Analysis of laser ablation process in semiconductor due to ultrashort-pulsed laser with molecular dynamics simulation

2000 ◽  
Author(s):  
Koji Watanabe ◽  
Yuri Ishizaka ◽  
Etsuji Ohmura ◽  
Isamu Miyamoto
Keyword(s):  
Molecular Dynamics ◽  
Laser Ablation ◽  
Molecular Dynamics Simulation ◽  
Pulsed Laser ◽  
Dynamics Simulation ◽  
Ablation Process ◽  
Laser Ablation Process ◽  
Ultrashort Pulsed Laser

Molecular Dynamics Simulation of the Ablation Process in Ultrashort Pulsed Laser Machining of Polycrystalline Diamond

2012 ◽  
Vol 500 ◽  
pp. 351-356 ◽  
Author(s):  
Zeng Qiang Li ◽  
Jun Wang ◽  
Qi Wu
Keyword(s):  
Molecular Dynamics ◽  
Laser Ablation ◽  
Molecular Dynamics Simulation ◽  
Grain Boundaries ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Polycrystalline Diamond ◽  
Pulsed Laser Ablation ◽  
Dynamics Simulation ◽  
Ultrashort Pulsed Laser

The mechanism of ultrashort pulsed laser ablation of polycrystalline diamond (PCD) is investigated using molecular dynamics simulation. The simulation model provides a detailed atomic-level description of the laser energy deposition to PCD specimens and is verified by an experiment using 300 fs laser irradiation of a PCD sample. It is found that grain boundaries play an important role in the laser ablation. Melting starts from the grain boundaries since the atoms in these regions have higher potential energy and are melted more easily than the perfect diamond. Non-homogeneous melting then takes place at these places, and the inner crystal grains melt more easily in liquid surroundings presented by the melting grain boundaries. Moreover, the interplay of the two processes, photomechanical spallation and evaporation, are found to account for material removal in ultrashort pulsed laser ablation of PCD.

Comparative Assessment of the Laser-Induced Plasma Micromachining and the Ultrashort Pulsed Laser Ablation Processes

2014 ◽  
Vol 2 (3) ◽  
Author(s):  
Kumar Pallav ◽  
Ishan Saxena ◽  
Kornel F. Ehmann
Keyword(s):  
Laser Ablation ◽  
Material Removal ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Comparative Assessment ◽  
Ablation Process ◽  
Laser Induced Plasma ◽  
Laser Ablation Process ◽  
Matter Interaction ◽  
Ultrashort Pulsed Laser

The ultrashort pulsed laser ablation process is a well-established micromachining process and has been at the center of manufacturing research in the past decade. However, it has its own limitations, primarily due to the involvement of various material-specific laser and machining process parameters. The laser-induced plasma micromachining (LIP-MM) is a novel tool-less and multimaterial selective material removal type of micromachining process. In a manner similar to ultrashort pulsed laser ablation, it also removes material through an ultrashort pulsed laser beam. However, instead of direct laser–matter interaction, it uses the laser beam to generate plasma within a transparent dielectric media that facilitates material removal through plasma–matter interaction and thus circumvents some of the limitations associated with the ultrashort pulsed laser ablation process. This paper presents an experimental investigation on the comparative assessment of the capabilities of the two processes in the machining of microchannels in stainless steel. For this purpose, microchannels were machined by the two processes at similar pulse energy levels and feed-rate values. The comparative assessment was based on the geometric characteristics, material removal rate (MRR), heat-affected zone and shock-affected zone (HAZ, SAZ), and the range of machinable materials.

MOLECULAR DYNAMICS SIMULATION OF PULSED LASER ABLATION

2011 ◽  
Vol 25 (04) ◽  
pp. 543-550 ◽  
Author(s):  
XIU-FANG GONG ◽  
GONG-XIAN YANG ◽  
PENG LI ◽  
YIN WANG ◽  
XI-JING NING
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Laser Pulses ◽  
Solid Surfaces ◽  
Dynamics Simulation ◽  
Angular Distributions ◽  
Adiabatic Expansion ◽  
Expansion Model

We have developed a simplified molecular-dynamical model for simulating ablation of solid surfaces by laser pulses, and specifically investigated expansion of Cu cloud in vacuum vaporized on the surface, showing that the angular distributions of the plume depend on the shape of the laser spot on the surface. In particular, experimentally observed flipover effects have been obtained, and an adiabatic constant determined from our simulations via an adiabatic expansion model agrees well with previous measurements.

Effect of silicon target porosity on laser ablation threshold: molecular dynamics simulation

2021 ◽  
Vol 18 (7) ◽  
pp. 076001
Author(s):  
A Yu Kharin ◽  
M S Grigoryeva ◽  
I N Zavestovskaya ◽  
V Yu Timoshenko
Keyword(s):  
Molecular Dynamics ◽  
Laser Ablation ◽  
Molecular Dynamics Simulation ◽  
Ablation Threshold ◽  
Dynamics Simulation ◽  
Silicon Target

Numerical Simulation Study on Truing and Dressing of Bronze-Bonded Diamond Wheel with Pulsed Laser

2007 ◽  
Vol 359-360 ◽  
pp. 166-170
Author(s):  
Gen Yu Chen ◽  
Li Fang Mei ◽  
Bi Zhang ◽  
Ding Jun Zhu ◽  
Guo Gui Chen
Keyword(s):  
Laser Ablation ◽  
Pulsed Laser ◽  
Diamond Wheel ◽  
Ablation Depth ◽  
Grinding Wheel ◽  
Ablation Process ◽  
Wheel Surface ◽  
Laser Ablation Process ◽  
Topographic Information ◽  
Single Process

A two-dimensional mathematical model is developed to simulate laser truing and dressing of bronze-bonded diamond grinding wheel. Based on the model, the ablation depth produced on bond and diamond abrasives by an acousto-optic Q-switched YAG pulsed laser under different parameters as well as the temperature field on grinding wheel surface produced in the laser ablation process are numerically simulated. An experimental study on laser truing and dressing of grinding wheel is also conducted. In the study, the wheel surface is ablated by the single-pulsed laser and measured with a measurement device for surface topographic information. Both the theoretical analysis and the experimental results indicate that the truing and dressing processes can be simultaneously realized with the laser ablation as a single process.

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