Fabrication process and measurement of injection molding aspheric lens

Author(s):  
liu lingcheng ◽  
Xuemin Cheng ◽  
Qun Hao
2005 ◽  
Vol 277-279 ◽  
pp. 912-918
Author(s):  
Doo Sun Choi ◽  
Tae Jin Je ◽  
Young Ho Seo ◽  
Kyung Hyun Whang

In this paper, we present a reusable quartz master fabricated by electron-beam lithography and the results of the preliminary test of injection molding using the reusable quartz master. Since patterned structures of photoresist can be easily damaged by demolding process of nickel stamper and master, a master with photoresist cannot be reused in stamper fabrication process. In this work, we have made it possible of the repeated use of master by directly patterning on quartz in nickel stamper fabrication process. We have developed a 100nm-pit sized reusable quartz master with intaglio carving patterns of finer sizes than those of DVD (400nm) and blue-ray disc (200nm). In the preliminary test of the injection molding, we have found optimum injection molding conditions using polypropylene.


Author(s):  
Ramasubramani Kuduva-Raman-Thanumoorthy ◽  
Donggang Yao

The hot embossing process has so far been mainly developed for replication of surface structures on thermoplastic substrates. Because of the lack of a through-thickness action, fabrication of discrete microparts such as microgears is considered difficult. In this study, an embossing mold having 13 microcavities was used in a through-thickness embossing process with a rubber-assisted ejection mechanism. Microparts made of HDPE and ABS with each part weighing approximately 0.9 and 1.4 mg, respectively, were produced. When in the mold, embossed microparts were intermittently connected to each other through thin residual films of a thickness approximately 20–30 μm on one surface. The residual films were detached from the microparts during ejection. Because no resin delivery path, e.g., runner and gate, is needed for microcavities on the mold, this micropart fabrication process could replace micro injection molding in numerous applications.


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