Full-field time domain optical molecular imaging system

Author(s):  
David J. Hall ◽  
David R. Vera ◽  
Robert F. Mattrey
Author(s):  
Jie Tian ◽  
Yu An ◽  
Kun Wang ◽  
Peng Zhang ◽  
Yuan Gao ◽  
...  

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.


2006 ◽  
Author(s):  
Dirk J. Faber ◽  
Mirjam E. J. van Velthoven ◽  
Martijn de Bruin ◽  
Maurice C. G. Aalders ◽  
Frank D. Verbraak ◽  
...  

2012 ◽  
Vol 19 (28) ◽  
pp. 4731-4741 ◽  
Author(s):  
E. Lacivita ◽  
M. Leopoldo ◽  
F. Berardi ◽  
N. A. Colabufo ◽  
R. Perrone

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