Since LED became an attractive alternative for general lighting, the market demand for higher brightness, higher efficiency and lower costs was the motivation for improving the LED technology. Locking in on the LED manufacturing process, most steps are on die-level after chip singularizing and therefore the costs are dominated by the huge number of dies which could often reach several thousand dies on one wafer. It's obvious that WLP has a clear benefit for LED packaging and it is also the path to success for LED manufacturing. Moreover, it also allows the implementation and integration of additional functionalities to the LED chip module, e.g. electrical connects, Zener-Diode, mirrors, optics drivers etc.
Nonetheless, a clear important aspect to adopt WLP for LED manufacturing is to benefit from existing know-how of the IC manufacturing technology and of the experience of the equipment suppliers for this industry. However, the equipment needs to be optimized for the dedicated LED-WLP application. For example, microlithography with mask aligners is widely used for LED chip manufacturing, but the illumination system of these mask aligner are typically optimized for highest resolution which means contact lithography. For LED-WLP the optical systems must be capable for customized illumination for proximity lithography, where the photo mask and the wafer are separated by a proximity gap of typically 30 to 200 microns. Here, diffraction effects limit the resolution and fidelity of the pattern generated or printed in the photoresist. These diffraction effects are related to the mask pattern and the angular spectrum of the illumination light.
The requirements on the lithography process for LED-WLP will be explained and discussed. Experimental results of perfect 3D patterning on topographies up to several hundred microns will be shown.