Extending aggressive low-k1 design rule requirements for 90-nm and 65-nm nodes via simultaneous optimization of NA, illumination, and OPC

Author(s):  
Sabita Roy ◽  
Douglas J. Van Den Broeke ◽  
J. F. Chen ◽  
Armin Liebchen ◽  
Ting Chen ◽  
...  
2014 ◽  
Vol 42 (4) ◽  
pp. 290-304
Author(s):  
Rajarajan Aiyengar ◽  
Jyoti Divecha

ABSTRACT The blends of natural rubber (NR), polybutadiene rubber (BR), and other forms of rubbers are widely used for enhancing the mechanical and physical properties of rubber compounds. Lots of work has been done in conditioning and mixing of NR/BR blends to improve the properties of its rubber compounds and end products such as tire tread. This article employs response surface methodology designed experiments in five factors; high abrasion furnace carbon black (N 330), aromatic oil, NR/BR ratio, sulfur, and N-oxydiethylene-2-benzothiazole sulfenamide for determination of combined and second order effects of the significant factors leading to simultaneous optimization of the NR/BR blend system. One of the overall optimum of eight properties existed at carbon 44 phr, oil 6.1 phr, NR/BR 78/22 phr with the following values of properties: tensile strength (22 MPa), elongation at break (528%), tear resistance (30 kg/mm), rebound resilience (67%), moderate hardness (68 International rubber hardness degrees) with low heat buildup (17 °C), permanent set (12%), and abrasion loss (57 mm3). More optimum combinations can easily be determined from the NR/BR blend system models contour plots.


2019 ◽  
Author(s):  
Carmen Guguta ◽  
Jan M.M. Smits ◽  
Rene de Gelder

A method for the determination of crystal structures from powder diffraction data is presented that circumvents the difficulties associated with separate indexing. For the simultaneous optimization of the parameters that describe a crystal structure a genetic algorithm is used together with a pattern matching technique based on auto and cross correlation functions.<br>


Author(s):  
DongKwon Jeong ◽  
JuHyeon Ahn ◽  
SangIn Lee ◽  
JooHyuk Chung ◽  
ByungLyul Park ◽  
...  

Abstract This paper presents the problems, the solutions, and the development state of the novel 0.18 μm Cu Metal Process through failure analysis of the Alpha CPU under development at Samsung Electronics. The presented problems include : “Via Bottom Lifting” induced by the Cu Via void, “Via Bottom dissociation” due to the IMD stress, “Via side dissociation” due to the poor formation of the Barrier Metal, “Via short/not-open failure” due to the IMD lifting, and Cu metal Corrosion/Loss. The analysis was carried out on the Via Contact Test Chain Patterns, using the “Electron (ION) Charge Up” method. After carefully analyzing each of the failure types, process improvement efforts followed. As a result, the pass rate of the via contact Rc was brought up from a mere 20% to 95%, and the device speed higher than 1.1 GHz was achieved, which surpasses the target speed of 1 GHz.


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