scholarly journals Beam steering by digital micro-mirror device for multi-beam and single-chip lidar

Author(s):  
Joshua M. Rodriguez ◽  
Eunmo Kang ◽  
Brandon Hellman ◽  
Guanghao Chen ◽  
Braden Smith ◽  
...  
Keyword(s):  
2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Lih-Ren Chen ◽  
Kuo-Bin Hong ◽  
Hsiu-Ling Chen ◽  
Kuan-Chih Huang ◽  
Tien-Chang Lu

AbstractWe designed and fabricated a photonic crystal surface emitting laser (PCSEL) with vertically integrated diffractive optical elements on their top to study the mechanism of static beam steering on a single chip. The deflected output beam by the self-formed periodic ITO cladding layer of the PCSEL can be further steered by changing the grating period and azimuthal angle of the diffractive gratings relative to the photonic crystal. Through the analysis of photonic band structure and lasing characteristics, the periodic ITO structure is coupled to the photonic crystal band, whereas the integrated grating serves the diffractive function only. The findings pave the way for the design of PCSELs enabling single or multiple output beam with varying direction capability. This type of laser is regarded as an ideal light source for various applications, such as light detection and ranging and three-dimensional sensing systems.


2017 ◽  
Vol 25 (13) ◽  
pp. 14732 ◽  
Author(s):  
Braden Smith ◽  
Brandon Hellman ◽  
Adley Gin ◽  
Alonzo Espinoza ◽  
Yuzuru Takashima

Author(s):  
Chuan Luo ◽  
Brandon Hellman ◽  
Guanghao Chen ◽  
Joshua Rodriguez ◽  
Charles Perkins ◽  
...  
Keyword(s):  

Author(s):  
Braden Smith ◽  
Brandon Hellman ◽  
Adley Gin ◽  
Alonzo Espinoza ◽  
Yuzuru Takashima

Author(s):  
Joshua Rodriguez ◽  
Braden Smith ◽  
Brandon Hellman ◽  
Adley Gin ◽  
Yuzuru Takashima ◽  
...  

2021 ◽  
Vol 29 (5) ◽  
pp. 7049
Author(s):  
Yaqi Liu ◽  
Zhibiao Hao ◽  
Lai Wang ◽  
Bing Xiong ◽  
Changzheng Sun ◽  
...  

2020 ◽  
Vol 28 (15) ◽  
pp. 21993 ◽  
Author(s):  
Brandon Hellman ◽  
Chuan Luo ◽  
Guanghao Chen ◽  
Joshua Rodriguez ◽  
Charles Perkins ◽  
...  

1991 ◽  
Vol 138 (4) ◽  
pp. 368 ◽  
Author(s):  
R. Benjamin ◽  
W. Titze ◽  
P.V. Brennan ◽  
H.D. Griffiths

2010 ◽  
Vol 130 (4) ◽  
pp. 107-112 ◽  
Author(s):  
Yoshiyuki Watanabe ◽  
Yutaka Abe ◽  
Shinnosuke Iwamatsu ◽  
Seiya Kobayashi ◽  
Yoshiyuki Takahashi ◽  
...  

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 19-27 ◽  
Author(s):  
Wei William Lee ◽  
Paul S. Ho

Continuing improvement of microprocessor performance historically involves a decrease in the device size. This allows greater device speed, an increase in device packing density, and an increase in the number of functions that can reside on a single chip. However higher packing density requires a much larger increase in the number of interconnects. This has led to an increase in the number of wiring levels and a reduction in the wiring pitch (sum of the metal line width and the spacing between the metal lines) to increase the wiring density. The problem with this approach is that—as device dimensions shrink to less than 0.25 μm (transistor gate length)—propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant due to increased wiring capacitance, especially interline capacitance between the metal lines on the same metal level. The smaller line dimensions increase the resistivity (R) of the metal lines, and the narrower interline spacing increases the capacitance (C) between the lines. Thus although the speed of the device will increase as the feature size decreases, the interconnect delay becomes the major fraction of the total delay and limits improvement in device performance.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILD) as well as alternative architectures have been proposed to replace the current Al(Cu) and SiO2 interconnect technology.


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