Microscopic simulation of short-pulse laser damage of melanin particles

Author(s):  
Leonid V. Zhigilei ◽  
Barbara J. Garrison
2014 ◽  
Author(s):  
Mark Gyamfi ◽  
Peter Jürgens ◽  
Mathias Mende ◽  
Lars Jensen ◽  
Detlev Ristau

1999 ◽  
Vol 82 (19) ◽  
pp. 3883-3886 ◽  
Author(s):  
An-Chun Tien ◽  
Sterling Backus ◽  
Henry Kapteyn ◽  
Margaret Murnane ◽  
Gérard Mourou

2008 ◽  
Author(s):  
Mark Kimmel ◽  
Jens Schwarz ◽  
Patrick Rambo ◽  
Matthias Geissel ◽  
Briggs Atherton

2007 ◽  
Author(s):  
Gérard Razé ◽  
Jérôme Néauport ◽  
Gabriel Dupuy ◽  
Matthieu Balas ◽  
Gabriel Mennerat ◽  
...  

Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov

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