Short-pulse laser diode sources enabling handheld photoacoustic devices for deep tissue imaging

Author(s):  
Celine Canal ◽  
Arnaud Laugustin ◽  
Andreas Kohl ◽  
Olivier Rabot
2005 ◽  
Author(s):  
M. Kume ◽  
H. Naito ◽  
J. Ohya ◽  
I. Ohta ◽  
H. Shimizu ◽  
...  

2017 ◽  
Author(s):  
Celine Canal ◽  
Arnaud Laugustin ◽  
Andreas Kohl ◽  
Olivier Rabot

Author(s):  
Andreas Kohl ◽  
Celine Canal ◽  
Arnaud Laugustin ◽  
Olivier Rabot

1991 ◽  
Vol 34 (12) ◽  
pp. 1329-1333 ◽  
Author(s):  
Masahiro Kume ◽  
Hiroki Naito ◽  
Jun Ohya ◽  
Issey Ohta ◽  
Hirokazu Shimizu ◽  
...  

Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov

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