Foundations of lasing and emission from surface-patterned structures

2021 ◽  
Author(s):  
Mohammed Benzaouia ◽  
Wenjie Yao ◽  
Alexander Cerjan ◽  
Zin Lin ◽  
Charles Roques-Carmes ◽  
...  
Keyword(s):  
Patterned Structures

Hybrid Micro-Optical Sensors via Sol-Gel Soft Lithography

2000 ◽  
Vol 628 ◽  
Author(s):  
Mark A. Clarner ◽  
Michael J. Lochhead
Keyword(s):  
Optical Sensors ◽  
Soft Lithography ◽  
Sol Gel ◽  
Silica Gels ◽  
Ph Sensing ◽  
Ambient Conditions ◽  
Sensor Applications ◽  
Patterned Structures ◽  
Biological Functionality ◽  
Indicator Dyes

ABSTRACTOrganically modified silica gels and dye-doped silica gels have been patterned into micrometer-scale structures on a substrate using micro molding in capillaries (MIMIC). This approach is from a class of elastomeric stamping and molding techniques collectively known as soft lithography. Soft lithography and sol-gel processing share attractive features in that they are relatively benign processes performed at ambient conditions, which makes both techniques compatible with a wide variety of organic molecules, molecular assemblies, and biomolecules. The combination of sol-gel and soft lithography, therefore, holds enormous promise as a tool for microfabrication of materials with optical, chemical, or biological functionality that are not readily patterned with conventional methods. This paper describes our investigation of micro-patterned organic-inorganic hybrid materials containing indicator dyes for microfluidic sensor applications. Reversible colorimetric pH sensing via entrapped reagents is demonstrated in a prototype microfluidic sensor element. Patterned structures range from one to tens of micrometers in cross-section and are up to centimeters in length. Fundamental chemical processing issues associated with mold filling, cracking and sensor stability are discussed.

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

Hierarchical Self-Assembly of Dopamine into Patterned Structures

2017 ◽  
Vol 4 (11) ◽  
pp. 1601218 ◽  
Author(s):  
Peibin Zhang ◽  
Anqi Tang ◽  
Baoku Zhu ◽  
Liping Zhu ◽  
Hongbo Zeng
Keyword(s):  
Self Assembly ◽  
Patterned Structures

Stress and Warpage Studies of Silicon Based Plain and Patterned Films During Rapid Thermal Processing (RTP)

1993 ◽  
Vol 303 ◽  
Author(s):  
R.P.S. Thakur ◽  
A. Martin ◽  
W.T. Fackrell ◽  
R. Barbour ◽  
J. L. Kawski ◽  
...  
Keyword(s):  
Thermal Processing ◽  
Large Diameter ◽  
Rapid Thermal Processing ◽  
High Stress ◽  
Film Stress ◽  
Dislocation Slip ◽  
Cmos Process ◽  
Destructive Interference ◽  
Data Set ◽  
Patterned Structures

ABSTRACTSingle wafer rapid thermal processing (RTP) is emerging as a key player in the processing of advanced sub-half micron memory devices. The high temperature processing of large diameter silicon wafers can create sufficient thermal stress for generation of dislocation, slip, and gross mechanical instability of the wafer. The aforementioned factors may lead to loss of device yield, dielectric defects, and reduced photolithographic yield due to degradation of virtual wafer flatness. Moreover, the loss of geometrical planarity of wafer due to warpage can make it impossible to process a wafer or can lead to self-fracture of the wafer.In this paper we present the warpage and stress results of our study on plain and patterned structures that were subjected to RTP at different stages of the CMOS process flow. Experimental results have been gathered with full wafer scanning technology using non-contact capacitive probes to measure more accurate global stress values. The stress and warpage values on the patterned wafers could be measured accurately without any light scattering effects and destructive interference. It is reported that the thermal processing creates significant variations in shape change around the wafer which could be identified using the full wafer data set acquired using this evaluation technique. We have successfully tracked variations in film stress for both plain and patterned structures as a cumulative effect and correlated it with the overall wafer warpage. The effects of incoming wafer warpage, ramp rate in RTP, and high stress nitride films on the overall wafer warpage are also reported.

scholarly journals Light circulation and weaving in periodically patterned structures

2008 ◽  
Vol 77 (19) ◽  
Author(s):  
David Crouse ◽  
Eric Jaquay ◽  
Abdur Maikal ◽  
Alastair P. Hibbins
Keyword(s):  
Patterned Structures
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