Manufacture of organic transistors on large‐area flexible substrate using direct imaging exposure system by wet process suitable for roll‐to‐roll production

2019 ◽  
Vol 27 (11) ◽  
pp. 679-690 ◽  
Author(s):  
Shohei Koizumi ◽  
Masakazu Hori ◽  
Yosuke Hayashida ◽  
Kazuo Naito ◽  
Seiji Kawabata ◽  
...  
Keyword(s):  
Flexible Substrate ◽  
Organic Transistors ◽  
Large Area ◽  
Direct Imaging ◽  
Exposure System ◽  
Wet Process ◽  
Roll To Roll

scholarly journals Direct Imaging Exposure Equipment with High Overlay Accuracy for Flexible Substrate in Roll-to-Roll Method

2017 ◽  
Vol 71 (10) ◽  
pp. J230-J235
Author(s):  
Yoshiaki Kito ◽  
Masakazu Hori ◽  
Yosuke Hayashida ◽  
Tomonari Suzuki ◽  
Hiroki Komiyama ◽  
...  
Keyword(s):  
Flexible Substrate ◽  
Direct Imaging ◽  
Roll To Roll

Visually tolerable tiling (VTT) for making a large-area flexible patterned surface

2015 ◽  
Vol 2 (1) ◽  
pp. 86-90 ◽  
Author(s):  
Moon Kyu Kwak ◽  
Jong G. Ok ◽  
Sung Ho Lee ◽  
L. Jay Guo
Keyword(s):  
Flexible Substrate ◽  
Large Area ◽  
Patterned Surface ◽  
Roll To Roll

Large-area micro/nano-patterns on a flexible substrate were produced using the VTT (visually tolerable tiling) method, realizing invisible seam lines between small master tiles. This could be applied in the roll-to-roll imprinting process, producing large-area polarizers and microprism sheets without visible seam lines.

Direct imaging exposure equipment with high overlay accuracy for flexible substrate in roll-to-roll method

2017 ◽  
Vol 25 (7) ◽  
pp. 411-420
Author(s):  
Yoshiaki Kito ◽  
Masakazu Hori ◽  
Yosuke Hayashida ◽  
Tomonari Suzuki ◽  
Hiroki Komiyama ◽  
...  
Keyword(s):  
Flexible Substrate ◽  
Direct Imaging ◽  
Roll To Roll

scholarly journals Amorphous thin-film oxide power devices operating beyond bulk single-crystal silicon limit

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yuki Tsuruma ◽  
Emi Kawashima ◽  
Yoshikazu Nagasaki ◽  
Takashi Sekiya ◽  
Gaku Imamura ◽  
...  
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Flexible Substrate ◽  
Single Crystal Silicon ◽  
Bulk Single Crystal ◽  
Next Generation ◽  
Power Devices ◽  
Large Area ◽  
Crystal Silicon ◽  
Amorphous Thin Film

AbstractPower devices (PD) are ubiquitous elements of the modern electronics industry that must satisfy the rigorous and diverse demands for robust power conversion systems that are essential for emerging technologies including Internet of Things (IoT), mobile electronics, and wearable devices. However, conventional PDs based on “bulk” and “single-crystal” semiconductors require high temperature (> 1000 °C) fabrication processing and a thick (typically a few tens to 100 μm) drift layer, thereby preventing their applications to compact devices, where PDs must be fabricated on a heat sensitive and flexible substrate. Here we report next-generation PDs based on “thin-films” of “amorphous” oxide semiconductors with the performance exceeding the silicon limit (a theoretical limit for a PD based on bulk single-crystal silicon). The breakthrough was achieved by the creation of an ideal Schottky interface without Fermi-level pinning at the interface, resulting in low specific on-resistance Ron,sp (< 1 × 10–4 Ω cm2) and high breakdown voltage VBD (~ 100 V). To demonstrate the unprecedented capability of the amorphous thin-film oxide power devices (ATOPs), we successfully fabricated a prototype on a flexible polyimide film, which is not compatible with the fabrication process of bulk single-crystal devices. The ATOP will play a central role in the development of next generation advanced technologies where devices require large area fabrication on flexible substrates and three-dimensional integration.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

scholarly journals Uniform Pressing Mechanism in Large-Area Roll-to-Roll Nanoimprint Lithography Process

2021 ◽  
Vol 11 (20) ◽  
pp. 9571
Author(s):  
Ga Eul Kim ◽  
Hyuntae Kim ◽  
Kyoohee Woo ◽  
Yousung Kang ◽  
Seung-Hyun Lee ◽  
...  
Keyword(s):  
Contact Pressure ◽  
Nanoimprint Lithography ◽  
Applied Pressure ◽  
Machine Learning Techniques ◽  
Conventional System ◽  
Large Area ◽  
High Productivity ◽  
Roll To Roll ◽  
Learning Techniques ◽  
Roller Machine

