Laser diode applications for contamination control in microelectronics fabrication processes

1999 ◽  
Author(s):  
Dumitru G. Ulieru
Keyword(s):  
Laser Diode ◽  
Contamination Control ◽  
Microelectronics Fabrication

Degradation Analysis and Degradation Suppression Technology Caused by Light Absorption at Active Layer Facet of GaInAsP Laser Diode

2008 ◽  
Vol 128 (5) ◽  
pp. 732-737
Author(s):  
Hiroyuki Ichikawa ◽  
Masashi Ito ◽  
Chie Fukuda ◽  
Kotaro Hamada ◽  
Akira Yamaguchi ◽  
...  
Keyword(s):  
Active Layer ◽  
Laser Diode ◽  
Light Absorption ◽  
Degradation Analysis

Development of the Terahertz Inspection Technology using Multimode Laser Diode

2013 ◽  
Vol 133 (8) ◽  
pp. 430-435 ◽  
Author(s):  
Tohru Takanaka ◽  
Hiroyuki Nishikawa ◽  
Yoshito Sameda ◽  
Keiji Yamamoto
Keyword(s):  
Laser Diode ◽  
Multimode Laser ◽  
Multimode Laser Diode

Split pump region in 1.55 ^|^mu;m InGaAsP/InGaAsP asymmetric active multi-mode interferometer laser diode for improved modulation bandwidth

2014 ◽  
Vol E97.C (7) ◽  
pp. 781-786 ◽  
Author(s):  
Mohammad NASIR UDDIN ◽  
Takaaki KIZU ◽  
Yasuhiro HINOKUMA ◽  
Kazuhiro TANABE ◽  
Akio TAJIMA ◽  
...  
Keyword(s):  
Laser Diode ◽  
Modulation Bandwidth ◽  
Multi Mode

Validity-Study of Commercial Semiconductor with TO-18 Package for Space Application by PIND Test

2013 ◽  
Author(s):  
Yusuke Nakatake ◽  
Makoto Okabe ◽  
Shota Sato
Keyword(s):  
Industrial Applications ◽  
Validity Study ◽  
Space Application ◽  
Noise Detection ◽  
Foreign Material ◽  
Contamination Control ◽  
X Ray ◽  
Impact Noise ◽  
Report Analysis ◽  
Foreign Materials

Abstract In this paper, we carried out PIND (Particle Impact Noise Detection) test and X-ray inspection of a transistor in a TO-18 package for commercial and industrial applications. From our evaluation results, we explain the validity of the PIND test by comparing PIND test and X-ray inspection results. We make clear that PIND test is able to detect internal foreign material that may be transparent to X-ray inspection. In addition, we report analysis results of internal foreign materials from defective devices. This matter suggests that a problem is contamination control in the manufacturing process, most likely the sealing process.

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