In‐Situ Mapping and Modeling Verification of Thermomechanical Deformation in Underfilled Flip‐Chip Packaging Using Moiré Interferometry

1996 ◽  
Vol 445 ◽  
Author(s):  
Xiang Dai ◽  
Connie Kim ◽  
Ralf Willecke ◽  
Paul S. Ho
Keyword(s):  
Flip Chip ◽  
Thermal Loading ◽  
Deformation Monitoring ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Fringe Analysis ◽  
Element Analysis ◽  
Solder Bumps ◽  
Thermomechanical Deformation

AbstractAn experimental technique of environmental moiré interferometry has been developed for in‐situ monitoring and analysis of thermomechanical deformation of microelectronics packages subjected to thermal loading under a controlled atmosphere. Coupled with fractional fringe analysis and digital image processing, the environmental moiré interferometry technique achieves accurate and realistic deformation monitoring with high sensitivity and excellent spatial resolution. It has been applied to investigate the thermomechanical deformations induced by thermal loading in an underfilled flip‐chip‐on‐board packaging. The effects of temperature change in the range of 102 °C to 22 °C are analyzed for underfill and solder bumps. In addition, shear deformation and shear strains across the solder bumps are determined as a function of temperature. The experimental results are compared with the results of a finite element analysis for modeling verification. Good agreement between the modeling results and experimental measurements has been found in the overall displacement fields. Through this study, the role of underfill in the thermomechanical deformation of the underfilled flip‐chip package is determined.

Spatial-carrier phase shifting method of fringe analysis for moiré interferometry

1993 ◽  
Vol 28 (2) ◽  
pp. 79-88 ◽  
Author(s):  
C Y Poon ◽  
M Kujawinska ◽  
C Ruiz
Keyword(s):  
Carrier Phase ◽  
Field Measurements ◽  
Displacement Function ◽  
Moiré Interferometry ◽  
Phase Shifting ◽  
Moire Interferometry ◽  
Fringe Analysis ◽  
Automated Method ◽  
Phase Shifting Method ◽  
Carrier Phase Shifting

The theory of an automated fringe pattern analysis using the spatial-carrier phase shifting method for moiré interferometry is presented. The automated method is shown to provide a fast and accurate strain measurement over the whole field. Measurements on a brass specimen and a tapered laminated composite specimen are shown to highlight the efficiency and the capability of this technique for moiré interferometry. The filtering technique used to remove noise from the required displacement function is also presented.

Fourier transform method of fringe analysis for moire interferometry

1999 ◽  
Author(s):  
Sergio De Nicola ◽  
Pietro Ferraro ◽  
Andrea Finizio ◽  
Giovanni Pierattini
Keyword(s):  
Fourier Transform ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Fringe Analysis ◽  
Transform Method ◽  
Fourier Transform Method

Fringe analysis of moire interferometry for studying micromechanical behavior of composite materials

1999 ◽  
Author(s):  
Sergio De Nicola ◽  
Pietro Ferraro ◽  
Andrea Finizio ◽  
Giovanni Pierattini ◽  
Marella De Angelis
Keyword(s):  
Composite Materials ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Fringe Analysis
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