In-situ shape measurement technology during large aperture optical planar continuous polishing process

2018 ◽  
Author(s):  
Ruiqing Xie ◽  
Defeng Liao ◽  
Jian Chen ◽  
Shijie Zhao ◽  
Xianhua Chen ◽  
...  
Keyword(s):  
Shape Measurement ◽  
Measurement Technology ◽  
Polishing Process ◽  
Large Aperture

An Experimental Study on the Effects of Abrasive Particle Sizes on Polishing Phenomena

2006 ◽  
Vol 505-507 ◽  
pp. 301-306
Author(s):  
Yeau Ren Jeng ◽  
Pay Yau Huang
Keyword(s):  
Experimental Study ◽  
Particle Size ◽  
Theoretical Model ◽  
Test Bench ◽  
Abrasive Particle ◽  
Theoretical Data ◽  
Measurement Technology ◽  
Particle Sizes ◽  
Polishing Process

The effects of abrasive particle size on polishing phenomena during wafer planarization are investigated using a high precision polishing process test bench with in-situ measurement technology. The present experimental results are found to be comported with the experimental and theoretical data published previously. The current experimental outcomes can help to understand the polishing mechanism and develop the relating theoretical model.

Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process

2011 ◽  
Vol 55-57 ◽  
pp. 508-511
Author(s):  
Hung Jung Tsai ◽  
Pay Yau Huang ◽  
Ming Yi Tsai ◽  
Hung Cheng Tsai ◽  
Cin Jhe Lin
Keyword(s):  
High Precision ◽  
Test Bench ◽  
Thermal Characteristics ◽  
Theoretical Data ◽  
Interfacial Phenomena ◽  
Measurement Technology ◽  
Operating Parameters ◽  
Test Rig ◽  
Polishing Process

In the current study, a high precision polishing process test bench with in-situ measurement technology was developed. The test bench also adopted to investigate the effects of operating parameters on polishing interfacial phenomena during the polishing process with IC1000 pad. The experimental results coincide with the experimental and theoretical data published previously results. The developed test rig and the current experimental outcomes contribute to the understanding of soft pad polishing mechanism.

The Experiments Study of Polishing Characteristics during Polishing Process

2012 ◽  
Vol 591-593 ◽  
pp. 460-463
Author(s):  
Hung Jung Tsai ◽  
Hung Cheng Tsai ◽  
Pay Yau Huang ◽  
Jeng Haur Horng ◽  
Shun Jung Chiu
Keyword(s):  
Temperature Rise ◽  
Shear Force ◽  
Mechanical Polishing ◽  
Interfacial Phenomena ◽  
Measurement Technology ◽  
Polishing Process ◽  
Load Transducer ◽  
End Point Detection ◽  
Point Detection

The investigation of experiment becomes more important to increase the understanding of polishing performance. In this paper, a high precision polishing process test bench with in-situ measurement technology was applied to investigate the effects of operating parameters on polishing interfacial phenomena during mechanical polishing with IC1000 pad. The shear force and temperature rise were measured for stainless steel during mechanical polishing process. The surface temperature was measured by T-type thermocouples and the shear force was measured by a load transducer. The shear force for various particle size, applied load and rotation speeds during polishing process was demonstrated. Furthermore, the temperature rise under different slurry concentration was investigated. The experimental results contribute to the understanding of polishing mechanism and also provide an index to end-point-detection.

Long-lasting antifogging mechanism for large-aperture optical surface in low-pressure air plasma in-situ treated

2021 ◽  
pp. 152358
Author(s):  
Yuhai Li ◽  
Qingshun Bai ◽  
Caizhen Yao ◽  
Peng Zhang ◽  
Rongqi Shen ◽  
...  
Keyword(s):  
Low Pressure ◽  
Optical Surface ◽  
Air Plasma ◽  
Large Aperture

scholarly journals High Speed 3D Shape Measurement with Temporal Fourier Transform Profilometry

2019 ◽  
Vol 9 (19) ◽  
pp. 4123 ◽  
Author(s):  
Haihua Zhang ◽  
Qican Zhang ◽  
Yong Li ◽  
Yihang Liu
Keyword(s):  
Fourier Transform ◽  
High Speed ◽  
Shape Measurement ◽  
Measurement Technology ◽  
Reconstruction Process ◽  
Measured Object ◽  
3D Shape ◽  
3D Shape Measurement ◽  
Fourier Transform Profilometry ◽  
Dynamic Objects

A novel high-speed 3D shape measurement technology called temporal Fourier transform profilometry (TFTP for short) is proposed by combining the merits of Fourier transform profilometry (FTP) and phase-measuring profilometry (PMP). Instead of using the digital light projector, a mechanical projector is employed to generate multi-period phase-shifting fringe patterns sequentially. During the reconstruction process, the phase value of each pixel is calculated independently along the temporal axis and no spectrum filtering operation is performed in a spatial domain. Therefore, high-frequency components containing the detailed information of the measured object effectively remain. The proposed method is suitable for measuring isolated dynamic objects. Only one frame of deformed fringe pattern is required to retrieve one 3D shape of the measured object, so it has the obvious advantage if measuring the dynamic scene at a high speed. A low-cost self-made mechanical projector with fast projection speed is developed to execute the principle-proof experiments, whose results demonstrate the feasibility of measuring isolated dynamic objects.

In situ detection and evaluation of surface defects for large-aperture optical elements

2019 ◽  
Vol 40 (6) ◽  
pp. 1167-1173
Author(s):  
WANG Guilin ◽  
ZHU Junhui ◽  
LI Jiaxiang ◽  
LI Zhibin
Keyword(s):  
Surface Defects ◽  
Optical Elements ◽  
Large Aperture ◽  
In Situ Detection
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