Packaging issues for free-space interconnects at the board level

1991 ◽  
Author(s):  
Raymond K. Kostuk
Keyword(s):  
1996 ◽  
Vol 35 (8) ◽  
pp. 1317 ◽  
Author(s):  
David Zaleta ◽  
Susant Patra ◽  
Volkan Ozguz ◽  
Jian Ma ◽  
Sing H. Lee

Sign in / Sign up

Export Citation Format

Share Document