We aimed to increase the processing area of the roll-to-roll (R2R) nanoimprint lithography (NIL) process for high productivity, using a long roller. It is common for a long roller to have bending deformation, geometric errors and misalignment. This causes the non-uniformity of contact pressure between the rollers, which leads to defects such as non-uniform patterning. The non-uniformity of the contact pressure of the conventional R2R NIL system was investigated through finite element (FE) analysis and experiments in the conventional system. To solve the problem, a new large-area R2R NIL uniform pressing system with five multi-backup rollers was proposed and manufactured instead of the conventional system. As a preliminary experiment, the possibility of uniform contact pressure was confirmed by using only the pressure at both ends and one backup roller in the center. A more even contact pressure was achieved by using all five backup rollers and applying an appropriate pushing force to each backup roller. Machine learning techniques were applied to find the optimal combination of the pushing forces. In the conventional pressing process, it was confirmed that pressure deviation of the contact area occurred at a level of 44%; when the improved system was applied, pressure deviation dropped to 5%.

scholarly journals Amorphous thin-film oxide power devices operating beyond bulk single-crystal silicon limit

2021 ◽  
Author(s):  
Yuki Tsuruma ◽  
Emi Kawashima ◽  
Yoshikazu Nagasaki ◽  
Takashi Sekiya ◽  
Gaku Imamura ◽  
...  
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Flexible Substrate ◽  
Single Crystal Silicon ◽  
Bulk Single Crystal ◽  
Next Generation ◽  
Power Devices ◽  
Large Area ◽  
Crystal Silicon ◽  
Amorphous Thin Film

Abstract Power devices (PD) are ubiquitous elements of the modern electronics industry that must satisfy the rigorous and diverse demands for robust power conversion systems that are essential for emerging technologies including Internet of Things (IoT), mobile electronics, and wearable devices. However, conventional PDs based on “bulk” and “single-crystal” semiconductors require high temperature (>1000°C) fabrication processing and a thick (typically a few tens to 100 μm) drift layer1, thereby preventing their applications to compact devices2, where PDs must be fabricated on a heat sensitive and flexible substrate. Here we report next-generation PDs based on “thin-films” of “amorphous” oxide semiconductors with the performance exceeding the silicon limit (a theoretical limit for a PD based on bulk single-crystal silicon3). The breakthrough was achieved by the creation of an ideal Schottky interface without Fermi-level pinning at the interface, resulting in low specific on-resistance Ron,sp (<1×10-4 Ωcm2) and high breakdown voltage VBD (~100 V). To demonstrate the unprecedented capability of the amorphous thin-film oxide power devices (ATOPs), we successfully fabricated a prototype on a flexible polyimide film, which is not compatible with the fabrication process of bulk single-crystal devices. The ATOP will play a central role in the development of next generation advanced technologies where devices require large area fabrication on flexible substrates and three-dimensional integration.

scholarly journals Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors

Polymers ◽  
2019 ◽  
Vol 11 (2) ◽  
pp. 245 ◽  
Author(s):  
Sang Lee ◽  
Sangyoon Lee
Keyword(s):  
Printed Electronics ◽  
Sacrificial Layer ◽  
Flexible Substrate ◽  
Air Gap ◽  
Touch Sensor ◽  
Roll To Roll ◽  
Slot Die ◽  
Gap Sensors ◽  
Structural Layer

Although printed electronics technology has been recently employed in the production of various devices, its use for the fabrication of electronic devices with air-gap structures remains challenging. This paper presents a productive roll-to-roll printed electronics method for the fabrication of capacitive touch sensors with air-gap structures. Each layer of the sensor was fabricated by printing or coating. The bottom electrode, and the dielectric and sacrificial layers were roll-to-roll slot-die coated on a flexible substrate. The top electrode was formed by roll-to-roll gravure printing, while the structural layer was formed by spin-coating. In particular, the sacrificial layer was coated with polyvinyl alcohol (PVA) and removed in water to form an air-gap. The successful formation of the air-gap was verified by field emission scanning electron microscopy (FE-SEM). Electrical characteristics of the air-gap touch sensor samples were analyzed in terms of sensitivity, hysteresis, and repeatability. Experimental results showed that the proposed method can be suitable for the fabrication of air-gap sensors by using the roll-to-roll printed electronics technology.

OLED Manufacturing on Flexible Substrates Towards Roll-to-Roll

MRS Advances ◽  
2019 ◽  
Vol 4 (24) ◽  
pp. 1367-1375 ◽  
Author(s):  
Dongxiang Wang ◽  
Jacqueline Hauptmann ◽  
Christian May
Keyword(s):  
High Throughput ◽  
Present Status ◽  
Manufacturing Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Thin Glass ◽  
Production Capability ◽  
Roll To Roll ◽  
Pet Film

ABSTRACTLarge area lighting OLEDs manufactured in a Roll-to-Roll (R2R) fashion enable the well-longed production capability with considerably high throughput based on flexible substrates, hence largely reduced OLED manufacturing cost. This paper will outline the present status of R2R OLED fabrication on ultra-thin glass with the focus on transparent OLED devices and how to perform segmentation by printing of silver- and dielectric pastes. Ultra-thin glass (UTG) is laminated on a PET film to avoid fabrication interruptions when glass cracks occur during the Roll-to-Roll process. The R2R fabricated flexible OLEDs also show key-values comparable to conventional OLEDs fabricated on small rigid glass in lab-scale.

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