High-efficiency silicon optoelectronic modulator based on a Bragg mirror and integrated in a low-loss silicon-on-insulator waveguide

Author(s):  
Andrea Irace ◽  
Giuseppe Coppola ◽  
Mario Iodice ◽  
Antonello Cutolo
2015 ◽  
Vol 14 ◽  
pp. 1400-1403 ◽  
Author(s):  
I. Kharrat ◽  
P. Xavier ◽  
T.-P. Vuong ◽  
J.-M. Duchamp ◽  
Ph. Benech ◽  
...  

2018 ◽  
Vol 32 (31) ◽  
pp. 1850344 ◽  
Author(s):  
N. Eti ◽  
Z. Çetin ◽  
H. S. Sözüer

A detailed numerical study of low-loss silicon on insulator (SOI) waveguide bend is presented using the fully three-dimensional (3D) finite-difference time-domain (FDTD) method. The geometrical parameters are optimized to minimize the bending loss over a range of frequencies. Transmission results for the conventional single bend and photonic crystal assisted SOI waveguide bend are compared. Calculations are performed for the transmission values of TE-like modes where the electric field is strongly transverse to the direction of propagation. The best obtained transmission is over 95% for TE-like modes.


2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000152-000158
Author(s):  
J. Valle Mayorga ◽  
C. Gutshall ◽  
K. Phan ◽  
I. Escorcia ◽  
H. A. Mantooth ◽  
...  

SiC power semiconductors have the capability of greatly outperforming Si-based power devices. Faster switching and smaller on-state losses coupled with higher voltage blocking and temperature capabilities, make SiC a very attractive semiconductor for high performance, high power density power modules. However, the temperature capabilities and increased power density are fully utilized only when the gate driver is placed next to the SiC devices. This requires the gate driver to successfully operate under these extreme conditions with reduced or no heat sinking requirements, allowing the full realization of a high efficiency, high power density SiC power module. In addition, since SiC devices are usually connected in a half or full bridge configuration, the gate driver should provide electrical isolation between the high and low voltage sections of the driver itself. This paper presents a 225 degrees Celsius operable, Silicon-On-Insulator (SOI) high voltage isolated gate driver IC for SiC devices. The IC was designed and fabricated in a 1 μm, partially depleted, CMOS process. The presented gate driver consists of a primary and a secondary side which are electrically isolated by the use of a transformer. The gate driver IC has been tested at a switching frequency of 200 kHz at 225 degrees Celsius while exhibiting a dv/dt noise immunity of at least 45 kV/μs.


2004 ◽  
Vol 85 (5) ◽  
pp. 701-703 ◽  
Author(s):  
L. Vivien ◽  
S. Lardenois ◽  
D. Pascal ◽  
S. Laval ◽  
E. Cassan ◽  
...  

2009 ◽  
Vol 48 (5) ◽  
pp. 958 ◽  
Author(s):  
R. Pafchek ◽  
R. Tummidi ◽  
J. Li ◽  
M. A. Webster ◽  
E. Chen ◽  
...  

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