Development of printed large area organic transistors and integrated circuits (Conference Presentation)

2017 ◽  
Author(s):  
Yong-Young Noh
Keyword(s):  
Integrated Circuits ◽  
Organic Transistors ◽  
Large Area

Diamond Films: Recent Developments

MRS Bulletin ◽  
1998 ◽  
Vol 23 (9) ◽  
pp. 16-21 ◽  
Author(s):  
Dieter M. Gruen ◽  
Ian Buckley-Golder
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Nuclear Power ◽  
Large Scale ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Large Area ◽  
Technical Problems ◽  
Practical Applications ◽  
Single Crystal Diamond

Carbon in the form of diamond is the stuff of dreams, and the image of the diamond evokes deep and powerful emotions in humans. Following the successful synthesis of diamond by high-pressure methods in the 1950s, the startling development of the low-pressure synthesis of diamond films in the 1970s and 1980s almost immediately engendered great expectations of utility. The many remarkable properties of diamond due in part to its being the most atomically dense material in the universe (hardness, thermal conductivity, friction coefficient, transparency, etc.) could at last be put to use in a multitude of practical applications. “The holy grail”—it was realized early on—would be the development of large-area, doped, single-crystal diamond wafers for the fabrication of high-temperature, extremely fast integrated circuits leading to a revolution in computer technology.Excitement in the community of chemical-vapor-deposition (CVD) diamond researchers, funding agencies, and industrial companies ran high in expectation of early realization for many of the commercial goals that had been envisioned: tool, optical, and corrosion-resistant coatings; flat-panel displays; thermomanagement for electronic components, etc. Market projection predicting diamond-film sales in the billions of dollars by the year 2000 was commonplace. Hopes were dashed when these optimistic predictions ran up against the enormous scientific and technical problems that had to be overcome in order for those involved to fully exploit the potential of diamond. This experience is not new to the scientific community. One need only remind oneself of the hopes for cheap nuclear power or for high-temperature superconducting wires available at hardware stores to realize that the lag between scientific discoveries and their large-scale applications can be very long. Diamond films are in fact being used today in commercial applications.

LASRE: A Novel Approach to Large area Accelerated Segmentation for Reverse Engineering on SEM images

2020 ◽  
Author(s):  
Ronald Wilson ◽  
Domenic Forte ◽  
Navid Asadizanjani ◽  
Damon L. Woodard
Keyword(s):  
Integrated Circuits ◽  
Reverse Engineering ◽  
Imaging Modality ◽  
Primary Source ◽  
Time Frame ◽  
Large Area ◽  
Sem Images ◽  
Model Free ◽  
Novel Approach ◽  
Daunting Task

Abstract In the hardware assurance community, Reverse Engineering (RE) is considered a key tool and asset in ensuring the security and reliability of Integrated Circuits (IC). However, with the introduction of advanced node technologies, the application of RE to ICs is turning into a daunting task. This is amplified by the challenges introduced by the imaging modalities such as the Scanning Electron Microscope (SEM) used in acquiring images of ICs. One such challenge is the lack of understanding of the influence of noise in the imaging modality along with its detrimental effect on the quality of images and the overall time frame required for imaging the IC. In this paper, we characterize some aspects of the noise in the image along with its primary source. Furthermore, we use this understanding to propose a novel texture-based segmentation algorithm for SEM images called LASRE. The proposed approach is unsupervised, model-free, robust to the presence of noise and can be applied to all layers of the IC with consistent results. Finally, the results from a comparison study is reported, and the issues associated with the approach are discussed in detail. The approach consistently achieved over 86% accuracy in segmenting various layers in the IC.

Large-area electronics combined with integrated circuits into a strain sensing sheets

2015 ◽  
Vol 105 (22) ◽  
pp. 1-8
Author(s):  
Yao Yao ◽  
Shue-Ting Tung ◽  
Naveen Verma ◽  
Sigurd Wagner ◽  
James Sturm ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Strain Sensing ◽  
Large Area ◽  
Large Area Electronics

Multi-Layer Photopolymer Micromachining

2005 ◽  
Vol 872 ◽  
Author(s):  
J. R. Huang ◽  
B. Bai ◽  
J. Shaw ◽  
T. N. Jackson ◽  
C. Y. Wei ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Aspect Ratio ◽  
Low Cost ◽  
Solution Process ◽  
Microfluidic Channel ◽  
Width Ratio ◽  
Large Area ◽  
Additive Process ◽  
Infiltration Process

AbstractThis paper presents a novel method to create and integrate micro-machined devices and high aspect-ratio (height-to-width ratio) microstructures in which the microstructures are built up using multiple layers of photopolymer film and/or viscous solution. Very high aspect-ratio 2-and 3-dimensional (2-D and 3-D) microstructures were constructed by stacking photo-imageable polymer films. Such films may be dry films applied by lamination or solution layers applied by bar coating, or doctor blade coating. Photolithography is used in both cases to define the microstructure. This additive process of thin-film micromachining facilitates high aspect-ratio microstructure fabrication. We have demonstrated structures of up to 12-layers comprising 2-D arrays of deep trenches (180 μm deep and 25 μm wide) and a 2-layer SU-8 micro-trench array with an aspect ratio up to 36 on glass substrates. Miniaturized structures of interconnected reservoirs as small as 50 μm × 50 μm × 15 μm (∼38 pico liter storage capacity) are also being fabricated, along with a novel 5-layer microfluidic channel array and a vacuum-infiltration process for fluid manipulation. This method has the potential to create functional large-area micro-devices at low-cost and with increased device flexibility, durability, prototyping speed, and reduced process complexity for applications in optoelectronics, integrated detectors, and bio-devices. The novel multi-layer photopolymer dry film and solution process also allows microstructures in micro-electro-mechanical systems (MEMS) to be built with ease and provides the functionality of MEMS integration with electronic devices and integrated circuits (ICs).

Recent progress of organic transistor integrated circuits for large-area sensor applications

2005 ◽  
Author(s):  
T. Someya ◽  
T. Sakurai ◽  
T. Sekitani ◽  
H. Kawaguchi ◽  
S. Iba ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Recent Progress ◽  
Large Area ◽  
Sensor Applications ◽  
Organic Transistor

Large-area flexible electronics with organic transistors

2011 ◽  
Author(s):  
Koichi Ishida ◽  
Tsung-Ching Huang ◽  
Tsuyoshi Sekitani ◽  
Makoto Takamiya ◽  
Takao Someya ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Organic Transistors ◽  
Large Area

A large-area wireless power-transmission sheet using printed organic transistors and plastic MEMS switches

2007 ◽  
Vol 6 (6) ◽  
pp. 413-417 ◽  
Author(s):  
Tsuyoshi Sekitani ◽  
Makoto Takamiya ◽  
Yoshiaki Noguchi ◽  
Shintaro Nakano ◽  
Yusaku Kato ◽  
...  
Keyword(s):  
Power Transmission ◽  
Organic Transistors ◽  
Wireless Power ◽  
Wireless Power Transmission ◽  
Large Area ◽  
Mems Switches
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