-mode supercars (advanced ultralight hybrids) have been conceived by the first author and designed by both authors with the Cracow University of Technology’s Automotive Mechatronics Research and Development (R&D) Team. These electromechanical/mechanoelectrical wheel-hub motors/generators, respectively, for instance, can be composed of the outer rotor with the Interior Permanent Magnet (IPM) poles and the inner stator that has the three-phase armature winding. The macroelectronic converter commutator establishes the AC-AC cycloconverter, AC-DC rectifier-DC-AC inverter and/or DC-AC inverter/AC-DC rectifier ASIM macrocommutator. The microelectronic NF computer (processor) controller establishes the ASIC microcomputer-based NF microcontroller. By adopting continuous semiconductor bipolar electrical valves in the high-power ASIM, it has been able to increase the commutation (switching) frequency and reduce harmonic losses of the electromechanical/mechanoelectrical wheel-hub motors/generators, respectively.

Hardware Trojan Detection Technique Using Frequency Characteristic Analysis of Path Delay in Application Specific Integrated Circuits

2020 ◽  
Vol 10 (2) ◽  
pp. 36-43
Author(s):  
Ha Thai Tran ◽  
Phuc Van Hoang ◽  
Tuan Ngoc Do ◽  
Duong Hai Nguyen
Keyword(s):  
Integrated Circuits ◽  
Frequency Characteristic ◽  
Integrated Circuit ◽  
Hardware Security ◽  
Hardware Trojan ◽  
Path Delay ◽  
Characteristic Analysis ◽  
Hardware Trojan Detection ◽  
Ic Manufacturing ◽  
Application Specific

 Abstract—  Since the last decade, hardware Trojan (HT) have become a serious problem for hardware security because of outsourcing trends in Integrated Circuit (IC) manufacturing. As the fabrication of IC is becoming very complex and costly, more and more chipmakers outsource their designs or parts of the fabrication process. This trend opens a loophole in hardware security, as an untrusted company could perform malicious modifications to the golden circuit at design or fabrication stages. Therefore, assessing risks and proposing solutions to detect HT are very important tasks. This paper presents a technique for detecting HT using frequency characteristic analysis of path delay. The results show that measuring with the frequency step of 0.016 MHz can detect a HT having the size of 0.2% of the original design.Tóm tắt— Từ thập niên 2010, Trojan phần cứng (HT) đã trở thành một vấn đề nghiêm trọng đối với bảo mật phần cứng, do xu hướng thuê sản xuất mạch tích hợp (Integrated Circuit - IC). Khi quá trình chế tạo IC trở nên phức tạp và tốn kém, ngày càng nhiều nhà sản xuất chip lựa chọn phương án thuê lại một phần hoặc toàn bộ thiết kế IC. Xu hướng này tạo ra lỗ hổng trong bảo mật phần cứng, vì một công ty không đáng tin cậy có thể thực hiện các sửa đổi độc hại vào trong mạch nguyên bản ở giai đoạn thiết kế hoặc chế tạo. Do đó, đánh giá rủi ro và đề xuất giải pháp phát hiện HT là một trong những nhiệm vụ hết sức quan trọng. Bài báo này trình bày một giải pháp phát hiện HT sử dụng phân tích đặc tính tần số của độ trễ đường truyền tín hiệu. Kết quả cho thấy, thực hiện khảo sát với bước tần số 0,016 MHz có thể phát hiện được HT có kích thước 0,2% so với thiết kế ban đầu. 

Design and Test of a MEMS Accelerometer Array for Submarine Landslide Displacement Monitoring

2021 ◽  
Vol 55 (1) ◽  
pp. 5-16
Author(s):  
Yongqiang Ge ◽  
Jiawang Chen ◽  
Chen Cao ◽  
Jiamin He ◽  
Yan Sheng ◽  
...  
Keyword(s):  
Gas Hydrate ◽  
Integrated Circuit ◽  
Slope Failure ◽  
Circuit Board ◽  
Measurement Unit ◽  
Physical Model Test ◽  
Submarine Landslides ◽  
Micro Electro Mechanical Systems ◽  
Mems Accelerometer ◽  
The Difference

AbstractSubmarine landslides in gas hydrate areas are a significant geo-hazard that can cause considerable damage. The processes and mechanism of submarine landslides caused by gas hydrate dissociation are not clearly understood. Therefore, we designed a micro-electro-mechanical systems (MEMS) accelerometer array to study and monitor the deep displacement of submarine landslides. The MEMS accelerometer array consists of several gravity acceleration-sensing units that are protected and positioned using a flexible circuit board and elastic steel tape, such that all the units are connected to an Inter-Integrated Circuit (IIC) communication bus. By sensing the three-axis tilt angles, the direction and magnitude of the displacement for a measurement unit can be calculated; then, the overall displacement of the array is calculated as the difference in the displacements from the initial values. To ensure the accuracy of the tilt angle and displacement calculation, the calibration and verification test of the single MEMS sensor and sensor array is conducted. The MEMS accelerometer array is verified with respect to its principle and arrangement by a laboratory physical model test, and the initial experimentation demonstrated the capacities of the monitoring system for collecting real-time and in-situ information about the dynamic process and propagation of slope failure.

High-Performance Reconfigurable Computing

2019 ◽  
pp. 731-744
Author(s):  
Mário Pereira Vestias
Keyword(s):  
Power Consumption ◽  
Integrated Circuit ◽  
Reconfigurable Computing ◽  
High Performance ◽  
General Purpose ◽  
Reconfigurable Hardware ◽  
Coarse Grained ◽  
Lower Power ◽  
Fine Grained ◽  
Application Specific

High-performance reconfigurable computing systems integrate reconfigurable technology in the computing architecture to improve performance. Besides performance, reconfigurable hardware devices also achieve lower power consumption compared to general-purpose processors. Better performance and lower power consumption could be achieved using application-specific integrated circuit (ASIC) technology. However, ASICs are not reconfigurable, turning them application specific. Reconfigurable logic becomes a major advantage when hardware flexibility permits to speed up whatever the application with the same hardware module. The first and most common devices utilized for reconfigurable computing are fine-grained FPGAs with a large hardware flexibility. To reduce the performance and area overhead associated with the reconfigurability, coarse-grained reconfigurable solutions has been proposed as a way to achieve better performance and lower power consumption. In this chapter, the authors provide a description of reconfigurable hardware for high-performance computing.

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