Silver nanoparticle electrospray laser deposition for additive manufacturing of microlayers on rigid or flexible substrates

2018 ◽  
Author(s):  
Eduardo Castillo Orozco ◽  
Ranganathan Kumar ◽  
Aravinda Kar
Keyword(s):  
Additive Manufacturing ◽  
Silver Nanoparticle ◽  
Laser Deposition ◽  
Flexible Substrates

In-Coated Carbon Nanotubes for Flexible Interconnects

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000968-000985
Author(s):  
Pingye Xu ◽  
Michael C. Hamilton
Keyword(s):  
Carbon Nanotube ◽  
Sheet Resistance ◽  
Silver Nanoparticle ◽  
Transmission Lines ◽  
Flexible Substrates ◽  
Ink Jet Printing ◽  
Silver Ink ◽  
Ink Jet ◽  
Jet Printing ◽  
Coated Carbon

This work explores a method to construct metal-coated carbon nanotube (CNT) structures, which are potential candidates for interconnects, transmission lines and contact structures. This simple method is suitable to many applications including flexible substrates. In this work, electroplating is used to coat a carbon nanotube surface with Indium. CNT films are prepared using drop casting method on different substrates: Ni coated silicon wafer, copy paper and photo paper. The CNT dispersion used for this work is prepared using sonication and centrifugation with a surfactant. The resulting dispersion has 0.8 wt. % of multi-walled CNTs and 0.5 wt. % of sodium dodecyl sulfate (SDS) in DI water. This dispersion is modified to reduce resistivity by adding either silver nanoparticle powder or silver ink. Electroplating is done at room temperature with a current density of 0.02 A/cm2. This work addresses two issues about electroplating on CNT: low electrical conductivity of CNT film and low CNT adhesion to substrate. A CNT film on a Ni surface displays poor adhesion; the film peels off easily during ultrasonication and electroplating. After thermal annealing or microwave treatment, adhesion between the CNT film and Ni is greatly enhanced such that no CNT film peel-off is observed during electroplating. A CNT film on paper has a high sheet resistance. As a result, Indium is only plated on the CNT film near the attached electrode. To reduce the film sheet resistance, the CNT solution is modified by adding silver nanoparticle powder or silver ink. Ethanol rinsing is also performed on the CNT film surface to wash away surfactant and further reduce sheet resistance. On-going work involves ink-jet printing of CNT solutions onto flexible substrates. Indium, as an example metallization, will be plated on these ink-jet printing defined transmission lines and interconnects patterns. Performance of these structures will be presented.

Deposition of Al-Doped Zinc Oxide by Direct Pulsed Laser Recrystallization at Room Temperature on Various Substrates for Solar Cell Applications

2012 ◽  
Author(s):  
Martin Y. Zhang ◽  
Qiong Nian ◽  
Gary J. Cheng
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Solar Cell ◽  
Melting Point ◽  
Room Temperature ◽  
Pulsed Laser ◽  
Laser Deposition ◽  
Flexible Substrates ◽  
Laser Recrystallization ◽  
Azo Thin Film

In this study, a method combining room temperature pulsed laser deposition (PLD) and direct pulsed laser recrystallization (DPLR) are introduced to deposit superior transparent conductive oxide (TCO) layer on low melting point flexible substrates. As an indispensable component of thin film solar cell, TCO layer with a higher quality will improve the overall performance of solar cells. Alumina-doped zinc oxide (AZO), as one of the most promising TCO candidates, has now been widely used in solar cells. However, to achieve optimal electrical and optical properties of AZO on low melting point flexible substrate is challenging. Recently developed direct pulsed laser recrystallization (DPLR) technique is a scalable, economic and fast process for point defects elimination and recrystallization at room temperature. It features selective processing by only heating up the TCO thin film and preserve the underlying substrate at low temperature. In this study, 250 nm AZO thin film is pre-deposited by pulsed laser deposition (PLD) on flexible and rigid substrates. Then DPLR is introduced to achieve a uniform TCO layer on low melting point flexible substrates, i.e. commercialized Kapton polyimide film and micron-thick Al-foil. Both finite element analysis (FEA) simulation and designed experiments are carried out to demonstrate that DPLR is promising in manufacturing high quality AZO layers without any damage to the underlying flexible substrates. Under appropriate experiment conditions, such as 248 nm in laser wavelength, 25 ns in laser pulse duration, 15 laser pulses at laser fluence of 25 mJ/cm2, desired temperature would result in the AZO thin film and activate the grain growth and recrystallization. Besides laser conditions, the thermal conductivity and crystallinity of the substrate serve as additional factors in the DPLR process. It is found that the substrate’s thermal conductivity correlates positively with the AZO crystal size; the substrate’s crystallinity correlates positively with the AZO film’s crystallinity. The thermal expansion of substrate would also contribute to the film tensile stress after processed by DPLR technique. The overall results indicate that DPLR technique is useful and scalable for flexible solar cell manufacturing.

