Utilizing a TII aspherical measurement machine in a computer controlled polishing process

2005 ◽  
Author(s):  
E. Pitschke ◽  
M. Schinhaerl ◽  
P. Sperber ◽  
R. Rascher
Keyword(s):  
Polishing Process ◽  
Computer Controlled

Development of a computer-controlled polishing process for x-ray optics

2009 ◽  
Author(s):  
Gufran S. Khan ◽  
Mikhail Gubarev ◽  
William Arnold ◽  
Brian Ramsey
Keyword(s):  
Polishing Process ◽  
Ray Optics ◽  
X Ray ◽  
Computer Controlled

An Investigation of Factors Affecting and Optimizing Material Removal Rate in Computer Controlled Ultra-Precision Polishing

2014 ◽  
Vol 625 ◽  
pp. 446-452
Author(s):  
Lai Ting Ho ◽  
Chi Fai Cheung ◽  
Liam Blunt ◽  
Sheng Yue Zeng
Keyword(s):  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Orthopedic Implants ◽  
Polishing Process ◽  
Factors Affecting ◽  
Ultra Precision ◽  
Computer Controlled ◽  
The Impact

There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.

Optimizing Computer Controlled-Polishing of Flat Surfaces

2014 ◽  
Author(s):  
Peiman Mosaddegh ◽  
Rasool Koosha ◽  
Alireza Fadaei Tehrani
Keyword(s):  
Surface Roughness ◽  
Tool Path ◽  
Optimization Method ◽  
New Method ◽  
Initial Surface ◽  
Cnc Machine ◽  
Polishing Process ◽  
Flat Surfaces ◽  
Flat Lens ◽  
Computer Controlled

The aim of this study is to optimize the Computer Controlled Polishing (CCP) of flat surfaces based on discretization of tool path. First, a new method has been developed to simulate the polishing Process. This method capable of expanding any tool path such as spiral, raster or even random over the surface, meaning that it has the capacity of simulating polishing process under different tool path strategies. Second, a numerical optimization method is applied to optimize the dwell time distribution over the defined tool path. The new method developed in this study was conducted to operate polishing process of a flat lens with 128 mm in diameter and initial surface roughness of 3.975 μm for PV and 987 nm for rms using a 3-axis CNC machine. After two passes of polishing, the final surface roughness reduced to 784 nm for PV and 190 nm for rms which shows around 80 percent reduction in surface roughness for PV and rms.

scholarly journals Edge Control in the Computer-Controlled Optical Surface

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1154
Author(s):  
Lianmin Yin ◽  
Hao Hu ◽  
Chaoliang Guan ◽  
Yifan Dai ◽  
Zelong Li
Keyword(s):  
Edge Effect ◽  
Single Crystal Silicon ◽  
Pressure Change ◽  
Silicon Sample ◽  
Optical Surface ◽  
Polishing Process ◽  
Crystal Silicon ◽  
Application Range ◽  
Fundamental Causes ◽  
Computer Controlled

The computer-controlled optical surface (CCOS) can process good optical surfaces, but its edge effect greatly affects its development and application range. In this paper, based on the two fundamental causes of the CCOS’s edge effect—namely the nonlinear variation of edge pressure and the unreachable edge removal—a combined polishing method of double-rotor polishing and spin-polishing is proposed. The model of the combined polishing method is established and theoretically analyzed. Combined with the advantages of double-rotor polishing and spin-polishing, the combined polishing process can achieve full-aperture machining without pressure change. Finally, the single-crystal silicon sample with a diameter of 100 mm is polished by the combined polishing process. The results show that, compared with the traditional CCOS polishing, the residual error of the sample after the combined polishing process is more convergent, and the edge effect is effectively controlled.

Modeling the computer-controlled polishing process

1983 ◽  
Vol 22 (15) ◽  
pp. 2245 ◽  
Author(s):  
Robert A. Jones
Keyword(s):  
Polishing Process ◽  
Computer Controlled
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