Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration

1999 ◽  
Vol 82 (19) ◽  
pp. 3883-3886 ◽  
Author(s):  
An-Chun Tien ◽  
Sterling Backus ◽  
Henry Kapteyn ◽  
Margaret Murnane ◽  
Gérard Mourou
Keyword(s):  
Pulse Duration ◽  
Pulse Laser ◽  
Short Pulse ◽  
Laser Damage ◽  
Short Pulse Laser ◽  
Transparent Materials

Dual-wavelength ultra-short pulse laser damage testing

2014 ◽  
Author(s):  
Mark Gyamfi ◽  
Peter Jürgens ◽  
Mathias Mende ◽  
Lars Jensen ◽  
Detlev Ristau
Keyword(s):  
Pulse Laser ◽  
Short Pulse ◽  
Dual Wavelength ◽  
Laser Damage ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Short pulse laser damage testing on nitrocellulose and polyimide thin films in vacuum with application to laser debris shields

2008 ◽  
Author(s):  
Mark Kimmel ◽  
Jens Schwarz ◽  
Patrick Rambo ◽  
Matthias Geissel ◽  
Briggs Atherton
Keyword(s):  
Thin Films ◽  
Pulse Laser ◽  
Short Pulse ◽  
Laser Damage ◽  
Short Pulse Laser

Short pulse laser damage measurements of pulse compression gratings for petawatt laser

2007 ◽  
Author(s):  
Gérard Razé ◽  
Jérôme Néauport ◽  
Gabriel Dupuy ◽  
Matthieu Balas ◽  
Gabriel Mennerat ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Pulse Compression ◽  
Short Pulse ◽  
Laser Damage ◽  
Short Pulse Laser

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

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