TCAD-based performance analysis of nanoscale vacuum field-emission transistors at advanced technology nodes

2019 ◽  
Author(s):  
Ilya Evsikov ◽  
Gleb Demin ◽  
Nikolay Djuzhev ◽  
Maxim Makhiboroda
Keyword(s):  
Performance Analysis ◽  
Field Emission ◽  
Advanced Technology ◽  
Vacuum Field ◽  
Technology Nodes

Use of Second Harmonic and Thermal Effects of Laser Voltage Probing for Better Fault Isolation

2016 ◽  
Author(s):  
Ramya Yeluri ◽  
Ravishankar Thirugnanasambandam ◽  
Cameron Wagner ◽  
Jonathan Urtecho ◽  
Jan M. Neirynck
Keyword(s):  
Duty Cycle ◽  
Thermal Effects ◽  
Second Harmonic ◽  
Fault Isolation ◽  
Advanced Technology ◽  
Temperature Dependent ◽  
First Case ◽  
Improve Accuracy ◽  
Degradation Monitoring ◽  
Technology Nodes

Abstract Laser voltage probing (LVP) has been extensively used for fault isolation over the last decade; however fault isolation in practice primarily relies on good-to-bad comparisons. In the case of complex logic failures at advanced technology nodes, understanding the components of the measured data can improve accuracy and speed of fault isolation. This work demonstrates the use of second harmonic and thermal effects of LVP to improve fault isolation with specific examples. In the first case, second harmonic frequency is used to identify duty cycle degradation. Monitoring the relative amplitude of the second harmonic helps identify minute deviations in the duty cycle with a scan over a region, as opposed to collecting multiple high resolution waveforms at each node. This can be used to identify timing degradation such as signal slope variation as well. In the second example, identifying abnormal data at the failing device as temperature dependent effect helps refine the fault isolation further.

Performance Analysis of Gate-Stack Dual-Material DG MOSFET Using Work-Function Modulation Technique for Lower Technology Nodes

Silicon ◽  
2021 ◽  
Author(s):  
Satish K. Das ◽  
Umakanta Nanda ◽  
Sudhansu M. Biswal ◽  
Chandan Kumar Pandey ◽  
Lalat Indu Giri
Keyword(s):  
Performance Analysis ◽  
Work Function ◽  
Gate Stack ◽  
Modulation Technique ◽  
Dg Mosfet ◽  
Technology Nodes ◽  
Dual Material

Advanced technology nodes, a foundry perspective

2012 ◽  
Author(s):  
Jürgen Faul ◽  
Jan Hoentschel ◽  
Maciej Wiatr ◽  
Manfred Horstmann
Keyword(s):  
Advanced Technology ◽  
Technology Nodes

Electromigration Improvement for Advanced Technology Nodes

2019 ◽  
Vol 18 (1) ◽  
pp. 269-274
Author(s):  
Hui-Jung Wu ◽  
Wen Wu ◽  
Roey Shaviv ◽  
Mandy Sriram ◽  
Anshu Pradhan ◽  
...  
Keyword(s):  
Advanced Technology ◽  
Technology Nodes

Diamond vacuum field emission devices

2004 ◽  
Vol 13 (4-8) ◽  
pp. 975-981 ◽  
Author(s):  
W.P. Kang ◽  
J.L. Davidson ◽  
Y.M. Wong ◽  
K. Holmes
Keyword(s):  
Field Emission ◽  
Vacuum Field ◽  
Field Emission Devices

Complementary Vacuum Field Emission Transistor

2021 ◽  
Vol 68 (10) ◽  
pp. 5244-5249
Author(s):  
Ranajoy Bhattacharya ◽  
Jin-Woo Han ◽  
Jim Browning ◽  
M. Meyyappan
Keyword(s):  
Field Emission ◽  
Vacuum Field

The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends

2015 ◽  
Vol 2015 (1) ◽  
pp. 000001-000005 ◽  
Author(s):  
R. Beica ◽  
A. Ivankovic ◽  
T. Buisson ◽  
S. Kumar ◽  
J. Azemar
Keyword(s):  
Semiconductor Industry ◽  
Cost Effective ◽  
Cmos Technology ◽  
Advanced Technology ◽  
Current Trends ◽  
Advanced Packaging ◽  
Scaling Process ◽  
Market Trends ◽  
The Cost ◽  
Technology Nodes

The semiconductor industry, for more than five decades, has followed Moore's law and was driven by miniaturization of the transistors, scaling the CMOS technology to smaller and more advanced technology nodes while, at the same time, reducing the cost. The industry is reaching now limitations in continuing this scaling process in cost effective way. While technology nodes continue to be developed and innovative solutions are being proposed, the investment required to bring such technologies to production are significantly increasing. To overcome these limitations, new packaging technologies have been developed, enabling integration of more performing as well as various type of devices within the same package. This paper will provide an overview of current trends seen in the industry across all the packaging platforms (WLCSP1, FanOut2, Embedded Die2, Flip Chip3 and 3DIC4). Challenges, applications, positioning of the different packaging technologies by market segments (from low end to high end applications) and changes of the markets and drivers, growth rates and roadmaps will be presented. Global capacities and demands and the landscape of the packaging industry will be reviewed. Examples of teardowns to illustrate the latest packaging techniques for various devices used in latest products will be included.

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