Processability of organic material for semiconductor packaging by 248 nm excimer laser

2021 ◽  
Author(s):  
Akira Suwa ◽  
Yasufumi Kawasuji ◽  
Masakazu Kobayashi ◽  
Kouji Kakizaki ◽  
Junichi Fujimoto
Keyword(s):  
Excimer Laser ◽  
Organic Material ◽  
Semiconductor Packaging

Microprocessing of organic material for semiconductor packaging by 248 nm excimer laser

2019 ◽  
Author(s):  
Akira Suwa ◽  
Junichi Fujimoto ◽  
Yasufumi Kawasuji ◽  
Masakazu Kobayashi ◽  
Masashi Simbori ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Organic Material ◽  
Semiconductor Packaging

scholarly journals Microdrilling Machinability of Organic Material for Semiconductor Packaging by 248 nm Excimer Laser

2020 ◽  
Vol 33 (5) ◽  
pp. 499-504
Author(s):  
Yasufumi Kawasuji ◽  
Akira Suwa ◽  
Masakazu Kobayashi ◽  
Junichi Fujimoto ◽  
Kouji Kakizaki
Keyword(s):  
Excimer Laser ◽  
Organic Material ◽  
Semiconductor Packaging

Micro-via fabrication of glass material for semiconductor packaging by 248 nm excimer laser

2021 ◽  
Author(s):  
Yasufumi Kawasuji ◽  
Akira Suwa ◽  
Yasuhiro Adachi ◽  
Masakazu Kobayashi ◽  
Kouji Kakizaki ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Glass Material ◽  
Semiconductor Packaging

Biological treatment for removal of organic material and ammonium from leachate at low temperatures

1999 ◽  
Vol 17 (6) ◽  
pp. 487-492
Author(s):  
Rittia H. Kettunen ◽  
Pertti Keskitalo ◽  
Taina H. Hoilijoki ◽  
Jukka A. Rintala
Keyword(s):  
Organic Material ◽  
Low Temperatures ◽  
Biological Treatment
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