High efficiency silicon-on-insulator fiber-chip spot size converting edge coupler

Author(s):  
Bo Liu ◽  
Gang Yang ◽  
Smit Desai ◽  
Keith Powell ◽  
Walter Xie ◽  
...  
2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000152-000158
Author(s):  
J. Valle Mayorga ◽  
C. Gutshall ◽  
K. Phan ◽  
I. Escorcia ◽  
H. A. Mantooth ◽  
...  

SiC power semiconductors have the capability of greatly outperforming Si-based power devices. Faster switching and smaller on-state losses coupled with higher voltage blocking and temperature capabilities, make SiC a very attractive semiconductor for high performance, high power density power modules. However, the temperature capabilities and increased power density are fully utilized only when the gate driver is placed next to the SiC devices. This requires the gate driver to successfully operate under these extreme conditions with reduced or no heat sinking requirements, allowing the full realization of a high efficiency, high power density SiC power module. In addition, since SiC devices are usually connected in a half or full bridge configuration, the gate driver should provide electrical isolation between the high and low voltage sections of the driver itself. This paper presents a 225 degrees Celsius operable, Silicon-On-Insulator (SOI) high voltage isolated gate driver IC for SiC devices. The IC was designed and fabricated in a 1 μm, partially depleted, CMOS process. The presented gate driver consists of a primary and a secondary side which are electrically isolated by the use of a transformer. The gate driver IC has been tested at a switching frequency of 200 kHz at 225 degrees Celsius while exhibiting a dv/dt noise immunity of at least 45 kV/μs.


2009 ◽  
Author(s):  
Yu Zhu ◽  
Zhiyong Li ◽  
Weihua Han ◽  
Zhongchao Fan ◽  
Yude Yu ◽  
...  

2007 ◽  
Vol 32 (11) ◽  
pp. 1495 ◽  
Author(s):  
Günther Roelkens ◽  
Dries Van Thourhout ◽  
Roel Baets

2019 ◽  
Vol 11 (4) ◽  
pp. 121
Author(s):  
Andrzej Kaźmierczak ◽  
Mateusz Słowikowski ◽  
Krystian Pavłov ◽  
Maciej Filipiak ◽  
Ryszard Piramidowicz

We present a low-cost scheme for non-permanent optical signal coupling for prospective application in single use photonic integrated chips. The proposed scheme exploits the use of polymer kinoform microlenses. The feasibility of the proposed solution is demonstrated by the experimental investigation of the optical signal coupling from single mode optical fiber (SMF) to the test structure of SixNy integrated waveguide. Full Text: PDF ReferencesM. Smit et al., "An introduction to InP-based generic integration technology," Semiconductor Science and Technology, 29 (8), 083001, 2014 CrossRef R. Baets et al., "Silicon Photonics: silicon nitride versus silicon-on-insulator," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optical Society of America, 2016), paper Th3J.1. CrossRef K. Shiraishi et al., "A silicon-based spot-size converter between single-mode fibers and Si-wire waveguides using cascaded tapers," Appl. Phys. Lett. 91, 141120 (2007) CrossRef Y. Sobu et al., "GaInAsP/InP waveguide dual core spot size converter for optical fiber,"IEEE Photonic Society 24th Annual Meeting, 469-470, (2011). CrossRef F. Van Laere et al., "Compact and Highly Efficient Grating Couplers Between Optical Fiber and Nanophotonic Waveguides," Journal of Lightwave Technology, vol. 25, no. 1, pp. 151-156, Jan. 2007. CrossRef A. Kaźmierczak et al., "Light coupling and distribution or Si3N4/SiO2 integrated multichannel single mode sensing system," Opt. Eng. 48, 2009, pp. 014401 CrossRef M. Rossi et al., "Arrays of anamorphic phase-matched Fresnel elements for diode-to-fiber coupling," Appl. Opt. 34, 2483-2488 (1995) CrossRef M. Prasciolu et al, "Fabrication of Diffractive Optical Elements On-Fiber for Photonic Applications by Nanolitography," Japanese Journal of Applied Physics, Volume 42, (2003) CrossRef F.Schiappelli et al., "Efficient fiber-to-waveguide coupling by a lens on the end of the optical fiber fabricated by focused ion beam milling" Microelectronic Engineering Volumes 73-74, pp.397-404 (2004) CrossRef


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