Pixel circuit design of CMOS image sensor

2000 ◽  
Author(s):  
Wenru Zhang ◽  
Suntao Wu ◽  
Donghui Guo ◽  
Gerard Parr
2021 ◽  
Vol 16 ◽  
pp. 626-632
Author(s):  
Aicha Menssouri ◽  
Karim El Khadiri ◽  
Ahmed Tahiri

This work aims to design and simulate an in-pixel Capacitive Transimpedance Amplifier (CTIA) and peripheral circuitry that ensures pixel reading. Each pixel circuit is composed of four transistors using 90nm CMOS technology with a supply voltage of 1.8 V and is part of an array of pixels that make up a CMOS image sensor with peripheral circuitry. Pixel output is sent to a delta difference sampling (DDS) circuit to filter reset voltages. The Gain Margin achieved for the in-pixel CTIA is 44dB and 91dB for the Phase Margin. We also present measured pixel parameters and give a comparison with prior work. The timing and readout circuitry is also described.


Sensors ◽  
2018 ◽  
Vol 18 (11) ◽  
pp. 3642 ◽  
Author(s):  
Yutaka Hirose ◽  
Shinzo Koyama ◽  
Motonori Ishii ◽  
Shigeru Saitou ◽  
Masato Takemoto ◽  
...  

We have developed a direct time-of-flight (TOF) 250 m ranging Complementary Metal Oxide Semiconductor (CMOS) image sensor (CIS) based on a 688 × 384 pixels array of vertical avalanche photodiodes (VAPD). Each pixel of the CIS comprises VAPD with a standard four transistor pixel circuit equipped with an analogue capacitor to accumulate or count avalanche pulses. High power near infrared (NIR) short (<50 ns) and repetitive (6 kHz) laser pulses are illuminated through a diffusing optics. By globally gating the VAPD, each pulse is counted in the in-pixel counter enabling extraction of sub-photon level signal. Depth map imaging with a 10 cm lateral resolution is realized from 1 m to 250 m range by synthesizing subranges images of photon counts. Advantages and limitation of an in-pixel circuit are described. The developed CIS is expected to supersede insufficient resolution of the conventional light detection and ranging (LiDAR) systems and the short range of indirect CIS TOF.


2015 ◽  
Author(s):  
Fengmei Cao ◽  
Shengyu Song ◽  
Tingzhu Bai ◽  
Nan Cao

Sensors ◽  
2021 ◽  
Vol 21 (18) ◽  
pp. 6079
Author(s):  
Shunsuke Okura ◽  
Masanori Aoki ◽  
Tatsuya Oyama ◽  
Masayoshi Shirahata ◽  
Takeshi Fujino ◽  
...  

In order to realize image information security starting from the data source, challenge–response (CR) device authentication, based on a Physically Unclonable Function (PUF) with a 2 Mpixel CMOS image sensor (CIS), is studied, in which variation of the transistor in the pixel array is utilized. As each CR pair can be used only once to make the CIS PUF resistant to the modeling attack, CR authentication with CIS can be carried out 4050 times, with basic post-processing to generate the PUF ID. If a larger number of authentications is required, advanced post-processing using Lehmer encoding can be utilized to carry out authentication 14,858 times. According to the PUF performance evaluation, the authentication error rate is less than 0.001 ppm. Furthermore, the area overhead of the CIS chip for the basic and advanced post-processing is only 1% and 2%, respectively, based on a Verilog HDL model circuit design.


2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  

2020 ◽  
Vol 2020 (7) ◽  
pp. 143-1-143-6 ◽  
Author(s):  
Yasuyuki Fujihara ◽  
Maasa Murata ◽  
Shota Nakayama ◽  
Rihito Kuroda ◽  
Shigetoshi Sugawa

This paper presents a prototype linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors (LOFITreCs) exhibiting over 120dB dynamic range with 11.4Me- full well capacity (FWC) and maximum signal-to-noise ratio (SNR) of 70dB. The measured SNR at all switching points were over 35dB thanks to the proposed two-stage LOFITreCs.


Author(s):  
Benedict Drevniok ◽  
St. John Dixon-Warren ◽  
Oskar Amster ◽  
Stuart L Friedman ◽  
Yongliang Yang

Abstract Scanning microwave impedance microscopy was used to analyze a CMOS image sensor sample to reveal details of the dopant profiling in planar and cross-sectional samples. Sitespecific capacitance-voltage spectroscopy was performed on different regions of the samples.


2014 ◽  
Vol 35 (3) ◽  
pp. 035005 ◽  
Author(s):  
Kaiming Nie ◽  
Suying Yao ◽  
Jiangtao Xu ◽  
Zhaorui Jiang

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