Novel photoresist thin films with in-situ photoacid generator by molecular layer deposition

Author(s):  
Han Zhou ◽  
Stacey F. Bent
2020 ◽  
Vol 49 (32) ◽  
pp. 11310-11316
Author(s):  
Aida Khayyami ◽  
Anish Philip ◽  
Jenna Multia ◽  
Maarit Karppinen

We demonstrate the fabrication of in-situ crystalline thin films of various azobenzene (AZO) based photoresponsive metal–organic structures using the atomic/molecular layer deposition (ALD/MLD) technique.


2022 ◽  
Author(s):  
Rachel A. Nye ◽  
Siyao Wang ◽  
Stefan Uhlenbrock ◽  
John A. Smythe III ◽  
Gregory N. Parsons

Organic thin films formed by molecular layer deposition (MLD) are important for next-generation electronics, energy storage, photoresists, protective barriers and other applications. This study uses in situ ellipsometry and quartz...


2021 ◽  
pp. 2101725
Author(s):  
Reut Yemini ◽  
Shalev Blanga ◽  
Hagit Aviv ◽  
Ilana Perelshtein ◽  
Eti Teblum ◽  
...  

2020 ◽  
Vol 8 (5) ◽  
pp. 2539-2548 ◽  
Author(s):  
Kristian Blindheim Lausund ◽  
Malin Solheim Olsen ◽  
Per-Anders Hansen ◽  
Håkon Valen ◽  
Ola Nilsen

Thin films of metal–organic frameworks (MOFs) are promising for a wide range of applications including membranes for separations and sensor materials in microelectronics.


2010 ◽  
Vol 1249 ◽  
Author(s):  
Stacey Bent ◽  
Paul William Loscutoff ◽  
Scott Clendenning

AbstractDevice scaling predicts that copper barrier layers of under 3 nm in thickness will soon be needed in back-end processing for integrated circuits, motivating the development of new barrier layer materials. In this work, nanoscale organic thin films for use as possible copper diffusion barrier layers are deposited by molecular layer deposition (MLD) utilizing a series of self-limiting reactions of organic molecules. MLD can be used to tailor film properties to optimize desirable barrier properties, including density, copper surface adhesion, thermal stability, and low copper diffusion. Three systems are examined as copper diffusion barriers, a polyurea film deposited by the reaction of 1,4-phenylene diisocyanate (PDIC) and ethylenediamine (ED), a polyurea film with a sulfide-modified backbone, and a polythiourea films using a modified coupling chemistry. Following deposition of the MLD films, copper is sputter deposited. The copper diffusion barrier properties of the film are tested through adhesion and annealing tests, including 4-point bend testing and TEM imaging to examine the level of copper penetration. The promise and challenges of MLD-formed organic copper diffusion barriers will be discussed.


2021 ◽  
Vol 9 ◽  
Author(s):  
Jian Liu ◽  
Jiajun Wang

The design of multifunctional thin films holds the key to manipulate the surface and interface structure of the electrode and electrolyte in rechargeable batteries and achieve desirable performance for various applications. Molecular layer deposition (MLD) is an emerging thin-film technique with exclusive advantages of depositing hybrid organic-inorganic materials at a nanoscale level and with well tunable and unique properties that conventional thin films might not have. Herein, we provide a timely mini-review on the most recent progress in the surface chemistry and MLD process of novel hybrid organic-inorganic thin films and their applications as the anode, cathode, and solid electrolytes in lithium-ion batteries. Perspectives for future research in designing new MLD process and precursors, enriching MLD material library, and expanding their potential applications in other energy storage systems, are discussed at the end.


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