Magnetorheological finishing with chemically modified fluids for studying material removal of single-crystal ZnS

2013 ◽  
Author(s):  
S. Salzman ◽  
H. J. Romanofsky ◽  
Y. I. Clara ◽  
L. J. Giannechini ◽  
G. West ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Magnetorheological Finishing ◽  
Chemically Modified

scholarly journals A Nanomechanical Analysis of Deformation Characteristics of 6H-SiC Using an Indenter and Abrasives in Different Fixed Methods

Micromachines ◽  
2019 ◽  
Vol 10 (5) ◽  
pp. 332 ◽  
Author(s):  
Jisheng Pan ◽  
Qiusheng Yan ◽  
Weihua Li ◽  
Xiaowei Zhang
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Elastic Moduli ◽  
Deformation Characteristics ◽  
Static Stiffness ◽  
Magnetorheological Finishing ◽  
Material Removal Mechanisms ◽  
Single Crystal Sic ◽  
Three Body ◽  
Precise Theory

The super-precise theory for machining single crystal SiC substrates with abrasives needs to be improved for its chemical stability, extremely hard and brittle. A Berkovich indenter was used to carry out a systematic static stiffness indentation experiments on single crystal 6H-SiC substrates, and then these substrates were machined by utilizing fixed, free, and semi-fixed abrasives, and the nanomechanical characteristics and material removal mechanisms using abrasives in different fixed methods were analyzed theoretically. The results indicated that the hardness of C faces and Si faces of single crystal 6H-SiC under 500 mN load were 38.596 Gpa and 36.246 Gpa respectively, and their elastic moduli were 563.019 Gpa and 524.839 Gpa, respectively. Moreover, the theoretical critical loads for the plastic transition and brittle fracture of C face of single crystal 6H-SiC were 1.941 mN and 366.8 mN, while those of Si face were 1.77 mN and 488.67 mN, respectively. The 6H-SiC materials were removed by pure brittle rolling under three-body friction with free abrasives, and the process parameters determined the material removal modes of 6H-SiC substrates by grinding with fixed abrasives, nevertheless, the materials were removed under full elastic-plastic deformation in cluster magnetorheological finishing with semi-fixed abrasives.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

A Mechanistic Model of Material Removal in Magnetorheological Finishing (MRF)

2007 ◽  
Vol 359-360 ◽  
pp. 384-388
Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Reynolds Equation ◽  
Removal Rate ◽  
Mechanistic Model ◽  
Magnetorheological Fluid ◽  
Magnetorheological Finishing ◽  
Material Removal Model ◽  
Removal Model ◽  
The Magnetic Field

According to the sharp rheological characteristics of magnetorheological fluid in the magnetic field, the principle and mechanism of magnetorheological finishing is analyzed. Based on the Preston equation, the Reynolds equation and its boundary conditions, the two-dimensional material removal model is built and simulated. Furthermore, a series of MRF experiments are carried out, and the influence of the immersed depth and material kinds on material removal rate are clarified respectively. The experimental results are compared with the modeling results of material removal rate to confirm the mechanistic model validity.

Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

2010 ◽  
Vol 431-432 ◽  
pp. 265-268 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
R Value ◽  
Material Removal Mode

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.

A Mechanistic Model of Material Removal in Magnetorheological Finishing (MRF)

2007 ◽  
pp. 384-388
Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  
Keyword(s):  
Material Removal ◽  
Mechanistic Model ◽  
Magnetorheological Finishing
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