Fixed abrasive flat lapping with 3M-3M Trizactl diamond tile abrasive pads

Author(s):  
T. D. Fletcher
Keyword(s):  
Machines ◽  
2021 ◽  
Vol 9 (4) ◽  
pp. 81
Author(s):  
Yanhua Zou ◽  
Ryunosuke Satou ◽  
Ozora Yamazaki ◽  
Huijun Xie

High quality, highly efficient finishing processes are required for finishing difficult-to-machine materials. Magnetic abrasive finishing (MAF) process is a finishing method that can obtain a high accuracy surface using fine magnetic particles and abrasive particles, but has poor finishing efficiency. On the contrary, fixed abrasive polishing (FAP) is a polishing process can obtain high material removal efficiency but often cannot provide a high-quality surface at the nano-scale. Therefore, this work proposes a new finishing process, which combines the magnetic abrasive finishing process and the fixed abrasive polishing process (MAF-FAP). To verify the proposed methodology, a finishing device was developed and finishing experiments on alumina ceramic plates were performed. Furthermore, the mechanism of the MAF-FAP process was investigated. In addition, the influence of process parameters on finishing characteristics is discussed. According to the experimental results, this process can achieve high-efficiency finishing of brittle hard materials (alumina ceramics) and can obtain nano-scale surfaces. The surface roughness of the alumina ceramic plate is improved from 202.11 nm Ra to 3.67 nm Ra within 30 min.


2017 ◽  
Vol 182 (1) ◽  
pp. 53-64 ◽  
Author(s):  
Jun Li ◽  
Yongkai Tang ◽  
Chengxu Hua ◽  
Taiyu Guo ◽  
Yongwei Zhu ◽  
...  

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.


2021 ◽  
Vol 70 ◽  
pp. 110-116
Author(s):  
Ke Wu ◽  
Daichi Touse ◽  
Libo Zhou ◽  
Wangpiao Lin ◽  
Jun Shimizu ◽  
...  

2010 ◽  
Vol 126-128 ◽  
pp. 82-87
Author(s):  
Mao Li ◽  
Yong Wei Zhu ◽  
Jun Li ◽  
Jian Feng Ye ◽  
Ji Long Fan

The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of the wafer lapped with a uniform pattern pad and that with an optimized pattern was compared. Results show that the PV value of the latter is lower that of the former.


CIRP Annals ◽  
2013 ◽  
Vol 62 (1) ◽  
pp. 311-314 ◽  
Author(s):  
Toshiyuki Enomoto ◽  
Urara Satake ◽  
Tsutomu Fujita ◽  
Tatsuya Sugihara
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document