Solid immersion optical lithography: tuning the prism/sample interface for improved ultra high-NA, high aspect ratio resist patterns over large exposure fields

2015 ◽  
Author(s):  
Sam Lowrey ◽  
Richard J. Blaikie
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Optical Lithography

scholarly journals Near-field Optical Lithography for High-aspect-ratio Patterning by Using Electric Field Enhanced Postexposure Baking

2010 ◽  
Vol 21 (6) ◽  
pp. 241-246
Author(s):  
Seok Kim ◽  
Jin-Hee Jang ◽  
Yong-Woo Kim ◽  
Ho-Won Jung ◽  
Jae-Won Hahn
Keyword(s):  
Aspect Ratio ◽  
Electric Field ◽  
High Aspect Ratio ◽  
Near Field ◽  
Optical Lithography

Fabrication of Hollow High Aspect Ratio Metal Microstructure Arrays

1992 ◽  
Vol 260 ◽  
Author(s):  
J. M. Calvert ◽  
J. H. Georger ◽  
M. L Rebbert ◽  
M. A. Anderson ◽  
D. Park ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Analytical Techniques ◽  
Optical Lithography ◽  
Aspect Ratios ◽  
Substrate Dissolution ◽  
Metal Microstructure ◽  
Regular Arrays ◽  
Hollow Metal

ABSTRACTA process has been developed to produce regular arrays of hollow metal microstructures on substrates of choice. Optical lithography was used to define high aspect ratio structures in photoresist. The resist structures were selectively metallized by electroless (EL) deposition such that metal was deposited only on the sidewalls of the resist and on the surface of the substrate. Dissolution of the polymeric photoresist resulted in regular arrays of hollow metal cylinders and cones with geometries and structure spacings determined by the original resist structures. Characterization of metallized microstructures using surface analytical techniques and SEM is presented. Arrays of microstructures with 500–1000 Å thick EL Ni walls and aspect ratios (height/tip diameter) of 8:1 are shown.

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