Effect of silver nanoparticle ink drop spacing on the characteristics of coplanar waveguide monopole antennas printed on flexible substrates

2017 ◽  
Vol 11 (11) ◽  
pp. 1572-1577 ◽  
Author(s):  
S.A. Mohassieb ◽  
Khaled Kirah ◽  
Edgar Dörsam ◽  
Ahmed S.G. Khalil ◽  
Hadia M. El‐Hennawy
Keyword(s):  
Silver Nanoparticle ◽  
Coplanar Waveguide ◽  
Flexible Substrates ◽  
Monopole Antennas ◽  
Nanoparticle Ink

Pulsed laser deposition of transparent conductive oxide thin films on flexible substrates

2012 ◽  
Vol 260 ◽  
pp. 42-46 ◽  
Author(s):  
G. Socol ◽  
M. Socol ◽  
N. Stefan ◽  
E. Axente ◽  
G. Popescu-Pelin ◽  
...  
Keyword(s):  
Thin Films ◽  
Pulsed Laser Deposition ◽  
Pulsed Laser ◽  
Transparent Conductive Oxide ◽  
Laser Deposition ◽  
Flexible Substrates ◽  
Oxide Thin Films ◽  
Conductive Oxide

Laser Deposition-Additive Manufacturing of Graphene Oxide Reinforced IN718 Alloys: Effects on Surface Quality, Microstructure, and Mechanical Properties

2019 ◽  
Author(s):  
Yingbin Hu ◽  
Hui Wang ◽  
Weilong Cong
Keyword(s):  
Wear Resistance ◽  
Graphene Oxide ◽  
Additive Manufacturing ◽  
Surface Quality ◽  
Metal Matrix ◽  
Selective Laser Sintering ◽  
Laser Deposition ◽  
Shaping Process ◽  
Near Net Shaping ◽  
Net Shaping

Abstract Owing to its high stiffness and strength, low density, and excellent flexibility, nano-sized graphene oxide (GO) is considered as a competitive material to reinforce metallic materials. Conventional manufacturing methods for GO reinforced metal matrix fabrication include casting and powder metallurgy, both of which demonstrate disadvantages of high reinforcement agglomeration, high cost, and difficulty in fabrication of complex structures. To reduce these problems, it is important to investigate a finely-controlled, cost-saving, and near-net-shaping process for GO reinforced metal matrix manufacturing. Laser additive manufacturing is such a process that mainly includes selective laser sintering / melting (SLS / M) and laser deposition-additive manufacturing (LD-AM). Compared with SLS / M, LD-AM demonstrates parts remanufacturing capability and is capable of fabricating functionally gradient materials. In this investigation, GO reinforced Inconel 718 (IN718) parts, for the first time, are fabricated using LD-AM processes. The effects of GO on flatness, surface roughness, microstructure, microhardness, and wear resistance of LD-AM fabricated GO reinforced IN718 parts are studied. Experimental results show that the introduction of GO is beneficial for enhancing both microhardness and wear resistance but harmful to surface quality of fabricated parts. In addition, the presence of GO has little influence on microstructures.

Laser deposition-additive manufacturing of ceramics/nanocrystalline intermetallics reinforced microlaminates

2019 ◽  
Vol 117 ◽  
pp. 158-164 ◽  
Author(s):  
Jianing Li ◽  
Molin Su ◽  
Xiaolin Wang ◽  
Qi Liu ◽  
Kegao Liu
Keyword(s):  
Additive Manufacturing ◽  
Laser Deposition

Additive Manufacturing of Fine Lines and Embedded Electronics for use in Chip Carriers and Microelectronic Systems

2012 ◽  
Vol 2012 (1) ◽  
pp. 000946-000948
Author(s):  
Scott Lauer ◽  
Whitten Little ◽  
Pier Benci ◽  
Tim Schmitt ◽  
John Mazurowski
Keyword(s):  
Additive Manufacturing ◽  
Preliminary Test ◽  
Flexible Substrates ◽  
Additive Technology ◽  
Space Resolution ◽  
Microelectronic Devices ◽  
Layer Manufacturing ◽  
Embedded Electronics ◽  
Manufacturing Techniques ◽  
Line Space

Additive manufacturing is the application of layer manufacturing techniques to fabricate microelectronic products. These techniques differentiate themselves from incumbent technologies in that they only add material to build the device and are an alternative to subtractive technologies such as lithography that globally coat layers and then etch-away unrequired materials. In this paper we discuss an additive technology that performs material evaporation through shadow masks. This process has shown significant potential for the fabrication of chip packaging, microelectronic devices and circuitry; specifically, high density interposers, fine conductor lines and embedded components such as capacitors, resistors, and transistors. The process is compatible with a number of both rigid and flexible substrates and deposition materials. Examples of devices and lines that have been manufactured by this technique are shown and discussed. Preliminary test data shows line / space resolution that has reached 15 / 30 microns and better.

Non-oxidized graphene/metal composites by laser deposition additive manufacturing

2021 ◽  
pp. 160724
Author(s):  
Tianqi Wang ◽  
Qingshi Meng ◽  
Sherif Araby ◽  
Guang Yang ◽  
Pengxu Li ◽  
...  
Keyword(s):  
Additive Manufacturing ◽  
Laser Deposition ◽  
Metal Composites
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