Permittivity measurements of low-loss dielectric materials at 60 GHz

1996 ◽  
Author(s):  
Chriss A. Jones ◽  
John H. Grosvenor ◽  
Yehuda Kantor
Keyword(s):  
Dielectric Materials ◽  
60 Ghz ◽  
Low Loss ◽  
Permittivity Measurements

LOW LOSS DIELECTRIC MATERIALS FOR HIGH FREQUENCY APPLICATIONS

2009 ◽  
Vol 23 (17) ◽  
pp. 3649-3654 ◽  
Author(s):  
MOHAN V. JACOB
Keyword(s):  
High Frequency ◽  
Room Temperature ◽  
Low Cost ◽  
Dielectric Materials ◽  
Dielectric Constants ◽  
Transmission Losses ◽  
Low Loss ◽  
Microwave Characterization ◽  
Materials Used ◽  
Low Temperature Electronics

The microwave properties of some of the low cost materials which can be used in high frequency applications with low transmission losses are investigated in this paper. One of the most accurate microwave characterization techniques, Split Post Dielectric Resonator technique (SPDR) is used for the experimental investigation. The dielectric constants of the 3 materials scrutinized at room temperature and at 10K are 3.65, 2.42, 3.61 and 3.58, 2.48, 3.59 respectively. The corresponding loss tangent values are 0.00370, 0.0015, 0.0042 and 0.0025, 0.0009, 0.0025. The high frequency transmission losses are comparable with many of the conventional materials used in low temperature electronics and hence these materials could be implemented in such applications.

A comparative study on four different transmission lines in LTCC for 60 GHz applications

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000191-000198 ◽  
Author(s):  
A. Isapour ◽  
D. Bahloul ◽  
A. B. Kouki
Keyword(s):  
Transmission Lines ◽  
Coplanar Waveguide ◽  
Data Rate ◽  
High Data Rate ◽  
60 Ghz ◽  
Low Loss ◽  
Great Opportunity ◽  
High Data ◽  
Wireless Telecommunication ◽  
5 Ghz

Abstract The wireless telecommunication systems have an undeniable role in today's society. The rapid progress of wireless services and applications accelerates demands for high data-rate reliable systems. The 60 GHz band with its 5 GHz globally unlicensed available spectrum, provides a great opportunity for the next generation of high data-rate wireless communication. Despite this attractive bandwidth surrounding 60 GHz, there are still many challenges to be addressed such as the loss performance and the integration with other systems. Low Temperature Cofired Ceramic (LTCC) technology, with its unique and mature multilayer fabrication process, has excellent capability of realizing miniaturized 3D low loss structures to overcome these challenges. Since, one of the key components in any communication system for both interconnecting and designing components is Low loss transmission lines, in this article we overview the performances and challenges for four different most practical transmission lines at 60 GHz in LTCC: Microstrip, Stripline, Coplanar Waveguide (CPW), and LTCC Integrated Waveguide (LIW).

A Low Loss Fully Embedded Stripline Parallel Coupled BPF for Applications using the 60 GHz Band

2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000050-000053
Author(s):  
Alexander Schulz ◽  
Sven Rentsch ◽  
Lei Xia ◽  
Robert Mueller ◽  
Jens Mueller
Keyword(s):  
Return Loss ◽  
Bandpass Filter ◽  
Coplanar Waveguide ◽  
Center Frequency ◽  
60 Ghz ◽  
Low Loss ◽  
Wireless Applications ◽  
High Data ◽  
V Band ◽  
Waveguide Transmission

This paper presents a low loss fully embedded bandpass filter (BPF) using low temperature co-fired ceramic (LTCC) for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless applications for the unlicensed 60 GHz band. The measured insertion loss was 1.5 dB at the center frequency 58 GHz, and a return loss of less than −10 dB was achieved, including two grounded coplanar waveguide transmission line (CPWg) to stripline transitions. The four layers BPF has a 3 dB bandwidth of about 11 GHz which supplies e.g. broadband and high data rate applications. The whole BPF requires a substrate area of 5.6 × 2.1 × 0.42 mm3 with transitions and a shielding via fence. This BPF suits well for V-band applications in a LTCC package because of the compact dimensions and the good performance.

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris
Keyword(s):  
3D Printing ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Coplanar Waveguide ◽  
Frequency Selective Surface ◽  
60 Ghz ◽  
Low Loss ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

Three-Dimensional Surface in LTCC for a MM-Wave Antenna

2011 ◽  
Vol 2011 (1) ◽  
pp. 000527-000533 ◽  
Author(s):  
Peter Uhlig ◽  
Sybille Holzwarth ◽  
Bahram Sanadgol ◽  
Alexandra Serwa
Keyword(s):  
Antenna Array ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
60 Ghz ◽  
Low Loss ◽  
Wave Antenna ◽  
Signal Path ◽  
Steerable Antenna ◽  
Dimensional Surface ◽  
High Density Packaging

Low loss LTCC (Low Temperature Cofired Ceramics) materials have already demonstrated their virtues for high density packaging of mm-wave modules and their capability to handle the inherent requirements of heat dissipation. A 60 GHz substrate integrated waveguide fed steerable antenna array is one example of the driving applications for new challenges in the LTCC process. This antenna is suitable for transmit and receive in the 60 GHz WPAN frequency band [1]. Integrating antenna array and mm-wave front-end in one module is a consequent way to avoid amplitude and phase uncertainties associated with connectors and cables. A compact module also helps to reduce losses in the signal path by providing short interconnects. This is important for mm-Wave systems, particularly for the receiver. The antenna design presented here requires a three-dimensional surface structure with features like small and precise cavities and grooves. Different methods to fabricate cavities in LTCC modules will be discussed and a new method which proved suitable for the demanding application will be presented in detail.

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