Lithography technology and trends for More than Moore devices: advanced packaging and MEMS devices

An advanced packaging technology with through-hole interconnections, which enables miniaturization and high-density packaging of electronic devices including MEMS devices and optical devices, has been developed. In this work, through-hole interconnections were applied to an image sensor packaging. Through-holes, 80μm in diameter and 200μm in depth, were formed from backside of the device wafer by Deep Reactive Ion Etching (DRIE). After an insulation layer was formed inside the holes, conductive material such as copper (Cu) or Gold-Tin (Au-Sn) alloy solder was filled into the holes by electroplating method or Molten Metal Suction Method (MMSM). This technology enables wafer-level packaging of the image sensor device. Some electrical characteristics and reliability performances including electric resistance, breakdown voltage, high-temperature storage test, heat cycle test, temperature-humidity test were examined. In this paper, fabrication processes, structural and electrical characteristics and reliability of the package will be reported.

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Processing Through Glass Via (TGV) Interposers for Advanced Packaging

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000264 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000264-000269 ◽

Cited By ~ 1

Author(s):

Charles Woychik ◽

John Lauffer ◽

David Bajkowski ◽

Michael Gaige ◽

Robert Edwards ◽

...

Keyword(s):

Glass Substrate ◽

Building Blocks ◽

Mems Devices ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Fine Line ◽

Advanced Packaging ◽

New Applications ◽

Robust Process ◽

Insulating Properties

Abstract In recent years new applications for RF and MEMS devices require the insulating properties of glass. In order to realize these applications using a glass substrate, it becomes necessary to be able to deposit a metalized layer on both surfaces as well as create vias through the glass substrate. In this paper we will present results of glass interposers that have fine line circuitry on both sides of the substrate and that have through glass vias (TGVs). One major challenge is creating TGVs, using either electrically conductive adhesives (ECAs) or Cu plating methods, to achieve high conductivity and reliable via connections. In addition, it is important to have the capability to produce fine line metallization on the surface of the glass substrate. We employ a semi-additive plating (SAP) method to produce the fine line metallization. The combination of a robust process to create a TGV and the ability to use SAP to do fine line circuitry are the fundamental building blocks to generate advanced carriers for these new future electronic packaging applications.

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Deposition and Characterization of Al2O3 and BiFeO3 Thin Films on Titanium Substrates for Tough MEMS Devices

IEEJ Transactions on Sensors and Micromachines ◽

10.1541/ieejsmas.137.46 ◽

2017 ◽

Vol 137 (1) ◽

pp. 46-47

Author(s):

Takeshi Kohno ◽

Masato Mihara ◽

Ataru Tanabe ◽

Takashi Abe ◽

Masanori Okuyama ◽

...

Keyword(s):

Thin Films ◽

Mems Devices ◽

Titanium Substrates

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MITIGATION OF FLOW AND THERMAL NON-UNIFORMITY IN MEMS DEVICES: NUMERICAL INVESTIGATION

Proceeding of Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019) ◽

10.1615/ihmtc-2019.450 ◽

2019 ◽

Author(s):

Mangal Singh Lodhi ◽

Tanuja Sheorey ◽

Goutam Dutta

Keyword(s):

Numerical Investigation ◽

Mems Devices

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Spin coating modeling and planarization using fill patterns for advanced packaging technologies

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966575 ◽

2017 ◽

Author(s):

Christopher Lang ◽

Duane Boning

Keyword(s):

Spin Coating ◽

Advanced Packaging

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Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2004p0376 ◽

2004 ◽

Author(s):

Andrew J. Komrowski ◽

Luis A. Curiel ◽

Daniel J. D. Sullivan ◽

Quang Nguyen ◽

Lisa Logan-Willams

Keyword(s):

Failure Analysis ◽

Case Studies ◽

New Technologies ◽

Electronic Packages ◽

Advanced Packaging ◽

Ic Package ◽

Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

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